The global 3D IC & 2.5D IC Packaging market size was valued at US$ 6802.8 million in 2023. With growing demand in downstream market, the 3D IC & 2.5D IC Packaging is forecast to a readjusted size of US$ 20950 million by 2030 with a CAGR of 17.4% during review period.
The research report highlights the growth potential of the global 3D IC & 2.5D IC Packaging market. 3D IC & 2.5D IC Packaging are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of 3D IC & 2.5D IC Packaging. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the 3D IC & 2.5D IC Packaging market.
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
Key Features:
The report on 3D IC & 2.5D IC Packaging market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the 3D IC & 2.5D IC Packaging market. It may include historical data, market segmentation by Type (e.g., 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the 3D IC & 2.5D IC Packaging market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the 3D IC & 2.5D IC Packaging market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the 3D IC & 2.5D IC Packaging industry. This include advancements in 3D IC & 2.5D IC Packaging technology, 3D IC & 2.5D IC Packaging new entrants, 3D IC & 2.5D IC Packaging new investment, and other innovations that are shaping the future of 3D IC & 2.5D IC Packaging.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the 3D IC & 2.5D IC Packaging market. It includes factors influencing customer ' purchasing decisions, preferences for 3D IC & 2.5D IC Packaging product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the 3D IC & 2.5D IC Packaging market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting 3D IC & 2.5D IC Packaging market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the 3D IC & 2.5D IC Packaging market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the 3D IC & 2.5D IC Packaging industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the 3D IC & 2.5D IC Packaging market.
Market Segmentation:
3D IC & 2.5D IC Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Segmentation by type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Segmentation by application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering
JCET
TongFu Microelectronics
Key Questions Addressed in this Report
What is the 10-year outlook for the global 3D IC & 2.5D IC Packaging market?
What factors are driving 3D IC & 2.5D IC Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do 3D IC & 2.5D IC Packaging market opportunities vary by end market size?
How does 3D IC & 2.5D IC Packaging break out type, application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global 3D IC & 2.5D IC Packaging Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for 3D IC & 2.5D IC Packaging by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for 3D IC & 2.5D IC Packaging by Country/Region, 2019, 2023 & 2030
2.2 3D IC & 2.5D IC Packaging Segment by Type
2.2.1 3D TSV
2.2.2 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
2.3 3D IC & 2.5D IC Packaging Sales by Type
2.3.1 Global 3D IC & 2.5D IC Packaging Sales Market Share by Type (2019-2024)
2.3.2 Global 3D IC & 2.5D IC Packaging Revenue and Market Share by Type (2019-2024)
2.3.3 Global 3D IC & 2.5D IC Packaging Sale Price by Type (2019-2024)
2.4 3D IC & 2.5D IC Packaging Segment by Application
2.4.1 Automotive
2.4.2 Consumer electronics
2.4.3 Medical devices
2.4.4 Military & aerospace
2.4.5 Telecommunication
2.4.6 Industrial sector and smart technologies
2.5 3D IC & 2.5D IC Packaging Sales by Application
2.5.1 Global 3D IC & 2.5D IC Packaging Sale Market Share by Application (2019-2024)
2.5.2 Global 3D IC & 2.5D IC Packaging Revenue and Market Share by Application (2019-2024)
2.5.3 Global 3D IC & 2.5D IC Packaging Sale Price by Application (2019-2024)
3 Global 3D IC & 2.5D IC Packaging by Company
3.1 Global 3D IC & 2.5D IC Packaging Breakdown Data by Company
3.1.1 Global 3D IC & 2.5D IC Packaging Annual Sales by Company (2019-2024)
3.1.2 Global 3D IC & 2.5D IC Packaging Sales Market Share by Company (2019-2024)
3.2 Global 3D IC & 2.5D IC Packaging Annual Revenue by Company (2019-2024)
3.2.1 Global 3D IC & 2.5D IC Packaging Revenue by Company (2019-2024)
3.2.2 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Company (2019-2024)
3.3 Global 3D IC & 2.5D IC Packaging Sale Price by Company
3.4 Key Manufacturers 3D IC & 2.5D IC Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers 3D IC & 2.5D IC Packaging Product Location Distribution
3.4.2 Players 3D IC & 2.5D IC Packaging Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for 3D IC & 2.5D IC Packaging by Geographic Region
4.1 World Historic 3D IC & 2.5D IC Packaging Market Size by Geographic Region (2019-2024)
4.1.1 Global 3D IC & 2.5D IC Packaging Annual Sales by Geographic Region (2019-2024)
4.1.2 Global 3D IC & 2.5D IC Packaging Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic 3D IC & 2.5D IC Packaging Market Size by Country/Region (2019-2024)
4.2.1 Global 3D IC & 2.5D IC Packaging Annual Sales by Country/Region (2019-2024)
4.2.2 Global 3D IC & 2.5D IC Packaging Annual Revenue by Country/Region (2019-2024)
4.3 Americas 3D IC & 2.5D IC Packaging Sales Growth
4.4 APAC 3D IC & 2.5D IC Packaging Sales Growth
4.5 Europe 3D IC & 2.5D IC Packaging Sales Growth
4.6 Middle East & Africa 3D IC & 2.5D IC Packaging Sales Growth
5 Americas
5.1 Americas 3D IC & 2.5D IC Packaging Sales by Country
5.1.1 Americas 3D IC & 2.5D IC Packaging Sales by Country (2019-2024)
5.1.2 Americas 3D IC & 2.5D IC Packaging Revenue by Country (2019-2024)
5.2 Americas 3D IC & 2.5D IC Packaging Sales by Type
5.3 Americas 3D IC & 2.5D IC Packaging Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC 3D IC & 2.5D IC Packaging Sales by Region
6.1.1 APAC 3D IC & 2.5D IC Packaging Sales by Region (2019-2024)
6.1.2 APAC 3D IC & 2.5D IC Packaging Revenue by Region (2019-2024)
6.2 APAC 3D IC & 2.5D IC Packaging Sales by Type
6.3 APAC 3D IC & 2.5D IC Packaging Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe 3D IC & 2.5D IC Packaging by Country
7.1.1 Europe 3D IC & 2.5D IC Packaging Sales by Country (2019-2024)
7.1.2 Europe 3D IC & 2.5D IC Packaging Revenue by Country (2019-2024)
7.2 Europe 3D IC & 2.5D IC Packaging Sales by Type
7.3 Europe 3D IC & 2.5D IC Packaging Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa 3D IC & 2.5D IC Packaging by Country
8.1.1 Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Country (2019-2024)
8.1.2 Middle East & Africa 3D IC & 2.5D IC Packaging Revenue by Country (2019-2024)
8.2 Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Type
8.3 Middle East & Africa 3D IC & 2.5D IC Packaging Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of 3D IC & 2.5D IC Packaging
10.3 Manufacturing Process Analysis of 3D IC & 2.5D IC Packaging
10.4 Industry Chain Structure of 3D IC & 2.5D IC Packaging
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 3D IC & 2.5D IC Packaging Distributors
11.3 3D IC & 2.5D IC Packaging Customer
12 World Forecast Review for 3D IC & 2.5D IC Packaging by Geographic Region
12.1 Global 3D IC & 2.5D IC Packaging Market Size Forecast by Region
12.1.1 Global 3D IC & 2.5D IC Packaging Forecast by Region (2025-2030)
12.1.2 Global 3D IC & 2.5D IC Packaging Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global 3D IC & 2.5D IC Packaging Forecast by Type
12.7 Global 3D IC & 2.5D IC Packaging Forecast by Application
13 Key Players Analysis
13.1 Intel Corporation
13.1.1 Intel Corporation Company Information
13.1.2 Intel Corporation 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Intel Corporation Main Business Overview
13.1.5 Intel Corporation Latest Developments
13.2 Toshiba Corp
13.2.1 Toshiba Corp Company Information
13.2.2 Toshiba Corp 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Toshiba Corp Main Business Overview
13.2.5 Toshiba Corp Latest Developments
13.3 Samsung Electronics
13.3.1 Samsung Electronics Company Information
13.3.2 Samsung Electronics 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Samsung Electronics Main Business Overview
13.3.5 Samsung Electronics Latest Developments
13.4 Stmicroelectronics
13.4.1 Stmicroelectronics Company Information
13.4.2 Stmicroelectronics 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Stmicroelectronics Main Business Overview
13.4.5 Stmicroelectronics Latest Developments
13.5 Taiwan Semiconductor Manufacturing
13.5.1 Taiwan Semiconductor Manufacturing Company Information
13.5.2 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Taiwan Semiconductor Manufacturing Main Business Overview
13.5.5 Taiwan Semiconductor Manufacturing Latest Developments
13.6 Amkor Technology
13.6.1 Amkor Technology Company Information
13.6.2 Amkor Technology 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Amkor Technology Main Business Overview
13.6.5 Amkor Technology Latest Developments
13.7 United Microelectronics
13.7.1 United Microelectronics Company Information
13.7.2 United Microelectronics 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 United Microelectronics Main Business Overview
13.7.5 United Microelectronics Latest Developments
13.8 Broadcom
13.8.1 Broadcom Company Information
13.8.2 Broadcom 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.8.3 Broadcom 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Broadcom Main Business Overview
13.8.5 Broadcom Latest Developments
13.9 ASE Group
13.9.1 ASE Group Company Information
13.9.2 ASE Group 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.9.3 ASE Group 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 ASE Group Main Business Overview
13.9.5 ASE Group Latest Developments
13.10 Pure Storage
13.10.1 Pure Storage Company Information
13.10.2 Pure Storage 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.10.3 Pure Storage 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Pure Storage Main Business Overview
13.10.5 Pure Storage Latest Developments
13.11 Advanced Semiconductor Engineering
13.11.1 Advanced Semiconductor Engineering Company Information
13.11.2 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Advanced Semiconductor Engineering Main Business Overview
13.11.5 Advanced Semiconductor Engineering Latest Developments
13.12 JCET
13.12.1 JCET Company Information
13.12.2 JCET 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.12.3 JCET 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 JCET Main Business Overview
13.12.5 JCET Latest Developments
13.13 TongFu Microelectronics
13.13.1 TongFu Microelectronics Company Information
13.13.2 TongFu Microelectronics 3D IC & 2.5D IC Packaging Product Portfolios and Specifications
13.13.3 TongFu Microelectronics 3D IC & 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 TongFu Microelectronics Main Business Overview
13.13.5 TongFu Microelectronics Latest Developments
14 Research Findings and Conclusion
听
听
*If Applicable.
