Global System-in-Package Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Publication ID:

GIR112402766

Publication Date:

November 27, 2024

Pages:

Publisher:

GIR

Countries:

Global [1]

USD 3,480.00

Software [2]

IT Services [3]

Computing & Electronics [4]

Description:

The global System-in-Package market size was valued at USD 54440 million in 2023 and is forecast to a readjusted size of USD 76960 million by 2030 with a CAGR of 5.1% during review period.
SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report includes an overview of the development of the System-in-Package industry chain, the market status of Consumer Electronics (2D IC, 2.5D IC), Communications (2D IC, 2.5D IC), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of System-in-Package.
Regionally, the report analyzes the System-in-Package markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global System-in-Package market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the System-in-Package market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the System-in-Package industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., 2D IC, 2.5D IC).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the System-in-Package market.
Regional Analysis: The report involves examining the System-in-Package market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the System-in-Package market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to System-in-Package:
Company Analysis: Report covers individual System-in-Package players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards System-in-Package This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Consumer Electronics, Communications).
Technology Analysis: Report covers specific technologies relevant to System-in-Package. It assesses the current state, advancements, and potential future developments in System-in-Package areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the System-in-Package market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
System-in-Package market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
2D IC
2.5D IC
3D IC
Market segment by Application
Consumer Electronics
Communications
Automotive & Transportation
Aerospace & Defense
Healthcare
Others
Market segment by players, this report covers
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe System-in-Package product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of System-in-Package, with revenue, gross margin and global market share of System-in-Package from 2019 to 2024.
Chapter 3, the System-in-Package competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and System-in-Package market forecast, by regions, type and application, with consumption value, from 2025 to 2030.
Chapter 11, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of System-in-Package.
Chapter 13, to describe System-in-Package research findings and conclusion.

Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.

Table Of Contents:

1 Market Overview
1.1 Product Overview and Scope of System-in-Package
1.2 Market Estimation Caveats and Base Year
1.3 Classification of System-in-Package by Type
1.3.1 Overview: Global System-in-Package Market Size by Type: 2019 Versus 2023 Versus 2030
1.3.2 Global System-in-Package Consumption Value Market Share by Type in 2023
1.3.3 2D IC
1.3.4 2.5D IC
1.3.5 3D IC
1.4 Global System-in-Package Market by Application
1.4.1 Overview: Global System-in-Package Market Size by Application: 2019 Versus 2023 Versus 2030
1.4.2 Consumer Electronics
1.4.3 Communications
1.4.4 Automotive & Transportation
1.4.5 Aerospace & Defense
1.4.6 Healthcare
1.4.7 Others
1.5 Global System-in-Package Market Size & Forecast
1.6 Global System-in-Package Market Size and Forecast by Region
1.6.1 Global System-in-Package Market Size by Region: 2019 VS 2023 VS 2030
1.6.2 Global System-in-Package Market Size by Region, (2019-2030)
1.6.3 North America System-in-Package Market Size and Prospect (2019-2030)
1.6.4 Europe System-in-Package Market Size and Prospect (2019-2030)
1.6.5 Asia-Pacific System-in-Package Market Size and Prospect (2019-2030)
1.6.6 South America System-in-Package Market Size and Prospect (2019-2030)
1.6.7 Middle East and Africa System-in-Package Market Size and Prospect (2019-2030)
2 Company Profiles
2.1 Amkor Technology
2.1.1 Amkor Technology Details
2.1.2 Amkor Technology Major Business
2.1.3 Amkor Technology System-in-Package Product and Solutions
2.1.4 Amkor Technology System-in-Package Revenue, Gross Margin and Market Share (2019-2024)
2.1.5 Amkor Technology Recent Developments and Future Plans
2.2 ASE
2.2.1 ASE Details
2.2.2 ASE Major Business
2.2.3 ASE System-in-Package Product and Solutions
2.2.4 ASE System-in-Package Revenue, Gross Margin and Market Share (2019-2024)
2.2.5 ASE Recent Developments and Future Plans
2.3 Jiangsu Changjiang Electronics Technology (JCET)
2.3.1 Jiangsu Changjiang Electronics Technology (JCET) Details
2.3.2 Jiangsu Changjiang Electronics Technology (JCET) Major Business
2.3.3 Jiangsu Changjiang Electronics Technology (JCET) System-in-Package Product and Solutions
2.3.4 Jiangsu Changjiang Electronics Technology (JCET) System-in-Package Revenue, Gross Margin and Market Share (2019-2024)
2.3.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Developments and Future Plans
2.4 Siliconware Precision Industries (SPIL)
2.4.1 Siliconware Precision Industries (SPIL) Details
2.4.2 Siliconware Precision Industries (SPIL) Major Business
2.4.3 Siliconware Precision Industries (SPIL) System-in-Package Product and Solutions
2.4.4 Siliconware Precision Industries (SPIL) System-in-Package Revenue, Gross Margin and Market Share (2019-2024)
2.4.5 Siliconware Precision Industries (SPIL) Recent Developments and Future Plans
2.5 United Test and Assembly Center (UTAC)
2.5.1 United Test and Assembly Center (UTAC) Details
2.5.2 United Test and Assembly Center (UTAC) Major Business
2.5.3 United Test and Assembly Center (UTAC) System-in-Package Product and Solutions
2.5.4 United Test and Assembly Center (UTAC) System-in-Package Revenue, Gross Margin and Market Share (2019-2024)
2.5.5 United Test and Assembly Center (UTAC) Recent Developments and Future Plans
3 Market Competition, by Players
3.1 Global System-in-Package Revenue and Share by Players (2019-2024)
3.2 Market Share Analysis (2023)
3.2.1 Market Share of System-in-Package by Company Revenue
3.2.2 Top 3 System-in-Package Players Market Share in 2023
3.2.3 Top 6 System-in-Package Players Market Share in 2023
3.3 System-in-Package Market: Overall Company Footprint Analysis
3.3.1 System-in-Package Market: Region Footprint
3.3.2 System-in-Package Market: Company Product Type Footprint
3.3.3 System-in-Package Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
4.1 Global System-in-Package Consumption Value and Market Share by Type (2019-2024)
4.2 Global System-in-Package Market Forecast by Type (2025-2030)
5 Market Size Segment by Application
5.1 Global System-in-Package Consumption Value Market Share by Application (2019-2024)
5.2 Global System-in-Package Market Forecast by Application (2025-2030)
6 North America
6.1 North America System-in-Package Consumption Value by Type (2019-2030)
6.2 North America System-in-Package Consumption Value by Application (2019-2030)
6.3 North America System-in-Package Market Size by Country
6.3.1 North America System-in-Package Consumption Value by Country (2019-2030)
6.3.2 United States System-in-Package Market Size and Forecast (2019-2030)
6.3.3 Canada System-in-Package Market Size and Forecast (2019-2030)
6.3.4 Mexico System-in-Package Market Size and Forecast (2019-2030)
7 Europe
7.1 Europe System-in-Package Consumption Value by Type (2019-2030)
7.2 Europe System-in-Package Consumption Value by Application (2019-2030)
7.3 Europe System-in-Package Market Size by Country
7.3.1 Europe System-in-Package Consumption Value by Country (2019-2030)
7.3.2 Germany System-in-Package Market Size and Forecast (2019-2030)
7.3.3 France System-in-Package Market Size and Forecast (2019-2030)
7.3.4 United Kingdom System-in-Package Market Size and Forecast (2019-2030)
7.3.5 Russia System-in-Package Market Size and Forecast (2019-2030)
7.3.6 Italy System-in-Package Market Size and Forecast (2019-2030)
8 Asia-Pacific
8.1 Asia-Pacific System-in-Package Consumption Value by Type (2019-2030)
8.2 Asia-Pacific System-in-Package Consumption Value by Application (2019-2030)
8.3 Asia-Pacific System-in-Package Market Size by Region
8.3.1 Asia-Pacific System-in-Package Consumption Value by Region (2019-2030)
8.3.2 China System-in-Package Market Size and Forecast (2019-2030)
8.3.3 Japan System-in-Package Market Size and Forecast (2019-2030)
8.3.4 South Korea System-in-Package Market Size and Forecast (2019-2030)
8.3.5 India System-in-Package Market Size and Forecast (2019-2030)
8.3.6 Southeast Asia System-in-Package Market Size and Forecast (2019-2030)
8.3.7 Australia System-in-Package Market Size and Forecast (2019-2030)
9 South America
9.1 South America System-in-Package Consumption Value by Type (2019-2030)
9.2 South America System-in-Package Consumption Value by Application (2019-2030)
9.3 South America System-in-Package Market Size by Country
9.3.1 South America System-in-Package Consumption Value by Country (2019-2030)
9.3.2 Brazil System-in-Package Market Size and Forecast (2019-2030)
9.3.3 Argentina System-in-Package Market Size and Forecast (2019-2030)
10 Middle East & Africa
10.1 Middle East & Africa System-in-Package Consumption Value by Type (2019-2030)
10.2 Middle East & Africa System-in-Package Consumption Value by Application (2019-2030)
10.3 Middle East & Africa System-in-Package Market Size by Country
10.3.1 Middle East & Africa System-in-Package Consumption Value by Country (2019-2030)
10.3.2 Turkey System-in-Package Market Size and Forecast (2019-2030)
10.3.3 Saudi Arabia System-in-Package Market Size and Forecast (2019-2030)
10.3.4 UAE System-in-Package Market Size and Forecast (2019-2030)
11 Market Dynamics
11.1 System-in-Package Market Drivers
11.2 System-in-Package Market Restraints
11.3 System-in-Package Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 System-in-Package Industry Chain
12.2 System-in-Package Upstream Analysis
12.3 System-in-Package Midstream Analysis
12.4 System-in-Package Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer

Companies Mentioned:

Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)

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