Global 3D ICs Market Growth (Status and Outlook) 2024-2030

Publication ID:

LPI03240216

Publication Date:

March 1, 2024

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global 3D ICs market size was valued at US$ 27990 million in 2023. With growing demand in downstream market, the 3D ICs is forecast to a readjusted size of US$ 36680 million by 2030 with a CAGR of 3.9% during review period.
The research report highlights the growth potential of the global 3D ICs market. 3D ICs are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of 3D ICs. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the 3D ICs market.
3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
Key Features:
The report on 3D ICs market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the 3D ICs market. It may include historical data, market segmentation by Type (e.g., 3D SiCs, Monolithic 3D ICs), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the 3D ICs market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the 3D ICs market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the 3D ICs industry. This include advancements in 3D ICs technology, 3D ICs new entrants, 3D ICs new investment, and other innovations that are shaping the future of 3D ICs.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the 3D ICs market. It includes factors influencing customer ' purchasing decisions, preferences for 3D ICs product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the 3D ICs market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting 3D ICs market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the 3D ICs market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the 3D ICs industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the 3D ICs market.
Market Segmentation:
3D ICs market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
3D SiCs
Monolithic 3D ICs
Segmentation by application
Automotive
Smart Technologies
Robotics
Electronics
Medical
Industrial
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Xilinx
Advanced Semiconductor Engineering (ASE)
Samsung
STMicroelectronics
Taiwan Semiconductors Manufacturing (TSMC)
Toshiba
EV Group
Tessera

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global 3D ICs Market Size 2019-2030
2.1.2 3D ICs Market Size CAGR by Region 2019 VS 2023 VS 2030
2.2 3D ICs Segment by Type
2.2.1 3D SiCs
2.2.2 Monolithic 3D ICs
2.3 3D ICs Market Size by Type
2.3.1 3D ICs Market Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global 3D ICs Market Size Market Share by Type (2019-2024)
2.4 3D ICs Segment by Application
2.4.1 Automotive
2.4.2 Smart Technologies
2.4.3 Robotics
2.4.4 Electronics
2.4.5 Medical
2.4.6 Industrial
2.5 3D ICs Market Size by Application
2.5.1 3D ICs Market Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global 3D ICs Market Size Market Share by Application (2019-2024)
3 3D ICs Market Size by Player
3.1 3D ICs Market Size Market Share by Players
3.1.1 Global 3D ICs Revenue by Players (2019-2024)
3.1.2 Global 3D ICs Revenue Market Share by Players (2019-2024)
3.2 Global 3D ICs Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 3D ICs by Regions
4.1 3D ICs Market Size by Regions (2019-2024)
4.2 Americas 3D ICs Market Size Growth (2019-2024)
4.3 APAC 3D ICs Market Size Growth (2019-2024)
4.4 Europe 3D ICs Market Size Growth (2019-2024)
4.5 Middle East & Africa 3D ICs Market Size Growth (2019-2024)
5 Americas
5.1 Americas 3D ICs Market Size by Country (2019-2024)
5.2 Americas 3D ICs Market Size by Type (2019-2024)
5.3 Americas 3D ICs Market Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC 3D ICs Market Size by Region (2019-2024)
6.2 APAC 3D ICs Market Size by Type (2019-2024)
6.3 APAC 3D ICs Market Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe 3D ICs by Country (2019-2024)
7.2 Europe 3D ICs Market Size by Type (2019-2024)
7.3 Europe 3D ICs Market Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa 3D ICs by Region (2019-2024)
8.2 Middle East & Africa 3D ICs Market Size by Type (2019-2024)
8.3 Middle East & Africa 3D ICs Market Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global 3D ICs Market Forecast
10.1 Global 3D ICs Forecast by Regions (2025-2030)
10.1.1 Global 3D ICs Forecast by Regions (2025-2030)
10.1.2 Americas 3D ICs Forecast
10.1.3 APAC 3D ICs Forecast
10.1.4 Europe 3D ICs Forecast
10.1.5 Middle East & Africa 3D ICs Forecast
10.2 Americas 3D ICs Forecast by Country (2025-2030)
10.2.1 United States 3D ICs Market Forecast
10.2.2 Canada 3D ICs Market Forecast
10.2.3 Mexico 3D ICs Market Forecast
10.2.4 Brazil 3D ICs Market Forecast
10.3 APAC 3D ICs Forecast by Region (2025-2030)
10.3.1 China 3D ICs Market Forecast
10.3.2 Japan 3D ICs Market Forecast
10.3.3 Korea 3D ICs Market Forecast
10.3.4 Southeast Asia 3D ICs Market Forecast
10.3.5 India 3D ICs Market Forecast
10.3.6 Australia 3D ICs Market Forecast
10.4 Europe 3D ICs Forecast by Country (2025-2030)
10.4.1 Germany 3D ICs Market Forecast
10.4.2 France 3D ICs Market Forecast
10.4.3 UK 3D ICs Market Forecast
10.4.4 Italy 3D ICs Market Forecast
10.4.5 Russia 3D ICs Market Forecast
10.5 Middle East & Africa 3D ICs Forecast by Region (2025-2030)
10.5.1 Egypt 3D ICs Market Forecast
10.5.2 South Africa 3D ICs Market Forecast
10.5.3 Israel 3D ICs Market Forecast
10.5.4 Turkey 3D ICs Market Forecast
10.5.5 GCC Countries 3D ICs Market Forecast
10.6 Global 3D ICs Forecast by Type (2025-2030)
10.7 Global 3D ICs Forecast by Application (2025-2030)

11 Key Players Analysis
11.1 Xilinx
11.1.1 Xilinx Company Information
11.1.2 Xilinx 3D ICs Product Offered
11.1.3 Xilinx 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.1.4 Xilinx Main Business Overview
11.1.5 Xilinx Latest Developments
11.2 Advanced Semiconductor Engineering (ASE)
11.2.1 Advanced Semiconductor Engineering (ASE) Company Information
11.2.2 Advanced Semiconductor Engineering (ASE) 3D ICs Product Offered
11.2.3 Advanced Semiconductor Engineering (ASE) 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.2.4 Advanced Semiconductor Engineering (ASE) Main Business Overview
11.2.5 Advanced Semiconductor Engineering (ASE) Latest Developments
11.3 Samsung
11.3.1 Samsung Company Information
11.3.2 Samsung 3D ICs Product Offered
11.3.3 Samsung 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.3.4 Samsung Main Business Overview
11.3.5 Samsung Latest Developments
11.4 STMicroelectronics
11.4.1 STMicroelectronics Company Information
11.4.2 STMicroelectronics 3D ICs Product Offered
11.4.3 STMicroelectronics 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.4.4 STMicroelectronics Main Business Overview
11.4.5 STMicroelectronics Latest Developments
11.5 Taiwan Semiconductors Manufacturing (TSMC)
11.5.1 Taiwan Semiconductors Manufacturing (TSMC) Company Information
11.5.2 Taiwan Semiconductors Manufacturing (TSMC) 3D ICs Product Offered
11.5.3 Taiwan Semiconductors Manufacturing (TSMC) 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.5.4 Taiwan Semiconductors Manufacturing (TSMC) Main Business Overview
11.5.5 Taiwan Semiconductors Manufacturing (TSMC) Latest Developments
11.6 Toshiba
11.6.1 Toshiba Company Information
11.6.2 Toshiba 3D ICs Product Offered
11.6.3 Toshiba 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.6.4 Toshiba Main Business Overview
11.6.5 Toshiba Latest Developments
11.7 EV Group
11.7.1 EV Group Company Information
11.7.2 EV Group 3D ICs Product Offered
11.7.3 EV Group 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.7.4 EV Group Main Business Overview
11.7.5 EV Group Latest Developments
11.8 Tessera
11.8.1 Tessera Company Information
11.8.2 Tessera 3D ICs Product Offered
11.8.3 Tessera 3D ICs Revenue, Gross Margin and Market Share (2019-2024)
11.8.4 Tessera Main Business Overview
11.8.5 Tessera Latest Developments
12 Research Findings and Conclusion

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