According to our latest study, the global System On Package (SOP) market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
System on package (SOP) refers to technology that places an entire system with computing, communications, and consumer functions all in a single chip.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
The publisher report includes an overview of the development of the System On Package (SOP) industry chain, the market status of Consumer Electronics (Fine-Pitch, High Bandwidth Wiring), Wireless Communication (Fine-Pitch, High Bandwidth Wiring), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of System On Package (SOP).
Regionally, the report analyzes the System On Package (SOP) markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global System On Package (SOP) market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the System On Package (SOP) market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the System On Package (SOP) industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., Fine-Pitch, High Bandwidth Wiring).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the System On Package (SOP) market.
Regional Analysis: The report involves examining the System On Package (SOP) market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the System On Package (SOP) market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to System On Package (SOP):
Company Analysis: Report covers individual System On Package (SOP) players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards System On Package (SOP) This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Consumer Electronics, Wireless Communication).
Technology Analysis: Report covers specific technologies relevant to System On Package (SOP). It assesses the current state, advancements, and potential future developments in System On Package (SOP) areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the System On Package (SOP) market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
System On Package (SOP) market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
Fine-Pitch
High Bandwidth Wiring
Advanced Microchannel Cooling
Others
Market segment by Application
Consumer Electronics
Wireless Communication
Market segment by players, this report covers
Samsung Electronics Co., Ltd.
ASE Group
Amkor Technology
Toshiba Corporation
Qualcomm Incorporated
ChipMOS Technologies Inc
Powertech Technologies Inc.
Fujitsu
Renesas Electronics Corporation
Siliconware Precision Industries Co.
NXP
Jiangsu Changjiang Electronics Technology Co. Ltd.
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe System On Package (SOP) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of System On Package (SOP), with revenue, gross margin and global market share of System On Package (SOP) from 2019 to 2024.
Chapter 3, the System On Package (SOP) competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and System On Package (SOP) market forecast, by regions, type and application, with consumption value, from 2025 to 2030.
Chapter 11, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of System On Package (SOP).
Chapter 13, to describe System On Package (SOP) research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 Market Overview
1.1 Product Overview and Scope of System On Package (SOP)
1.2 Market Estimation Caveats and Base Year
1.3 Classification of System On Package (SOP) by Type
1.3.1 Overview: Global System On Package (SOP) Market Size by Type: 2019 Versus 2023 Versus 2030
1.3.2 Global System On Package (SOP) Consumption Value Market Share by Type in 2023
1.3.3 Fine-Pitch
1.3.4 High Bandwidth Wiring
1.3.5 Advanced Microchannel Cooling
1.3.6 Others
1.4 Global System On Package (SOP) Market by Application
1.4.1 Overview: Global System On Package (SOP) Market Size by Application: 2019 Versus 2023 Versus 2030
1.4.2 Consumer Electronics
1.4.3 Wireless Communication
1.5 Global System On Package (SOP) Market Size & Forecast
1.6 Global System On Package (SOP) Market Size and Forecast by Region
1.6.1 Global System On Package (SOP) Market Size by Region: 2019 VS 2023 VS 2030
1.6.2 Global System On Package (SOP) Market Size by Region, (2019-2030)
1.6.3 North America System On Package (SOP) Market Size and Prospect (2019-2030)
1.6.4 Europe System On Package (SOP) Market Size and Prospect (2019-2030)
1.6.5 Asia-Pacific System On Package (SOP) Market Size and Prospect (2019-2030)
1.6.6 South America System On Package (SOP) Market Size and Prospect (2019-2030)
1.6.7 Middle East and Africa System On Package (SOP) Market Size and Prospect (2019-2030)
2 Company Profiles
2.1 Samsung Electronics Co., Ltd.
2.1.1 Samsung Electronics Co., Ltd. Details
2.1.2 Samsung Electronics Co., Ltd. Major Business
2.1.3 Samsung Electronics Co., Ltd. System On Package (SOP) Product and Solutions
2.1.4 Samsung Electronics Co., Ltd. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.1.5 Samsung Electronics Co., Ltd. Recent Developments and Future Plans
2.2 ASE Group
2.2.1 ASE Group Details
2.2.2 ASE Group Major Business
2.2.3 ASE Group System On Package (SOP) Product and Solutions
2.2.4 ASE Group System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.2.5 ASE Group Recent Developments and Future Plans
2.3 Amkor Technology
2.3.1 Amkor Technology Details
2.3.2 Amkor Technology Major Business
2.3.3 Amkor Technology System On Package (SOP) Product and Solutions
2.3.4 Amkor Technology System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.3.5 Amkor Technology Recent Developments and Future Plans
2.4 Toshiba Corporation
2.4.1 Toshiba Corporation Details
2.4.2 Toshiba Corporation Major Business
2.4.3 Toshiba Corporation System On Package (SOP) Product and Solutions
2.4.4 Toshiba Corporation System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.4.5 Toshiba Corporation Recent Developments and Future Plans
2.5 Qualcomm Incorporated
2.5.1 Qualcomm Incorporated Details
2.5.2 Qualcomm Incorporated Major Business
2.5.3 Qualcomm Incorporated System On Package (SOP) Product and Solutions
2.5.4 Qualcomm Incorporated System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.5.5 Qualcomm Incorporated Recent Developments and Future Plans
2.6 ChipMOS Technologies Inc
2.6.1 ChipMOS Technologies Inc Details
2.6.2 ChipMOS Technologies Inc Major Business
2.6.3 ChipMOS Technologies Inc System On Package (SOP) Product and Solutions
2.6.4 ChipMOS Technologies Inc System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.6.5 ChipMOS Technologies Inc Recent Developments and Future Plans
2.7 Powertech Technologies Inc.
2.7.1 Powertech Technologies Inc. Details
2.7.2 Powertech Technologies Inc. Major Business
2.7.3 Powertech Technologies Inc. System On Package (SOP) Product and Solutions
2.7.4 Powertech Technologies Inc. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.7.5 Powertech Technologies Inc. Recent Developments and Future Plans
2.8 Fujitsu
2.8.1 Fujitsu Details
2.8.2 Fujitsu Major Business
2.8.3 Fujitsu System On Package (SOP) Product and Solutions
2.8.4 Fujitsu System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.8.5 Fujitsu Recent Developments and Future Plans
2.9 Renesas Electronics Corporation
2.9.1 Renesas Electronics Corporation Details
2.9.2 Renesas Electronics Corporation Major Business
2.9.3 Renesas Electronics Corporation System On Package (SOP) Product and Solutions
2.9.4 Renesas Electronics Corporation System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.9.5 Renesas Electronics Corporation Recent Developments and Future Plans
2.10 Siliconware Precision Industries Co.
2.10.1 Siliconware Precision Industries Co. Details
2.10.2 Siliconware Precision Industries Co. Major Business
2.10.3 Siliconware Precision Industries Co. System On Package (SOP) Product and Solutions
2.10.4 Siliconware Precision Industries Co. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.10.5 Siliconware Precision Industries Co. Recent Developments and Future Plans
2.11 NXP
2.11.1 NXP Details
2.11.2 NXP Major Business
2.11.3 NXP System On Package (SOP) Product and Solutions
2.11.4 NXP System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.11.5 NXP Recent Developments and Future Plans
2.12 Jiangsu Changjiang Electronics Technology Co. Ltd.
2.12.1 Jiangsu Changjiang Electronics Technology Co. Ltd. Details
2.12.2 Jiangsu Changjiang Electronics Technology Co. Ltd. Major Business
2.12.3 Jiangsu Changjiang Electronics Technology Co. Ltd. System On Package (SOP) Product and Solutions
2.12.4 Jiangsu Changjiang Electronics Technology Co. Ltd. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
2.12.5 Jiangsu Changjiang Electronics Technology Co. Ltd. Recent Developments and Future Plans
3 Market Competition, by Players
3.1 Global System On Package (SOP) Revenue and Share by Players (2019-2024)
3.2 Market Share Analysis (2023)
3.2.1 Market Share of System On Package (SOP) by Company Revenue
3.2.2 Top 3 System On Package (SOP) Players Market Share in 2023
3.2.3 Top 6 System On Package (SOP) Players Market Share in 2023
3.3 System On Package (SOP) Market: Overall Company Footprint Analysis
3.3.1 System On Package (SOP) Market: Region Footprint
3.3.2 System On Package (SOP) Market: Company Product Type Footprint
3.3.3 System On Package (SOP) Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
4.1 Global System On Package (SOP) Consumption Value and Market Share by Type (2019-2024)
4.2 Global System On Package (SOP) Market Forecast by Type (2025-2030)
5 Market Size Segment by Application
5.1 Global System On Package (SOP) Consumption Value Market Share by Application (2019-2024)
5.2 Global System On Package (SOP) Market Forecast by Application (2025-2030)
6 North America
6.1 North America System On Package (SOP) Consumption Value by Type (2019-2030)
6.2 North America System On Package (SOP) Consumption Value by Application (2019-2030)
6.3 North America System On Package (SOP) Market Size by Country
6.3.1 North America System On Package (SOP) Consumption Value by Country (2019-2030)
6.3.2 United States System On Package (SOP) Market Size and Forecast (2019-2030)
6.3.3 Canada System On Package (SOP) Market Size and Forecast (2019-2030)
6.3.4 Mexico System On Package (SOP) Market Size and Forecast (2019-2030)
7 Europe
7.1 Europe System On Package (SOP) Consumption Value by Type (2019-2030)
7.2 Europe System On Package (SOP) Consumption Value by Application (2019-2030)
7.3 Europe System On Package (SOP) Market Size by Country
7.3.1 Europe System On Package (SOP) Consumption Value by Country (2019-2030)
7.3.2 Germany System On Package (SOP) Market Size and Forecast (2019-2030)
7.3.3 France System On Package (SOP) Market Size and Forecast (2019-2030)
7.3.4 United Kingdom System On Package (SOP) Market Size and Forecast (2019-2030)
7.3.5 Russia System On Package (SOP) Market Size and Forecast (2019-2030)
7.3.6 Italy System On Package (SOP) Market Size and Forecast (2019-2030)
8 Asia-Pacific
8.1 Asia-Pacific System On Package (SOP) Consumption Value by Type (2019-2030)
8.2 Asia-Pacific System On Package (SOP) Consumption Value by Application (2019-2030)
8.3 Asia-Pacific System On Package (SOP) Market Size by Region
8.3.1 Asia-Pacific System On Package (SOP) Consumption Value by Region (2019-2030)
8.3.2 China System On Package (SOP) Market Size and Forecast (2019-2030)
8.3.3 Japan System On Package (SOP) Market Size and Forecast (2019-2030)
8.3.4 South Korea System On Package (SOP) Market Size and Forecast (2019-2030)
8.3.5 India System On Package (SOP) Market Size and Forecast (2019-2030)
8.3.6 Southeast Asia System On Package (SOP) Market Size and Forecast (2019-2030)
8.3.7 Australia System On Package (SOP) Market Size and Forecast (2019-2030)
9 South America
9.1 South America System On Package (SOP) Consumption Value by Type (2019-2030)
9.2 South America System On Package (SOP) Consumption Value by Application (2019-2030)
9.3 South America System On Package (SOP) Market Size by Country
9.3.1 South America System On Package (SOP) Consumption Value by Country (2019-2030)
9.3.2 Brazil System On Package (SOP) Market Size and Forecast (2019-2030)
9.3.3 Argentina System On Package (SOP) Market Size and Forecast (2019-2030)
10 Middle East & Africa
10.1 Middle East & Africa System On Package (SOP) Consumption Value by Type (2019-2030)
10.2 Middle East & Africa System On Package (SOP) Consumption Value by Application (2019-2030)
10.3 Middle East & Africa System On Package (SOP) Market Size by Country
10.3.1 Middle East & Africa System On Package (SOP) Consumption Value by Country (2019-2030)
10.3.2 Turkey System On Package (SOP) Market Size and Forecast (2019-2030)
10.3.3 Saudi Arabia System On Package (SOP) Market Size and Forecast (2019-2030)
10.3.4 UAE System On Package (SOP) Market Size and Forecast (2019-2030)
11 Market Dynamics
11.1 System On Package (SOP) Market Drivers
11.2 System On Package (SOP) Market Restraints
11.3 System On Package (SOP) Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 System On Package (SOP) Industry Chain
12.2 System On Package (SOP) Upstream Analysis
12.3 System On Package (SOP) Midstream Analysis
12.4 System On Package (SOP) Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
Samsung Electronics Co., Ltd.
ASE Group
Amkor Technology
Toshiba Corporation
Qualcomm Incorporated
ChipMOS Technologies Inc
Powertech Technologies Inc.
Fujitsu
Renesas Electronics Corporation
Siliconware Precision Industries Co.
NXP
Jiangsu Changjiang Electronics Technology Co. Ltd.
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*If Applicable.
