Global Embedded Die Packaging Technology Market 2025 by Company, Regions, Type and Application, Forecast to 2031

Publication ID:

GIR022501520

Publication Date:

February 10, 2025

Pages:

115

Publisher:

GIR

Countries:

Global [1]

USD 3,480.00

Software [2]

IT Services [3]

Computing & Electronics [4]

Description:

The global Embedded Die Packaging Technology market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report is a detailed and comprehensive analysis for global Embedded Die Packaging Technology market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Embedded Die Packaging Technology market size and forecasts, in consumption value ($ Million), 2020-2031
Global Embedded Die Packaging Technology market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Embedded Die Packaging Technology market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Embedded Die Packaging Technology market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Embedded Die Packaging Technology
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Embedded Die Packaging Technology market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include AT & S, General Electric, Amkor Technology, Taiwan Semiconductor Manufacturing Company, TDK-Epcos, Schweizer, Fujikura, Microchip Technology, Infineon, Toshiba Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Embedded Die Packaging Technology market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Embedded Die in Rigid Board
Embedded Die in Flexible Board
Market segment by Application
Consumer Electronics
IT & Telecommunications
Automotive
Healthcare
Others
Market segment by players, this report covers
AT & S
General Electric
Amkor Technology
Taiwan Semiconductor Manufacturing Company
TDK-Epcos
Schweizer
Fujikura
Microchip Technology
Infineon
Toshiba Corporation
Fujitsu Limited
STMICROELECTRONICS
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Embedded Die Packaging Technology product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Embedded Die Packaging Technology, with revenue, gross margin, and global market share of Embedded Die Packaging Technology from 2020 to 2025.
Chapter 3, the Embedded Die Packaging Technology competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Embedded Die Packaging Technology market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Embedded Die Packaging Technology.
Chapter 13, to describe Embedded Die Packaging Technology research findings and conclusion.

Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.

Table Of Contents:

1 Market Overview
1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Classification of Embedded Die Packaging Technology by Type
1.3.1 Overview: Global Embedded Die Packaging Technology Market Size by Type: 2020 Versus 2024 Versus 2031
1.3.2 Global Embedded Die Packaging Technology Consumption Value Market Share by Type in 2024
1.3.3 Embedded Die in Rigid Board
1.3.4 Embedded Die in Flexible Board
1.4 Global Embedded Die Packaging Technology Market by Application
1.4.1 Overview: Global Embedded Die Packaging Technology Market Size by Application: 2020 Versus 2024 Versus 2031
1.4.2 Consumer Electronics
1.4.3 IT & Telecommunications
1.4.4 Automotive
1.4.5 Healthcare
1.4.6 Others
1.5 Global Embedded Die Packaging Technology Market Size & Forecast
1.6 Global Embedded Die Packaging Technology Market Size and Forecast by Region
1.6.1 Global Embedded Die Packaging Technology Market Size by Region: 2020 VS 2024 VS 2031
1.6.2 Global Embedded Die Packaging Technology Market Size by Region, (2020-2031)
1.6.3 North America Embedded Die Packaging Technology Market Size and Prospect (2020-2031)
1.6.4 Europe Embedded Die Packaging Technology Market Size and Prospect (2020-2031)
1.6.5 Asia-Pacific Embedded Die Packaging Technology Market Size and Prospect (2020-2031)
1.6.6 South America Embedded Die Packaging Technology Market Size and Prospect (2020-2031)
1.6.7 Middle East & Africa Embedded Die Packaging Technology Market Size and Prospect (2020-2031)
2 Company Profiles
2.1 AT & S
2.1.1 AT & S Details
2.1.2 AT & S Major Business
2.1.3 AT & S Embedded Die Packaging Technology Product and Solutions
2.1.4 AT & S Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.1.5 AT & S Recent Developments and Future Plans
2.2 General Electric
2.2.1 General Electric Details
2.2.2 General Electric Major Business
2.2.3 General Electric Embedded Die Packaging Technology Product and Solutions
2.2.4 General Electric Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.2.5 General Electric Recent Developments and Future Plans
2.3 Amkor Technology
2.3.1 Amkor Technology Details
2.3.2 Amkor Technology Major Business
2.3.3 Amkor Technology Embedded Die Packaging Technology Product and Solutions
2.3.4 Amkor Technology Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.3.5 Amkor Technology Recent Developments and Future Plans
2.4 Taiwan Semiconductor Manufacturing Company
2.4.1 Taiwan Semiconductor Manufacturing Company Details
2.4.2 Taiwan Semiconductor Manufacturing Company Major Business
2.4.3 Taiwan Semiconductor Manufacturing Company Embedded Die Packaging Technology Product and Solutions
2.4.4 Taiwan Semiconductor Manufacturing Company Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.4.5 Taiwan Semiconductor Manufacturing Company Recent Developments and Future Plans
2.5 TDK-Epcos
2.5.1 TDK-Epcos Details
2.5.2 TDK-Epcos Major Business
2.5.3 TDK-Epcos Embedded Die Packaging Technology Product and Solutions
2.5.4 TDK-Epcos Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.5.5 TDK-Epcos Recent Developments and Future Plans
2.6 Schweizer
2.6.1 Schweizer Details
2.6.2 Schweizer Major Business
2.6.3 Schweizer Embedded Die Packaging Technology Product and Solutions
2.6.4 Schweizer Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.6.5 Schweizer Recent Developments and Future Plans
2.7 Fujikura
2.7.1 Fujikura Details
2.7.2 Fujikura Major Business
2.7.3 Fujikura Embedded Die Packaging Technology Product and Solutions
2.7.4 Fujikura Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.7.5 Fujikura Recent Developments and Future Plans
2.8 Microchip Technology
2.8.1 Microchip Technology Details
2.8.2 Microchip Technology Major Business
2.8.3 Microchip Technology Embedded Die Packaging Technology Product and Solutions
2.8.4 Microchip Technology Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.8.5 Microchip Technology Recent Developments and Future Plans
2.9 Infineon
2.9.1 Infineon Details
2.9.2 Infineon Major Business
2.9.3 Infineon Embedded Die Packaging Technology Product and Solutions
2.9.4 Infineon Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.9.5 Infineon Recent Developments and Future Plans
2.10 Toshiba Corporation
2.10.1 Toshiba Corporation Details
2.10.2 Toshiba Corporation Major Business
2.10.3 Toshiba Corporation Embedded Die Packaging Technology Product and Solutions
2.10.4 Toshiba Corporation Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.10.5 Toshiba Corporation Recent Developments and Future Plans
2.11 Fujitsu Limited
2.11.1 Fujitsu Limited Details
2.11.2 Fujitsu Limited Major Business
2.11.3 Fujitsu Limited Embedded Die Packaging Technology Product and Solutions
2.11.4 Fujitsu Limited Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.11.5 Fujitsu Limited Recent Developments and Future Plans
2.12 STMICROELECTRONICS
2.12.1 STMICROELECTRONICS Details
2.12.2 STMICROELECTRONICS Major Business
2.12.3 STMICROELECTRONICS Embedded Die Packaging Technology Product and Solutions
2.12.4 STMICROELECTRONICS Embedded Die Packaging Technology Revenue, Gross Margin and Market Share (2020-2025)
2.12.5 STMICROELECTRONICS Recent Developments and Future Plans
3 Market Competition, by Players
3.1 Global Embedded Die Packaging Technology Revenue and Share by Players (2020-2025)
3.2 Market Share Analysis (2024)
3.2.1 Market Share of Embedded Die Packaging Technology by Company Revenue
3.2.2 Top 3 Embedded Die Packaging Technology Players Market Share in 2024
3.2.3 Top 6 Embedded Die Packaging Technology Players Market Share in 2024
3.3 Embedded Die Packaging Technology Market: Overall Company Footprint Analysis
3.3.1 Embedded Die Packaging Technology Market: Region Footprint
3.3.2 Embedded Die Packaging Technology Market: Company Product Type Footprint
3.3.3 Embedded Die Packaging Technology Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
4.1 Global Embedded Die Packaging Technology Consumption Value and Market Share by Type (2020-2025)
4.2 Global Embedded Die Packaging Technology Market Forecast by Type (2026-2031)
5 Market Size Segment by Application
5.1 Global Embedded Die Packaging Technology Consumption Value Market Share by Application (2020-2025)
5.2 Global Embedded Die Packaging Technology Market Forecast by Application (2026-2031)
6 North America
6.1 North America Embedded Die Packaging Technology Consumption Value by Type (2020-2031)
6.2 North America Embedded Die Packaging Technology Market Size by Application (2020-2031)
6.3 North America Embedded Die Packaging Technology Market Size by Country
6.3.1 North America Embedded Die Packaging Technology Consumption Value by Country (2020-2031)
6.3.2 United States Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
6.3.3 Canada Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
6.3.4 Mexico Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
7 Europe
7.1 Europe Embedded Die Packaging Technology Consumption Value by Type (2020-2031)
7.2 Europe Embedded Die Packaging Technology Consumption Value by Application (2020-2031)
7.3 Europe Embedded Die Packaging Technology Market Size by Country
7.3.1 Europe Embedded Die Packaging Technology Consumption Value by Country (2020-2031)
7.3.2 Germany Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
7.3.3 France Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
7.3.4 United Kingdom Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
7.3.5 Russia Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
7.3.6 Italy Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
8 Asia-Pacific
8.1 Asia-Pacific Embedded Die Packaging Technology Consumption Value by Type (2020-2031)
8.2 Asia-Pacific Embedded Die Packaging Technology Consumption Value by Application (2020-2031)
8.3 Asia-Pacific Embedded Die Packaging Technology Market Size by Region
8.3.1 Asia-Pacific Embedded Die Packaging Technology Consumption Value by Region (2020-2031)
8.3.2 China Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
8.3.3 Japan Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
8.3.4 South Korea Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
8.3.5 India Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
8.3.6 Southeast Asia Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
8.3.7 Australia Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
9 South America
9.1 South America Embedded Die Packaging Technology Consumption Value by Type (2020-2031)
9.2 South America Embedded Die Packaging Technology Consumption Value by Application (2020-2031)
9.3 South America Embedded Die Packaging Technology Market Size by Country
9.3.1 South America Embedded Die Packaging Technology Consumption Value by Country (2020-2031)
9.3.2 Brazil Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
9.3.3 Argentina Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
10 Middle East & Africa
10.1 Middle East & Africa Embedded Die Packaging Technology Consumption Value by Type (2020-2031)
10.2 Middle East & Africa Embedded Die Packaging Technology Consumption Value by Application (2020-2031)
10.3 Middle East & Africa Embedded Die Packaging Technology Market Size by Country
10.3.1 Middle East & Africa Embedded Die Packaging Technology Consumption Value by Country (2020-2031)
10.3.2 Turkey Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
10.3.3 Saudi Arabia Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
10.3.4 UAE Embedded Die Packaging Technology Market Size and Forecast (2020-2031)
11 Market Dynamics
11.1 Embedded Die Packaging Technology Market Drivers
11.2 Embedded Die Packaging Technology Market Restraints
11.3 Embedded Die Packaging Technology Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 Embedded Die Packaging Technology Industry Chain
12.2 Embedded Die Packaging Technology Upstream Analysis
12.3 Embedded Die Packaging Technology Midstream Analysis
12.4 Embedded Die Packaging Technology Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer

Companies Mentioned:

AT & S
General Electric
Amkor Technology
Taiwan Semiconductor Manufacturing Company
TDK-Epcos
Schweizer
Fujikura
Microchip Technology
Infineon
Toshiba Corporation
Fujitsu Limited
STMICROELECTRONICS

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