Global Epoxy Plastic Compound for Electronic Packaging Supply, Demand and Key Producers, 2024-2030

Publication ID:

GIR032415078

Publication Date:

March 28, 2024

Pages:

108

Publisher:

GIR

Countries:

Global [1]

USD 4,480.00

Specialty Chemicals [2]

Manufacturing (Chemicals) [3]

Chemicals [4]

Description:

The global Epoxy Plastic Compound for Electronic Packaging market size is expected to reach $ 3676.5 million by 2030, rising at a market growth of 5.6% CAGR during the forecast period (2024-2030).
Epoxy plastic compound for electronic packaging is an important electronic material used to encapsulate and protect various electronic components and devices to improve their stability, durability and performance. These materials are typically a type of epoxy resin that offers excellent mechanical properties, chemical resistance, heat resistance, and electrical properties. With the continuous development of electronic products and the expansion of application fields, the performance requirements for electronic packaging materials are getting higher and higher. The future development trend is to continuously improve the performance of epoxy plastic sealants, such as improving its heat resistance, mechanical strength, chemical stability, etc., to meet the needs of various special applications. The future development trend of epoxy plastic sealants for electronic packaging will pay more attention to high performance, miniaturization, green environmental protection and intelligence to meet the changing packaging needs of electronic products and promote the sustainable development of the electronics industry.
This report studies the global Epoxy Plastic Compound for Electronic Packaging production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Epoxy Plastic Compound for Electronic Packaging, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Epoxy Plastic Compound for Electronic Packaging that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Epoxy Plastic Compound for Electronic Packaging total production and demand, 2019-2030, (Tons)
Global Epoxy Plastic Compound for Electronic Packaging total production value, 2019-2030, (USD Million)
Global Epoxy Plastic Compound for Electronic Packaging production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Tons)
Global Epoxy Plastic Compound for Electronic Packaging consumption by region & country, CAGR, 2019-2030 & (Tons)
U.S. VS China: Epoxy Plastic Compound for Electronic Packaging domestic production, consumption, key domestic manufacturers and share
Global Epoxy Plastic Compound for Electronic Packaging production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Tons)
Global Epoxy Plastic Compound for Electronic Packaging production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Tons)
Global Epoxy Plastic Compound for Electronic Packaging production by Application production, value, CAGR, 2019-2030, (USD Million) & (Tons).
This reports profiles key players in the global Epoxy Plastic Compound for Electronic Packaging market based on the following parameters 鈥� company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Dow, Henkel, Sumitomo Chemical, Momentive Performance Materials, Shin-Etsu Chemical and Huntsman, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Epoxy Plastic Compound for Electronic Packaging market.
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/Ton) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.
Global Epoxy Plastic Compound for Electronic Packaging Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Epoxy Plastic Compound for Electronic Packaging Market, Segmentation by Type
Epoxy Resin Encapsulation Material
Epoxy Glue Encapsulation Material
Others
Global Epoxy Plastic Compound for Electronic Packaging Market, Segmentation by Application
Semiconductor
Vehicle Electronics
Aerospace Electronics
Optoelectronic Devices
Others
Companies Profiled:
Dow
Henkel
Sumitomo Chemical
Momentive Performance Materials
Shin-Etsu Chemical
Huntsman
Key Questions Answered
1. How big is the global Epoxy Plastic Compound for Electronic Packaging market?
2. What is the demand of the global Epoxy Plastic Compound for Electronic Packaging market?
3. What is the year over year growth of the global Epoxy Plastic Compound for Electronic Packaging market?
4. What is the production and production value of the global Epoxy Plastic Compound for Electronic Packaging market?
5. Who are the key producers in the global Epoxy Plastic Compound for Electronic Packaging market?

Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.

Table Of Contents:

1 Supply Summary
1.1 Epoxy Plastic Compound for Electronic Packaging Introduction
1.2 World Epoxy Plastic Compound for Electronic Packaging Supply & Forecast
1.2.1 World Epoxy Plastic Compound for Electronic Packaging Production Value (2019 & 2023 & 2030)
1.2.2 World Epoxy Plastic Compound for Electronic Packaging Production (2019-2030)
1.2.3 World Epoxy Plastic Compound for Electronic Packaging Pricing Trends (2019-2030)
1.3 World Epoxy Plastic Compound for Electronic Packaging Production by Region (Based on Production Site)
1.3.1 World Epoxy Plastic Compound for Electronic Packaging Production Value by Region (2019-2030)
1.3.2 World Epoxy Plastic Compound for Electronic Packaging Production by Region (2019-2030)
1.3.3 World Epoxy Plastic Compound for Electronic Packaging Average Price by Region (2019-2030)
1.3.4 North America Epoxy Plastic Compound for Electronic Packaging Production (2019-2030)
1.3.5 Europe Epoxy Plastic Compound for Electronic Packaging Production (2019-2030)
1.3.6 China Epoxy Plastic Compound for Electronic Packaging Production (2019-2030)
1.3.7 Japan Epoxy Plastic Compound for Electronic Packaging Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 Epoxy Plastic Compound for Electronic Packaging Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Epoxy Plastic Compound for Electronic Packaging Major Market Trends
2 Demand Summary
2.1 World Epoxy Plastic Compound for Electronic Packaging Demand (2019-2030)
2.2 World Epoxy Plastic Compound for Electronic Packaging Consumption by Region
2.2.1 World Epoxy Plastic Compound for Electronic Packaging Consumption by Region (2019-2024)
2.2.2 World Epoxy Plastic Compound for Electronic Packaging Consumption Forecast by Region (2025-2030)
2.3 United States Epoxy Plastic Compound for Electronic Packaging Consumption (2019-2030)
2.4 China Epoxy Plastic Compound for Electronic Packaging Consumption (2019-2030)
2.5 Europe Epoxy Plastic Compound for Electronic Packaging Consumption (2019-2030)
2.6 Japan Epoxy Plastic Compound for Electronic Packaging Consumption (2019-2030)
2.7 South Korea Epoxy Plastic Compound for Electronic Packaging Consumption (2019-2030)
2.8 ASEAN Epoxy Plastic Compound for Electronic Packaging Consumption (2019-2030)
2.9 India Epoxy Plastic Compound for Electronic Packaging Consumption (2019-2030)
3 World Epoxy Plastic Compound for Electronic Packaging Manufacturers Competitive Analysis
3.1 World Epoxy Plastic Compound for Electronic Packaging Production Value by Manufacturer (2019-2024)
3.2 World Epoxy Plastic Compound for Electronic Packaging Production by Manufacturer (2019-2024)
3.3 World Epoxy Plastic Compound for Electronic Packaging Average Price by Manufacturer (2019-2024)
3.4 Epoxy Plastic Compound for Electronic Packaging Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Epoxy Plastic Compound for Electronic Packaging Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Epoxy Plastic Compound for Electronic Packaging in 2023
3.5.3 Global Concentration Ratios (CR8) for Epoxy Plastic Compound for Electronic Packaging in 2023
3.6 Epoxy Plastic Compound for Electronic Packaging Market: Overall Company Footprint Analysis
3.6.1 Epoxy Plastic Compound for Electronic Packaging Market: Region Footprint
3.6.2 Epoxy Plastic Compound for Electronic Packaging Market: Company Product Type Footprint
3.6.3 Epoxy Plastic Compound for Electronic Packaging Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations
4 United States VS China VS Rest of the World
4.1 United States VS China: Epoxy Plastic Compound for Electronic Packaging Production Value Comparison
4.1.1 United States VS China: Epoxy Plastic Compound for Electronic Packaging Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: Epoxy Plastic Compound for Electronic Packaging Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: Epoxy Plastic Compound for Electronic Packaging Production Comparison
4.2.1 United States VS China: Epoxy Plastic Compound for Electronic Packaging Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: Epoxy Plastic Compound for Electronic Packaging Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: Epoxy Plastic Compound for Electronic Packaging Consumption Comparison
4.3.1 United States VS China: Epoxy Plastic Compound for Electronic Packaging Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: Epoxy Plastic Compound for Electronic Packaging Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based Epoxy Plastic Compound for Electronic Packaging Manufacturers and Market Share, 2019-2024
4.4.1 United States Based Epoxy Plastic Compound for Electronic Packaging Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Epoxy Plastic Compound for Electronic Packaging Production Value (2019-2024)
4.4.3 United States Based Manufacturers Epoxy Plastic Compound for Electronic Packaging Production (2019-2024)
4.5 China Based Epoxy Plastic Compound for Electronic Packaging Manufacturers and Market Share
4.5.1 China Based Epoxy Plastic Compound for Electronic Packaging Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Epoxy Plastic Compound for Electronic Packaging Production Value (2019-2024)
4.5.3 China Based Manufacturers Epoxy Plastic Compound for Electronic Packaging Production (2019-2024)
4.6 Rest of World Based Epoxy Plastic Compound for Electronic Packaging Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based Epoxy Plastic Compound for Electronic Packaging Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Epoxy Plastic Compound for Electronic Packaging Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers Epoxy Plastic Compound for Electronic Packaging Production (2019-2024)
5 Market Analysis by Type
5.1 World Epoxy Plastic Compound for Electronic Packaging Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 Epoxy Resin Encapsulation Material
5.2.2 Epoxy Glue Encapsulation Material
5.2.3 Others
5.3 Market Segment by Type
5.3.1 World Epoxy Plastic Compound for Electronic Packaging Production by Type (2019-2030)
5.3.2 World Epoxy Plastic Compound for Electronic Packaging Production Value by Type (2019-2030)
5.3.3 World Epoxy Plastic Compound for Electronic Packaging Average Price by Type (2019-2030)
6 Market Analysis by Application
6.1 World Epoxy Plastic Compound for Electronic Packaging Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 Semiconductor
6.2.2 Vehicle Electronics
6.2.3 Aerospace Electronics
6.2.4 Optoelectronic Devices
6.2.5 Others
6.3 Market Segment by Application
6.3.1 World Epoxy Plastic Compound for Electronic Packaging Production by Application (2019-2030)
6.3.2 World Epoxy Plastic Compound for Electronic Packaging Production Value by Application (2019-2030)
6.3.3 World Epoxy Plastic Compound for Electronic Packaging Average Price by Application (2019-2030)
7 Company Profiles
7.1 Dow
7.1.1 Dow Details
7.1.2 Dow Major Business
7.1.3 Dow Epoxy Plastic Compound for Electronic Packaging Product and Services
7.1.4 Dow Epoxy Plastic Compound for Electronic Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 Dow Recent Developments/Updates
7.1.6 Dow Competitive Strengths & Weaknesses
7.2 Henkel
7.2.1 Henkel Details
7.2.2 Henkel Major Business
7.2.3 Henkel Epoxy Plastic Compound for Electronic Packaging Product and Services
7.2.4 Henkel Epoxy Plastic Compound for Electronic Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 Henkel Recent Developments/Updates
7.2.6 Henkel Competitive Strengths & Weaknesses
7.3 Sumitomo Chemical
7.3.1 Sumitomo Chemical Details
7.3.2 Sumitomo Chemical Major Business
7.3.3 Sumitomo Chemical Epoxy Plastic Compound for Electronic Packaging Product and Services
7.3.4 Sumitomo Chemical Epoxy Plastic Compound for Electronic Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 Sumitomo Chemical Recent Developments/Updates
7.3.6 Sumitomo Chemical Competitive Strengths & Weaknesses
7.4 Momentive Performance Materials
7.4.1 Momentive Performance Materials Details
7.4.2 Momentive Performance Materials Major Business
7.4.3 Momentive Performance Materials Epoxy Plastic Compound for Electronic Packaging Product and Services
7.4.4 Momentive Performance Materials Epoxy Plastic Compound for Electronic Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Momentive Performance Materials Recent Developments/Updates
7.4.6 Momentive Performance Materials Competitive Strengths & Weaknesses
7.5 Shin-Etsu Chemical
7.5.1 Shin-Etsu Chemical Details
7.5.2 Shin-Etsu Chemical Major Business
7.5.3 Shin-Etsu Chemical Epoxy Plastic Compound for Electronic Packaging Product and Services
7.5.4 Shin-Etsu Chemical Epoxy Plastic Compound for Electronic Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 Shin-Etsu Chemical Recent Developments/Updates
7.5.6 Shin-Etsu Chemical Competitive Strengths & Weaknesses
7.6 Huntsman
7.6.1 Huntsman Details
7.6.2 Huntsman Major Business
7.6.3 Huntsman Epoxy Plastic Compound for Electronic Packaging Product and Services
7.6.4 Huntsman Epoxy Plastic Compound for Electronic Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 Huntsman Recent Developments/Updates
7.6.6 Huntsman Competitive Strengths & Weaknesses
8 Industry Chain Analysis
8.1 Epoxy Plastic Compound for Electronic Packaging Industry Chain
8.2 Epoxy Plastic Compound for Electronic Packaging Upstream Analysis
8.2.1 Epoxy Plastic Compound for Electronic Packaging Core Raw Materials
8.2.2 Main Manufacturers of Epoxy Plastic Compound for Electronic Packaging Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Epoxy Plastic Compound for Electronic Packaging Production Mode
8.6 Epoxy Plastic Compound for Electronic Packaging Procurement Model
8.7 Epoxy Plastic Compound for Electronic Packaging Industry Sales Model and Sales Channels
8.7.1 Epoxy Plastic Compound for Electronic Packaging Sales Model
8.7.2 Epoxy Plastic Compound for Electronic Packaging Typical Customers
9 Research Findings and Conclusion
10 Appendix
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer

Companies Mentioned:

Dow
Henkel
Sumitomo Chemical
Momentive Performance Materials
Shin-Etsu Chemical
Huntsman

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