The global MEMS and Sensors Packaging market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report is a detailed and comprehensive analysis for global MEMS and Sensors Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global MEMS and Sensors Packaging market size and forecasts, in consumption value ($ Million), 2020-2031
Global MEMS and Sensors Packaging market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global MEMS and Sensors Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global MEMS and Sensors Packaging market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for MEMS and Sensors Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global MEMS and Sensors Packaging market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Amkor Technology, Unisem (M) Berhad, Micralyne, Inc, UTAC, Hana Microelectronics Public Co., Ltd, Infineon Technologies AG, Analog Devices, Inc, Bosch Sensortec GmbH, JCET Group, HT-tech, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
MEMS and Sensors Packaging market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Mold Type
Air Type
Market segment by Application
Lidar
Microphone Sensor
RF MEMS
Fingerprint Sensor
Onboard Pressure Sensor
Optical Sensor
IoT Devices
Market segment by players, this report covers
Amkor Technology
Unisem (M) Berhad
Micralyne, Inc
UTAC
Hana Microelectronics Public Co., Ltd
Infineon Technologies AG
Analog Devices, Inc
Bosch Sensortec GmbH
JCET Group
HT-tech
KYEC
Chipmos Technologies Inc
Chipbond Technology Corporation
OSE CORP
Tong Hsing Electronic Industries,ltd
Formosa Advanced Technologies Co., Ltd
Xintec Inc
Shunsin Technology (Zhongshan) Ltd
China Wafer Level CSP Co.,Ltd
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe MEMS and Sensors Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of MEMS and Sensors Packaging, with revenue, gross margin, and global market share of MEMS and Sensors Packaging from 2020 to 2025.
Chapter 3, the MEMS and Sensors Packaging competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and MEMS and Sensors Packaging market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of MEMS and Sensors Packaging.
Chapter 13, to describe MEMS and Sensors Packaging research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 Market Overview
1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Classification of MEMS and Sensors Packaging by Type
1.3.1 Overview: Global MEMS and Sensors Packaging Market Size by Type: 2020 Versus 2024 Versus 2031
1.3.2 Global MEMS and Sensors Packaging Consumption Value Market Share by Type in 2024
1.3.3 Mold Type
1.3.4 Air Type
1.4 Global MEMS and Sensors Packaging Market by Application
1.4.1 Overview: Global MEMS and Sensors Packaging Market Size by Application: 2020 Versus 2024 Versus 2031
1.4.2 Lidar
1.4.3 Microphone Sensor
1.4.4 RF MEMS
1.4.5 Fingerprint Sensor
1.4.6 Onboard Pressure Sensor
1.4.7 Optical Sensor
1.4.8 IoT Devices
1.5 Global MEMS and Sensors Packaging Market Size & Forecast
1.6 Global MEMS and Sensors Packaging Market Size and Forecast by Region
1.6.1 Global MEMS and Sensors Packaging Market Size by Region: 2020 VS 2024 VS 2031
1.6.2 Global MEMS and Sensors Packaging Market Size by Region, (2020-2031)
1.6.3 North America MEMS and Sensors Packaging Market Size and Prospect (2020-2031)
1.6.4 Europe MEMS and Sensors Packaging Market Size and Prospect (2020-2031)
1.6.5 Asia-Pacific MEMS and Sensors Packaging Market Size and Prospect (2020-2031)
1.6.6 South America MEMS and Sensors Packaging Market Size and Prospect (2020-2031)
1.6.7 Middle East & Africa MEMS and Sensors Packaging Market Size and Prospect (2020-2031)
2 Company Profiles
2.1 Amkor Technology
2.1.1 Amkor Technology Details
2.1.2 Amkor Technology Major Business
2.1.3 Amkor Technology MEMS and Sensors Packaging Product and Solutions
2.1.4 Amkor Technology MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.1.5 Amkor Technology Recent Developments and Future Plans
2.2 Unisem (M) Berhad
2.2.1 Unisem (M) Berhad Details
2.2.2 Unisem (M) Berhad Major Business
2.2.3 Unisem (M) Berhad MEMS and Sensors Packaging Product and Solutions
2.2.4 Unisem (M) Berhad MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.2.5 Unisem (M) Berhad Recent Developments and Future Plans
2.3 Micralyne, Inc
2.3.1 Micralyne, Inc Details
2.3.2 Micralyne, Inc Major Business
2.3.3 Micralyne, Inc MEMS and Sensors Packaging Product and Solutions
2.3.4 Micralyne, Inc MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.3.5 Micralyne, Inc Recent Developments and Future Plans
2.4 UTAC
2.4.1 UTAC Details
2.4.2 UTAC Major Business
2.4.3 UTAC MEMS and Sensors Packaging Product and Solutions
2.4.4 UTAC MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.4.5 UTAC Recent Developments and Future Plans
2.5 Hana Microelectronics Public Co., Ltd
2.5.1 Hana Microelectronics Public Co., Ltd Details
2.5.2 Hana Microelectronics Public Co., Ltd Major Business
2.5.3 Hana Microelectronics Public Co., Ltd MEMS and Sensors Packaging Product and Solutions
2.5.4 Hana Microelectronics Public Co., Ltd MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.5.5 Hana Microelectronics Public Co., Ltd Recent Developments and Future Plans
2.6 Infineon Technologies AG
2.6.1 Infineon Technologies AG Details
2.6.2 Infineon Technologies AG Major Business
2.6.3 Infineon Technologies AG MEMS and Sensors Packaging Product and Solutions
2.6.4 Infineon Technologies AG MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.6.5 Infineon Technologies AG Recent Developments and Future Plans
2.7 Analog Devices, Inc
2.7.1 Analog Devices, Inc Details
2.7.2 Analog Devices, Inc Major Business
2.7.3 Analog Devices, Inc MEMS and Sensors Packaging Product and Solutions
2.7.4 Analog Devices, Inc MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.7.5 Analog Devices, Inc Recent Developments and Future Plans
2.8 Bosch Sensortec GmbH
2.8.1 Bosch Sensortec GmbH Details
2.8.2 Bosch Sensortec GmbH Major Business
2.8.3 Bosch Sensortec GmbH MEMS and Sensors Packaging Product and Solutions
2.8.4 Bosch Sensortec GmbH MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.8.5 Bosch Sensortec GmbH Recent Developments and Future Plans
2.9 JCET Group
2.9.1 JCET Group Details
2.9.2 JCET Group Major Business
2.9.3 JCET Group MEMS and Sensors Packaging Product and Solutions
2.9.4 JCET Group MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.9.5 JCET Group Recent Developments and Future Plans
2.10 HT-tech
2.10.1 HT-tech Details
2.10.2 HT-tech Major Business
2.10.3 HT-tech MEMS and Sensors Packaging Product and Solutions
2.10.4 HT-tech MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.10.5 HT-tech Recent Developments and Future Plans
2.11 KYEC
2.11.1 KYEC Details
2.11.2 KYEC Major Business
2.11.3 KYEC MEMS and Sensors Packaging Product and Solutions
2.11.4 KYEC MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.11.5 KYEC Recent Developments and Future Plans
2.12 Chipmos Technologies Inc
2.12.1 Chipmos Technologies Inc Details
2.12.2 Chipmos Technologies Inc Major Business
2.12.3 Chipmos Technologies Inc MEMS and Sensors Packaging Product and Solutions
2.12.4 Chipmos Technologies Inc MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.12.5 Chipmos Technologies Inc Recent Developments and Future Plans
2.13 Chipbond Technology Corporation
2.13.1 Chipbond Technology Corporation Details
2.13.2 Chipbond Technology Corporation Major Business
2.13.3 Chipbond Technology Corporation MEMS and Sensors Packaging Product and Solutions
2.13.4 Chipbond Technology Corporation MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.13.5 Chipbond Technology Corporation Recent Developments and Future Plans
2.14 OSE CORP
2.14.1 OSE CORP Details
2.14.2 OSE CORP Major Business
2.14.3 OSE CORP MEMS and Sensors Packaging Product and Solutions
2.14.4 OSE CORP MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.14.5 OSE CORP Recent Developments and Future Plans
2.15 Tong Hsing Electronic Industries,ltd
2.15.1 Tong Hsing Electronic Industries,ltd Details
2.15.2 Tong Hsing Electronic Industries,ltd Major Business
2.15.3 Tong Hsing Electronic Industries,ltd MEMS and Sensors Packaging Product and Solutions
2.15.4 Tong Hsing Electronic Industries,ltd MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.15.5 Tong Hsing Electronic Industries,ltd Recent Developments and Future Plans
2.16 Formosa Advanced Technologies Co., Ltd
2.16.1 Formosa Advanced Technologies Co., Ltd Details
2.16.2 Formosa Advanced Technologies Co., Ltd Major Business
2.16.3 Formosa Advanced Technologies Co., Ltd MEMS and Sensors Packaging Product and Solutions
2.16.4 Formosa Advanced Technologies Co., Ltd MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.16.5 Formosa Advanced Technologies Co., Ltd Recent Developments and Future Plans
2.17 Xintec Inc
2.17.1 Xintec Inc Details
2.17.2 Xintec Inc Major Business
2.17.3 Xintec Inc MEMS and Sensors Packaging Product and Solutions
2.17.4 Xintec Inc MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.17.5 Xintec Inc Recent Developments and Future Plans
2.18 Shunsin Technology (Zhongshan) Ltd
2.18.1 Shunsin Technology (Zhongshan) Ltd Details
2.18.2 Shunsin Technology (Zhongshan) Ltd Major Business
2.18.3 Shunsin Technology (Zhongshan) Ltd MEMS and Sensors Packaging Product and Solutions
2.18.4 Shunsin Technology (Zhongshan) Ltd MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.18.5 Shunsin Technology (Zhongshan) Ltd Recent Developments and Future Plans
2.19 China Wafer Level CSP Co.,Ltd
2.19.1 China Wafer Level CSP Co.,Ltd Details
2.19.2 China Wafer Level CSP Co.,Ltd Major Business
2.19.3 China Wafer Level CSP Co.,Ltd MEMS and Sensors Packaging Product and Solutions
2.19.4 China Wafer Level CSP Co.,Ltd MEMS and Sensors Packaging Revenue, Gross Margin and Market Share (2020-2025)
2.19.5 China Wafer Level CSP Co.,Ltd Recent Developments and Future Plans
3 Market Competition, by Players
3.1 Global MEMS and Sensors Packaging Revenue and Share by Players (2020-2025)
3.2 Market Share Analysis (2024)
3.2.1 Market Share of MEMS and Sensors Packaging by Company Revenue
3.2.2 Top 3 MEMS and Sensors Packaging Players Market Share in 2024
3.2.3 Top 6 MEMS and Sensors Packaging Players Market Share in 2024
3.3 MEMS and Sensors Packaging Market: Overall Company Footprint Analysis
3.3.1 MEMS and Sensors Packaging Market: Region Footprint
3.3.2 MEMS and Sensors Packaging Market: Company Product Type Footprint
3.3.3 MEMS and Sensors Packaging Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
4.1 Global MEMS and Sensors Packaging Consumption Value and Market Share by Type (2020-2025)
4.2 Global MEMS and Sensors Packaging Market Forecast by Type (2026-2031)
5 Market Size Segment by Application
5.1 Global MEMS and Sensors Packaging Consumption Value Market Share by Application (2020-2025)
5.2 Global MEMS and Sensors Packaging Market Forecast by Application (2026-2031)
6 North America
6.1 North America MEMS and Sensors Packaging Consumption Value by Type (2020-2031)
6.2 North America MEMS and Sensors Packaging Market Size by Application (2020-2031)
6.3 North America MEMS and Sensors Packaging Market Size by Country
6.3.1 North America MEMS and Sensors Packaging Consumption Value by Country (2020-2031)
6.3.2 United States MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
6.3.3 Canada MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
6.3.4 Mexico MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
7 Europe
7.1 Europe MEMS and Sensors Packaging Consumption Value by Type (2020-2031)
7.2 Europe MEMS and Sensors Packaging Consumption Value by Application (2020-2031)
7.3 Europe MEMS and Sensors Packaging Market Size by Country
7.3.1 Europe MEMS and Sensors Packaging Consumption Value by Country (2020-2031)
7.3.2 Germany MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
7.3.3 France MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
7.3.4 United Kingdom MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
7.3.5 Russia MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
7.3.6 Italy MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
8 Asia-Pacific
8.1 Asia-Pacific MEMS and Sensors Packaging Consumption Value by Type (2020-2031)
8.2 Asia-Pacific MEMS and Sensors Packaging Consumption Value by Application (2020-2031)
8.3 Asia-Pacific MEMS and Sensors Packaging Market Size by Region
8.3.1 Asia-Pacific MEMS and Sensors Packaging Consumption Value by Region (2020-2031)
8.3.2 China MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
8.3.3 Japan MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
8.3.4 South Korea MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
8.3.5 India MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
8.3.6 Southeast Asia MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
8.3.7 Australia MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
9 South America
9.1 South America MEMS and Sensors Packaging Consumption Value by Type (2020-2031)
9.2 South America MEMS and Sensors Packaging Consumption Value by Application (2020-2031)
9.3 South America MEMS and Sensors Packaging Market Size by Country
9.3.1 South America MEMS and Sensors Packaging Consumption Value by Country (2020-2031)
9.3.2 Brazil MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
9.3.3 Argentina MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
10 Middle East & Africa
10.1 Middle East & Africa MEMS and Sensors Packaging Consumption Value by Type (2020-2031)
10.2 Middle East & Africa MEMS and Sensors Packaging Consumption Value by Application (2020-2031)
10.3 Middle East & Africa MEMS and Sensors Packaging Market Size by Country
10.3.1 Middle East & Africa MEMS and Sensors Packaging Consumption Value by Country (2020-2031)
10.3.2 Turkey MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
10.3.3 Saudi Arabia MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
10.3.4 UAE MEMS and Sensors Packaging Market Size and Forecast (2020-2031)
11 Market Dynamics
11.1 MEMS and Sensors Packaging Market Drivers
11.2 MEMS and Sensors Packaging Market Restraints
11.3 MEMS and Sensors Packaging Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 MEMS and Sensors Packaging Industry Chain
12.2 MEMS and Sensors Packaging Upstream Analysis
12.3 MEMS and Sensors Packaging Midstream Analysis
12.4 MEMS and Sensors Packaging Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
Amkor Technology
Unisem (M) Berhad
Micralyne, Inc
UTAC
Hana Microelectronics Public Co., Ltd
Infineon Technologies AG
Analog Devices, Inc
Bosch Sensortec GmbH
JCET Group
HT-tech
KYEC
Chipmos Technologies Inc
Chipbond Technology Corporation
OSE CORP
Tong Hsing Electronic Industries,ltd
Formosa Advanced Technologies Co., Ltd
Xintec Inc
Shunsin Technology (Zhongshan) Ltd
China Wafer Level CSP Co.,Ltd
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*If Applicable.