The global Through-Silicon Vias (TSVs) market size was valued at US$ 2974 million in 2023 and is forecast to a readjusted size of USD 7994 million by 2030 with a CAGR of 14.2% during review period.
Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 25% of the global market. Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. These major enterprises account for more than 80% of the total share.
The global Through-Silicon Vias (TSVs) market is poised for significant growth due to the rising demand for high-performance, compact, and energy-efficient electronic devices. TSV technology is a critical enabler of 3D integrated circuits (ICs) and advanced packaging solutions, making it essential for applications like artificial intelligence (AI), 5G, automotive electronics, and high-performance computing (HPC).
Market Growth Drivers
Demand for 3D Integration:
TSVs enable vertical stacking of chips, reducing the interconnect length and enhancing performance, making them indispensable for 3D ICs and heterogeneous integration.
Applications in logic-memory integration, MEMS, and CMOS image sensors are key contributors.
Proliferation of AI and 5G:
TSVs are critical for high-bandwidth memory (HBM), used in AI accelerators and 5G base stations.
These technologies require higher data transfer rates, lower latency, and reduced power consumption, driving TSV adoption.
Miniaturization and High-Density Packaging:
The trend towards smaller, lighter, and more functional devices necessitates the use of TSVs for high-density interconnects.
Growth in Automotive Electronics:
The demand for advanced driver-assistance systems (ADAS), autonomous driving, and in-vehicle sensors is spurring the adoption of TSV-enabled components.
Expansion in Data Centers and HPC:
High-performance TSV-based packaging solutions are essential for the increasing processing power demands in cloud computing and data centers.
This report is a detailed and comprehensive analysis for global Through-Silicon Vias (TSVs) market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Through-Silicon Vias (TSVs) market size and forecasts, in consumption value ($ Million), 2019-2030
Global Through-Silicon Vias (TSVs) market size and forecasts by region and country, in consumption value ($ Million), 2019-2030
Global Through-Silicon Vias (TSVs) market size and forecasts, by Type and by Application, in consumption value ($ Million), 2019-2030
Global Through-Silicon Vias (TSVs) market shares of main players, in revenue ($ Million), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Through-Silicon Vias (TSVs)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Through-Silicon Vias (TSVs) market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE Technology Holding, Amkor Technology, TSMC, Intel, GlobalFoundries, JCET Group, Samsung, HT-tech, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Through-Silicon Vias (TSVs) market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
2.5D TSV
3D TSV
Market segment by Application
Mobile and Consumer Electronics
Communication Equipment
Automotive Electronics
Other
Market segment by players, this report covers
ASE Technology Holding
Amkor Technology
TSMC
Intel
GlobalFoundries
JCET Group
Samsung
HT-tech
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Through-Silicon Vias (TSVs) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Through-Silicon Vias (TSVs), with revenue, gross margin, and global market share of Through-Silicon Vias (TSVs) from 2019 to 2024.
Chapter 3, the Through-Silicon Vias (TSVs) competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Through-Silicon Vias (TSVs) market forecast, by regions, by Type and by Application, with consumption value, from 2025 to 2030.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Through-Silicon Vias (TSVs).
Chapter 13, to describe Through-Silicon Vias (TSVs) research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 Market Overview
1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Classification of Through-Silicon Vias (TSVs) by Type
1.3.1 Overview: Global Through-Silicon Vias (TSVs) Market Size by Type: 2019 Versus 2023 Versus 2030
1.3.2 Global Through-Silicon Vias (TSVs) Consumption Value Market Share by Type in 2023
1.3.3 2.5D TSV
1.3.4 3D TSV
1.4 Global Through-Silicon Vias (TSVs) Market by Application
1.4.1 Overview: Global Through-Silicon Vias (TSVs) Market Size by Application: 2019 Versus 2023 Versus 2030
1.4.2 Mobile and Consumer Electronics
1.4.3 Communication Equipment
1.4.4 Automotive Electronics
1.4.5 Other
1.5 Global Through-Silicon Vias (TSVs) Market Size & Forecast
1.6 Global Through-Silicon Vias (TSVs) Market Size and Forecast by Region
1.6.1 Global Through-Silicon Vias (TSVs) Market Size by Region: 2019 VS 2023 VS 2030
1.6.2 Global Through-Silicon Vias (TSVs) Market Size by Region, (2019-2030)
1.6.3 North America Through-Silicon Vias (TSVs) Market Size and Prospect (2019-2030)
1.6.4 Europe Through-Silicon Vias (TSVs) Market Size and Prospect (2019-2030)
1.6.5 Asia-Pacific Through-Silicon Vias (TSVs) Market Size and Prospect (2019-2030)
1.6.6 South America Through-Silicon Vias (TSVs) Market Size and Prospect (2019-2030)
1.6.7 Middle East & Africa Through-Silicon Vias (TSVs) Market Size and Prospect (2019-2030)
2 Company Profiles
2.1 ASE Technology Holding
2.1.1 ASE Technology Holding Details
2.1.2 ASE Technology Holding Major Business
2.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Product and Solutions
2.1.4 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.1.5 ASE Technology Holding Recent Developments and Future Plans
2.2 Amkor Technology
2.2.1 Amkor Technology Details
2.2.2 Amkor Technology Major Business
2.2.3 Amkor Technology Through-Silicon Vias (TSVs) Product and Solutions
2.2.4 Amkor Technology Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.2.5 Amkor Technology Recent Developments and Future Plans
2.3 TSMC
2.3.1 TSMC Details
2.3.2 TSMC Major Business
2.3.3 TSMC Through-Silicon Vias (TSVs) Product and Solutions
2.3.4 TSMC Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.3.5 TSMC Recent Developments and Future Plans
2.4 Intel
2.4.1 Intel Details
2.4.2 Intel Major Business
2.4.3 Intel Through-Silicon Vias (TSVs) Product and Solutions
2.4.4 Intel Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.4.5 Intel Recent Developments and Future Plans
2.5 GlobalFoundries
2.5.1 GlobalFoundries Details
2.5.2 GlobalFoundries Major Business
2.5.3 GlobalFoundries Through-Silicon Vias (TSVs) Product and Solutions
2.5.4 GlobalFoundries Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.5.5 GlobalFoundries Recent Developments and Future Plans
2.6 JCET Group
2.6.1 JCET Group Details
2.6.2 JCET Group Major Business
2.6.3 JCET Group Through-Silicon Vias (TSVs) Product and Solutions
2.6.4 JCET Group Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.6.5 JCET Group Recent Developments and Future Plans
2.7 Samsung
2.7.1 Samsung Details
2.7.2 Samsung Major Business
2.7.3 Samsung Through-Silicon Vias (TSVs) Product and Solutions
2.7.4 Samsung Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.7.5 Samsung Recent Developments and Future Plans
2.8 HT-tech
2.8.1 HT-tech Details
2.8.2 HT-tech Major Business
2.8.3 HT-tech Through-Silicon Vias (TSVs) Product and Solutions
2.8.4 HT-tech Through-Silicon Vias (TSVs) Revenue, Gross Margin and Market Share (2019-2024)
2.8.5 HT-tech Recent Developments and Future Plans
3 Market Competition, by Players
3.1 Global Through-Silicon Vias (TSVs) Revenue and Share by Players (2019-2024)
3.2 Market Share Analysis (2023)
3.2.1 Market Share of Through-Silicon Vias (TSVs) by Company Revenue
3.2.2 Top 3 Through-Silicon Vias (TSVs) Players Market Share in 2023
3.2.3 Top 6 Through-Silicon Vias (TSVs) Players Market Share in 2023
3.3 Through-Silicon Vias (TSVs) Market: Overall Company Footprint Analysis
3.3.1 Through-Silicon Vias (TSVs) Market: Region Footprint
3.3.2 Through-Silicon Vias (TSVs) Market: Company Product Type Footprint
3.3.3 Through-Silicon Vias (TSVs) Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
4.1 Global Through-Silicon Vias (TSVs) Consumption Value and Market Share by Type (2019-2024)
4.2 Global Through-Silicon Vias (TSVs) Market Forecast by Type (2025-2030)
5 Market Size Segment by Application
5.1 Global Through-Silicon Vias (TSVs) Consumption Value Market Share by Application (2019-2024)
5.2 Global Through-Silicon Vias (TSVs) Market Forecast by Application (2025-2030)
6 North America
6.1 North America Through-Silicon Vias (TSVs) Consumption Value by Type (2019-2030)
6.2 North America Through-Silicon Vias (TSVs) Market Size by Application (2019-2030)
6.3 North America Through-Silicon Vias (TSVs) Market Size by Country
6.3.1 North America Through-Silicon Vias (TSVs) Consumption Value by Country (2019-2030)
6.3.2 United States Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
6.3.3 Canada Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
6.3.4 Mexico Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
7 Europe
7.1 Europe Through-Silicon Vias (TSVs) Consumption Value by Type (2019-2030)
7.2 Europe Through-Silicon Vias (TSVs) Consumption Value by Application (2019-2030)
7.3 Europe Through-Silicon Vias (TSVs) Market Size by Country
7.3.1 Europe Through-Silicon Vias (TSVs) Consumption Value by Country (2019-2030)
7.3.2 Germany Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
7.3.3 France Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
7.3.4 United Kingdom Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
7.3.5 Russia Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
7.3.6 Italy Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
8 Asia-Pacific
8.1 Asia-Pacific Through-Silicon Vias (TSVs) Consumption Value by Type (2019-2030)
8.2 Asia-Pacific Through-Silicon Vias (TSVs) Consumption Value by Application (2019-2030)
8.3 Asia-Pacific Through-Silicon Vias (TSVs) Market Size by Region
8.3.1 Asia-Pacific Through-Silicon Vias (TSVs) Consumption Value by Region (2019-2030)
8.3.2 China Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
8.3.3 Japan Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
8.3.4 South Korea Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
8.3.5 India Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
8.3.6 Southeast Asia Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
8.3.7 Australia Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
9 South America
9.1 South America Through-Silicon Vias (TSVs) Consumption Value by Type (2019-2030)
9.2 South America Through-Silicon Vias (TSVs) Consumption Value by Application (2019-2030)
9.3 South America Through-Silicon Vias (TSVs) Market Size by Country
9.3.1 South America Through-Silicon Vias (TSVs) Consumption Value by Country (2019-2030)
9.3.2 Brazil Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
9.3.3 Argentina Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
10 Middle East & Africa
10.1 Middle East & Africa Through-Silicon Vias (TSVs) Consumption Value by Type (2019-2030)
10.2 Middle East & Africa Through-Silicon Vias (TSVs) Consumption Value by Application (2019-2030)
10.3 Middle East & Africa Through-Silicon Vias (TSVs) Market Size by Country
10.3.1 Middle East & Africa Through-Silicon Vias (TSVs) Consumption Value by Country (2019-2030)
10.3.2 Turkey Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
10.3.3 Saudi Arabia Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
10.3.4 UAE Through-Silicon Vias (TSVs) Market Size and Forecast (2019-2030)
11 Market Dynamics
11.1 Through-Silicon Vias (TSVs) Market Drivers
11.2 Through-Silicon Vias (TSVs) Market Restraints
11.3 Through-Silicon Vias (TSVs) Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 Through-Silicon Vias (TSVs) Industry Chain
12.2 Through-Silicon Vias (TSVs) Upstream Analysis
12.3 Through-Silicon Vias (TSVs) Midstream Analysis
12.4 Through-Silicon Vias (TSVs) Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
ASE Technology Holding
Amkor Technology
TSMC
Intel
GlobalFoundries
JCET Group
Samsung
HT-tech
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*If Applicable.
