The global Semiconductor Package market size was valued at USD 29490 million in 2023 and is forecast to a readjusted size of USD 42990 million by 2030 with a CAGR of 5.5% during review period.
Semiconductor packaging is conducted to guarantee protection to the wafer or substrate. The packaging is built from materials such as plastic, metal, glass or ceramic and is composed of one or more semiconductor electronic components.
Semiconductor packaging materials are base players of discrete semiconductor devices and integrated circuits on which other layers are deposited to complete the circuit. Thinner core materials are ideally used to surro system applications.
The validation of lead substrates has increased in comparison to lead frames and bonding wires as the industry advances more towards leadless and cable-less packages.
The market will experience robust growth due to increased demand for smart mobile devices and electronic goods.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report includes an overview of the development of the Semiconductor Package industry chain, the market status of Consumer Electronics (Flip Chip, Embedded Die), Automotive Industry (Flip Chip, Embedded Die), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Semiconductor Package.
Regionally, the report analyzes the Semiconductor Package markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Semiconductor Package market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Semiconductor Package market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Semiconductor Package industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., Flip Chip, Embedded Die).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Semiconductor Package market.
Regional Analysis: The report involves examining the Semiconductor Package market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Semiconductor Package market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Semiconductor Package:
Company Analysis: Report covers individual Semiconductor Package players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Semiconductor Package This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Consumer Electronics, Automotive Industry).
Technology Analysis: Report covers specific technologies relevant to Semiconductor Package. It assesses the current state, advancements, and potential future developments in Semiconductor Package areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Semiconductor Package market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Semiconductor Package market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
Flip Chip
Embedded Die
Fan-in Wafer Level Packaging (Fi Wlp)
Fan-out Wafer Level Packaging
Others
Market segment by Application
Consumer Electronics
Automotive Industry
Aerospace and Defense
Medical Devices
Communications and Telecom
Others
Market segment by players, this report covers
SPIL
ASE
Amkor
JCET
TFME
Siliconware Precision Industries
Powertech Technology Inc
TSMC
Nepes
Walton Advanced Engineering
Unisem
Huatian
Chipbond
UTAC
Chipmos
China Wafer Level CSP
Lingsen Precision
Tianshui Huatian Technology Co., Ltd
King Yuan Electronics CO., Ltd.
Formosa
Carsem
J-Devices
Stats Chippac
Advanced Micro Devices
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Semiconductor Package product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Semiconductor Package, with revenue, gross margin and global market share of Semiconductor Package from 2019 to 2024.
Chapter 3, the Semiconductor Package competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Semiconductor Package market forecast, by regions, type and application, with consumption value, from 2025 to 2030.
Chapter 11, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Package.
Chapter 13, to describe Semiconductor Package research findings and conclusion.
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1 Market Overview
1.1 Product Overview and Scope of Semiconductor Package
1.2 Market Estimation Caveats and Base Year
1.3 Classification of Semiconductor Package by Type
1.3.1 Overview: Global Semiconductor Package Market Size by Type: 2019 Versus 2023 Versus 2030
1.3.2 Global Semiconductor Package Consumption Value Market Share by Type in 2023
1.3.3 Flip Chip
1.3.4 Embedded Die
1.3.5 Fan-in Wafer Level Packaging (Fi Wlp)
1.3.6 Fan-out Wafer Level Packaging
1.3.7 Others
1.4 Global Semiconductor Package Market by Application
1.4.1 Overview: Global Semiconductor Package Market Size by Application: 2019 Versus 2023 Versus 2030
1.4.2 Consumer Electronics
1.4.3 Automotive Industry
1.4.4 Aerospace and Defense
1.4.5 Medical Devices
1.4.6 Communications and Telecom
1.4.7 Others
1.5 Global Semiconductor Package Market Size & Forecast
1.6 Global Semiconductor Package Market Size and Forecast by Region
1.6.1 Global Semiconductor Package Market Size by Region: 2019 VS 2023 VS 2030
1.6.2 Global Semiconductor Package Market Size by Region, (2019-2030)
1.6.3 North America Semiconductor Package Market Size and Prospect (2019-2030)
1.6.4 Europe Semiconductor Package Market Size and Prospect (2019-2030)
1.6.5 Asia-Pacific Semiconductor Package Market Size and Prospect (2019-2030)
1.6.6 South America Semiconductor Package Market Size and Prospect (2019-2030)
1.6.7 Middle East and Africa Semiconductor Package Market Size and Prospect (2019-2030)
2 Company Profiles
2.1 SPIL
2.1.1 SPIL Details
2.1.2 SPIL Major Business
2.1.3 SPIL Semiconductor Package Product and Solutions
2.1.4 SPIL Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.1.5 SPIL Recent Developments and Future Plans
2.2 ASE
2.2.1 ASE Details
2.2.2 ASE Major Business
2.2.3 ASE Semiconductor Package Product and Solutions
2.2.4 ASE Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.2.5 ASE Recent Developments and Future Plans
2.3 Amkor
2.3.1 Amkor Details
2.3.2 Amkor Major Business
2.3.3 Amkor Semiconductor Package Product and Solutions
2.3.4 Amkor Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.3.5 Amkor Recent Developments and Future Plans
2.4 JCET
2.4.1 JCET Details
2.4.2 JCET Major Business
2.4.3 JCET Semiconductor Package Product and Solutions
2.4.4 JCET Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.4.5 JCET Recent Developments and Future Plans
2.5 TFME
2.5.1 TFME Details
2.5.2 TFME Major Business
2.5.3 TFME Semiconductor Package Product and Solutions
2.5.4 TFME Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.5.5 TFME Recent Developments and Future Plans
2.6 Siliconware Precision Industries
2.6.1 Siliconware Precision Industries Details
2.6.2 Siliconware Precision Industries Major Business
2.6.3 Siliconware Precision Industries Semiconductor Package Product and Solutions
2.6.4 Siliconware Precision Industries Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.6.5 Siliconware Precision Industries Recent Developments and Future Plans
2.7 Powertech Technology Inc
2.7.1 Powertech Technology Inc Details
2.7.2 Powertech Technology Inc Major Business
2.7.3 Powertech Technology Inc Semiconductor Package Product and Solutions
2.7.4 Powertech Technology Inc Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.7.5 Powertech Technology Inc Recent Developments and Future Plans
2.8 TSMC
2.8.1 TSMC Details
2.8.2 TSMC Major Business
2.8.3 TSMC Semiconductor Package Product and Solutions
2.8.4 TSMC Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.8.5 TSMC Recent Developments and Future Plans
2.9 Nepes
2.9.1 Nepes Details
2.9.2 Nepes Major Business
2.9.3 Nepes Semiconductor Package Product and Solutions
2.9.4 Nepes Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.9.5 Nepes Recent Developments and Future Plans
2.10 Walton Advanced Engineering
2.10.1 Walton Advanced Engineering Details
2.10.2 Walton Advanced Engineering Major Business
2.10.3 Walton Advanced Engineering Semiconductor Package Product and Solutions
2.10.4 Walton Advanced Engineering Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.10.5 Walton Advanced Engineering Recent Developments and Future Plans
2.11 Unisem
2.11.1 Unisem Details
2.11.2 Unisem Major Business
2.11.3 Unisem Semiconductor Package Product and Solutions
2.11.4 Unisem Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.11.5 Unisem Recent Developments and Future Plans
2.12 Huatian
2.12.1 Huatian Details
2.12.2 Huatian Major Business
2.12.3 Huatian Semiconductor Package Product and Solutions
2.12.4 Huatian Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.12.5 Huatian Recent Developments and Future Plans
2.13 Chipbond
2.13.1 Chipbond Details
2.13.2 Chipbond Major Business
2.13.3 Chipbond Semiconductor Package Product and Solutions
2.13.4 Chipbond Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.13.5 Chipbond Recent Developments and Future Plans
2.14 UTAC
2.14.1 UTAC Details
2.14.2 UTAC Major Business
2.14.3 UTAC Semiconductor Package Product and Solutions
2.14.4 UTAC Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.14.5 UTAC Recent Developments and Future Plans
2.15 Chipmos
2.15.1 Chipmos Details
2.15.2 Chipmos Major Business
2.15.3 Chipmos Semiconductor Package Product and Solutions
2.15.4 Chipmos Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.15.5 Chipmos Recent Developments and Future Plans
2.16 China Wafer Level CSP
2.16.1 China Wafer Level CSP Details
2.16.2 China Wafer Level CSP Major Business
2.16.3 China Wafer Level CSP Semiconductor Package Product and Solutions
2.16.4 China Wafer Level CSP Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.16.5 China Wafer Level CSP Recent Developments and Future Plans
2.17 Lingsen Precision
2.17.1 Lingsen Precision Details
2.17.2 Lingsen Precision Major Business
2.17.3 Lingsen Precision Semiconductor Package Product and Solutions
2.17.4 Lingsen Precision Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.17.5 Lingsen Precision Recent Developments and Future Plans
2.18 Tianshui Huatian Technology Co., Ltd
2.18.1 Tianshui Huatian Technology Co., Ltd Details
2.18.2 Tianshui Huatian Technology Co., Ltd Major Business
2.18.3 Tianshui Huatian Technology Co., Ltd Semiconductor Package Product and Solutions
2.18.4 Tianshui Huatian Technology Co., Ltd Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.18.5 Tianshui Huatian Technology Co., Ltd Recent Developments and Future Plans
2.19 King Yuan Electronics CO., Ltd.
2.19.1 King Yuan Electronics CO., Ltd. Details
2.19.2 King Yuan Electronics CO., Ltd. Major Business
2.19.3 King Yuan Electronics CO., Ltd. Semiconductor Package Product and Solutions
2.19.4 King Yuan Electronics CO., Ltd. Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.19.5 King Yuan Electronics CO., Ltd. Recent Developments and Future Plans
2.20 Formosa
2.20.1 Formosa Details
2.20.2 Formosa Major Business
2.20.3 Formosa Semiconductor Package Product and Solutions
2.20.4 Formosa Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.20.5 Formosa Recent Developments and Future Plans
2.21 Carsem
2.21.1 Carsem Details
2.21.2 Carsem Major Business
2.21.3 Carsem Semiconductor Package Product and Solutions
2.21.4 Carsem Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.21.5 Carsem Recent Developments and Future Plans
2.22 J-Devices
2.22.1 J-Devices Details
2.22.2 J-Devices Major Business
2.22.3 J-Devices Semiconductor Package Product and Solutions
2.22.4 J-Devices Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.22.5 J-Devices Recent Developments and Future Plans
2.23 Stats Chippac
2.23.1 Stats Chippac Details
2.23.2 Stats Chippac Major Business
2.23.3 Stats Chippac Semiconductor Package Product and Solutions
2.23.4 Stats Chippac Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.23.5 Stats Chippac Recent Developments and Future Plans
2.24 Advanced Micro Devices
2.24.1 Advanced Micro Devices Details
2.24.2 Advanced Micro Devices Major Business
2.24.3 Advanced Micro Devices Semiconductor Package Product and Solutions
2.24.4 Advanced Micro Devices Semiconductor Package Revenue, Gross Margin and Market Share (2019-2024)
2.24.5 Advanced Micro Devices Recent Developments and Future Plans
3 Market Competition, by Players
3.1 Global Semiconductor Package Revenue and Share by Players (2019-2024)
3.2 Market Share Analysis (2023)
3.2.1 Market Share of Semiconductor Package by Company Revenue
3.2.2 Top 3 Semiconductor Package Players Market Share in 2023
3.2.3 Top 6 Semiconductor Package Players Market Share in 2023
3.3 Semiconductor Package Market: Overall Company Footprint Analysis
3.3.1 Semiconductor Package Market: Region Footprint
3.3.2 Semiconductor Package Market: Company Product Type Footprint
3.3.3 Semiconductor Package Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
4.1 Global Semiconductor Package Consumption Value and Market Share by Type (2019-2024)
4.2 Global Semiconductor Package Market Forecast by Type (2025-2030)
5 Market Size Segment by Application
5.1 Global Semiconductor Package Consumption Value Market Share by Application (2019-2024)
5.2 Global Semiconductor Package Market Forecast by Application (2025-2030)
6 North America
6.1 North America Semiconductor Package Consumption Value by Type (2019-2030)
6.2 North America Semiconductor Package Consumption Value by Application (2019-2030)
6.3 North America Semiconductor Package Market Size by Country
6.3.1 North America Semiconductor Package Consumption Value by Country (2019-2030)
6.3.2 United States Semiconductor Package Market Size and Forecast (2019-2030)
6.3.3 Canada Semiconductor Package Market Size and Forecast (2019-2030)
6.3.4 Mexico Semiconductor Package Market Size and Forecast (2019-2030)
7 Europe
7.1 Europe Semiconductor Package Consumption Value by Type (2019-2030)
7.2 Europe Semiconductor Package Consumption Value by Application (2019-2030)
7.3 Europe Semiconductor Package Market Size by Country
7.3.1 Europe Semiconductor Package Consumption Value by Country (2019-2030)
7.3.2 Germany Semiconductor Package Market Size and Forecast (2019-2030)
7.3.3 France Semiconductor Package Market Size and Forecast (2019-2030)
7.3.4 United Kingdom Semiconductor Package Market Size and Forecast (2019-2030)
7.3.5 Russia Semiconductor Package Market Size and Forecast (2019-2030)
7.3.6 Italy Semiconductor Package Market Size and Forecast (2019-2030)
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor Package Consumption Value by Type (2019-2030)
8.2 Asia-Pacific Semiconductor Package Consumption Value by Application (2019-2030)
8.3 Asia-Pacific Semiconductor Package Market Size by Region
8.3.1 Asia-Pacific Semiconductor Package Consumption Value by Region (2019-2030)
8.3.2 China Semiconductor Package Market Size and Forecast (2019-2030)
8.3.3 Japan Semiconductor Package Market Size and Forecast (2019-2030)
8.3.4 South Korea Semiconductor Package Market Size and Forecast (2019-2030)
8.3.5 India Semiconductor Package Market Size and Forecast (2019-2030)
8.3.6 Southeast Asia Semiconductor Package Market Size and Forecast (2019-2030)
8.3.7 Australia Semiconductor Package Market Size and Forecast (2019-2030)
9 South America
9.1 South America Semiconductor Package Consumption Value by Type (2019-2030)
9.2 South America Semiconductor Package Consumption Value by Application (2019-2030)
9.3 South America Semiconductor Package Market Size by Country
9.3.1 South America Semiconductor Package Consumption Value by Country (2019-2030)
9.3.2 Brazil Semiconductor Package Market Size and Forecast (2019-2030)
9.3.3 Argentina Semiconductor Package Market Size and Forecast (2019-2030)
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor Package Consumption Value by Type (2019-2030)
10.2 Middle East & Africa Semiconductor Package Consumption Value by Application (2019-2030)
10.3 Middle East & Africa Semiconductor Package Market Size by Country
10.3.1 Middle East & Africa Semiconductor Package Consumption Value by Country (2019-2030)
10.3.2 Turkey Semiconductor Package Market Size and Forecast (2019-2030)
10.3.3 Saudi Arabia Semiconductor Package Market Size and Forecast (2019-2030)
10.3.4 UAE Semiconductor Package Market Size and Forecast (2019-2030)
11 Market Dynamics
11.1 Semiconductor Package Market Drivers
11.2 Semiconductor Package Market Restraints
11.3 Semiconductor Package Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 Semiconductor Package Industry Chain
12.2 Semiconductor Package Upstream Analysis
12.3 Semiconductor Package Midstream Analysis
12.4 Semiconductor Package Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
SPIL
ASE
Amkor
JCET
TFME
Siliconware Precision Industries
Powertech Technology Inc
TSMC
Nepes
Walton Advanced Engineering
Unisem
Huatian
Chipbond
UTAC
Chipmos
China Wafer Level CSP
Lingsen Precision
Tianshui Huatian Technology Co., Ltd
King Yuan Electronics CO., Ltd.
Formosa
Carsem
J-Devices
Stats Chippac
Advanced Micro Devices
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*If Applicable.