Global advanced packaging market will reach $69.17 billion by 2031, growing by 10.0% annually over 2021-2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.
Highlighted with 79 tables and 74 figures, this 152-page report “Global Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify global advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Region.
Based on Product Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging
Based on Packaging Platform, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms
By End User, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users
Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Russia, Rest of Europe; Rest of Europe is further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (Turkey, Iran, South Africa, Other Nations)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SĂśSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 20
2.1 Market Size and Forecast 20
2.1.1 Impact of COVID-19 on World Economy 21
2.1.2 Impact of COVID-19 on the Market 23
2.2 Major Growth Drivers 25
2.3 Market Restraints and Challenges 28
2.4 Emerging Opportunities and Market Trends 31
2.5 Porter’s Fiver Forces Analysis 35
3 Segmentation of Global Market by Product Type 39
3.1 Market Overview by Product Type 39
3.2 Active Packaging 41
3.3 Smart and Intelligent Packaging 42
4 Segmentation of Global Market by Packaging Platform 43
4.1 Market Overview by Packaging Platform 43
4.2 Flip-Chip Ball Grid Array 45
4.3 Flip Chip CSP 46
4.4 Wafer Level CSP 47
4.5 2.5D/3D Integrated Circuit 48
4.6 Fan Out Wafer Level Package (Fo-WLP) 49
4.7 Embedded Die 50
4.8 Fan In Wafer Level Package (Fi-WLP) 51
4.9 Other Packaging Platforms 52
5 Segmentation of Global Market by End User 53
5.1 Market Overview by End User 53
5.2 Consumer Electronics 55
5.3 IT and Telecom 56
5.4 Automotive and Transportation 57
5.5 Industrial Sector 58
5.6 Healthcare and Life Science 59
5.7 Aerospace and Defense 60
5.8 Other End Users 61
6 Segmentation of Global Market by Region 62
6.1 Geographic Market Overview 2021-2031 62
6.2 North America Market 2021-2031 by Country 66
6.2.1 Overview of North America Market 66
6.2.2 U.S. 70
6.2.3 Canada 73
6.2.4 Mexico 75
6.3 European Market 2021-2031 by Country 77
6.3.1 Overview of European Market 77
6.3.2 Germany 81
6.3.3 U.K. 83
6.3.4 France 85
6.3.5 Spain 87
6.3.6 Italy 89
6.3.7 Russia 91
6.3.8 Rest of European Market 93
6.4 Asia-Pacific Market 2021-2031 by Country 95
6.4.1 Overview of Asia-Pacific Market 95
6.4.2 Japan 99
6.4.3 China 102
6.4.4 Australia 104
6.4.5 India 106
6.4.6 South Korea 108
6.4.7 Rest of APAC Region 110
6.5 South America Market 2021-2031 by Country 112
6.5.1 Argentina 115
6.5.2 Brazil 117
6.5.3 Chile 119
6.5.4 Rest of South America Market 121
6.6 MEA Market 2021-2031 by Country 122
6.6.1 Turkey 125
6.6.2 Iran 127
6.6.3 South Africa 129
6.6.4 Other National Markets 131
7 Competitive Landscape 132
7.1 Overview of Key Vendors 132
7.2 New Product Launch, Partnership, Investment, and M&A 135
7.3 Company Profiles 136
Advanced Semiconductor Engineering Inc. 136
Amkor Technology, Inc. 138
Brewer Science, Inc. 139
Chipbond Technology Corporation 140
Intel Corporation 141
International Business Machines Corporation (IBM) 142
Microchip Technology, Inc. 143
Qualcomm Technologies, Inc. 144
Renesas Electronics Corporation 145
Samsung Electronics Co., Ltd. 146
STATS ChipPAC Pte. Ltd 147
SĂśSS Microtec Se 148
Taiwan Semiconductor Manufacturing Company, Limited 149
Texas Instruments, Inc. 150
Universal Instruments Corporation 151
RELATED REPORTS 152
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SĂśSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
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