Global 3D Packaging Market Growth (Status and Outlook) 2024-2030

Publication ID:

LPI08249882

Publication Date:

August 26, 2024

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

IT Services [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

According to this study, the global 3D Packaging market size will reach US$ million by 2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report presents a comprehensive overview, market shares, and growth opportunities of 3D Packaging market by product type, application, key players and key regions and countries.
Segmentation by product type:
3D Wire Bonding
3D TSV
Others
Segmentation by Application:
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others
This report also splits the market by region:
United States
China
Europe
Other regions:
Japan
South Korea
Southeast Asia
Rest of world
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report:
lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
2 Executive Summary
2.1 World Market Overview
2.1.1 Global 3D Packaging Market Size 2024-2030
2.1.2 3D Packaging Market Size CAGR by Region
2.2 3D Packaging Segment by Type
2.2.1 3D Wire Bonding
2.2.2 3D TSV
2.2.3 Others
2.3 3D Packaging Market Size by Type
2.3.1 Global 3D Packaging Market Size Market Share by Type (2024-2030)
2.3.2 Global 3D Packaging Market Size Growth Rate by Type (2024-2030)
2.4 3D Packaging Segment by Application
2.4.1 Consumer Electronics
2.4.2 Industrial
2.4.3 Automotive & Transport
2.4.4 IT & Telecommunication
2.4.5 Others
2.5 3D Packaging Market Size by Application
2.5.1 Global 3D Packaging Market Size Market Share by Application (2024-2030)
2.5.2 Global 3D Packaging Market Size Growth Rate by Application (2024-2030)
3 3D Packaging Key Players
3.1 Date of Key Players Enter into 3D Packaging
3.2 Key Players 3D Packaging Product Offered
3.3 Key Players 3D Packaging Funding/Investment Analysis
3.4 Funding/Investment
3.4.1 Funding/Investment by Regions
3.4.2 Funding/Investment by End-Industry
3.5 Key Players 3D Packaging Valuation & Market Capitalization
3.6 Key Players Mergers & Acquisitions, Expansion Plans
3.7 Market Ranking
3.8 New Product/Technology Launches
3.9 Partnerships, Agreements, and Collaborations
3.10 Mergers and Acquisitions
4 3D Packaging by Regions
4.1 3D Packaging Market Size by Regions (2024-2030)
4.2 United States 3D Packaging Market Size Growth (2024-2030)
4.3 China 3D Packaging Market Size Growth (2024-2030)
4.4 Europe 3D Packaging Market Size Growth (2024-2030)
4.5 Rest of World 3D Packaging Market Size Growth (2024-2030)
5 United States
5.1 United States 3D Packaging Market Size by Type (2024-2030)
5.2 United States 3D Packaging Market Size by Application (2024-2030)
6 Europe
6.1 Europe 3D Packaging Market Size by Type (2024-2030)
6.2 Europe 3D Packaging Market Size by Application (2024-2030)
7 China
7.1 China 3D Packaging Market Size by Type (2024-2030)
7.2 China 3D Packaging Market Size by Application (2024-2030)
8 Rest of World
8.1 Rest of World 3D Packaging Market Size by Type (2024-2030)
8.2 Rest of World 3D Packaging Market Size by Application (2024-2030)
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Key Investors in 3D Packaging
10.1 Company A
10.1.1 Company A Company Details
10.1.2 Company Description
10.1.3 Companies Invested by Company A
10.1.4 Company A Key Development and Market Layout
10.2 Company B
10.2.1 Company B Company Details
10.2.2 Company Description
10.2.3 Companies Invested by Company B
10.2.4 Company B Key Development and Market Layout
10.3 Company C
10.3.1 Company C Company Details
10.3.2 Company Description
10.3.3 Companies Invested by Company C
10.3.4 Company C Key Development and Market Layout
10.4 Company D
10.5 鈥︹€�
11 Key Players Analysis
11.1 lASE
11.1.1 lASE Company Details
11.1.2 lASE 3D Packaging Product Offered
11.1.3 lASE 3D Packaging Market Size (2024 VS 2030)
11.1.4 lASE Main Business Overview
11.1.5 lASE News
11.2 Amkor
11.2.1 Amkor Company Details
11.2.2 Amkor 3D Packaging Product Offered
11.2.3 Amkor 3D Packaging Market Size (2024 VS 2030)
11.2.4 Amkor Main Business Overview
11.2.5 Amkor News
11.3 Intel
11.3.1 Intel Company Details
11.3.2 Intel 3D Packaging Product Offered
11.3.3 Intel 3D Packaging Market Size (2024 VS 2030)
11.3.4 Intel Main Business Overview
11.3.5 Intel News
11.4 Samsung
11.4.1 Samsung Company Details
11.4.2 Samsung 3D Packaging Product Offered
11.4.3 Samsung 3D Packaging Market Size (2024 VS 2030)
11.4.4 Samsung Main Business Overview
11.4.5 Samsung News
11.5 AT&S
11.5.1 AT&S Company Details
11.5.2 AT&S 3D Packaging Product Offered
11.5.3 AT&S 3D Packaging Market Size (2024 VS 2030)
11.5.4 AT&S Main Business Overview
11.5.5 AT&S News
11.6 Toshiba
11.6.1 Toshiba Company Details
11.6.2 Toshiba 3D Packaging Product Offered
11.6.3 Toshiba 3D Packaging Market Size (2024 VS 2030)
11.6.4 Toshiba Main Business Overview
11.6.5 Toshiba News
11.7 JCET
11.7.1 JCET Company Details
11.7.2 JCET 3D Packaging Product Offered
11.7.3 JCET 3D Packaging Market Size (2024 VS 2030)
11.7.4 JCET Main Business Overview
11.7.5 JCET News
11.8 Qualcomm
11.8.1 Qualcomm Company Details
11.8.2 Qualcomm 3D Packaging Product Offered
11.8.3 Qualcomm 3D Packaging Market Size (2024 VS 2030)
11.8.4 Qualcomm Main Business Overview
11.8.5 Qualcomm News
11.9 IBM
11.9.1 IBM Company Details
11.9.2 IBM 3D Packaging Product Offered
11.9.3 IBM 3D Packaging Market Size (2024 VS 2030)
11.9.4 IBM Main Business Overview
11.9.5 IBM News
11.10 SK Hynix
11.10.1 SK Hynix Company Details
11.10.2 SK Hynix 3D Packaging Product Offered
11.10.3 SK Hynix 3D Packaging Market Size (2024 VS 2030)
11.10.4 SK Hynix Main Business Overview
11.10.5 SK Hynix News
11.11 UTAC
11.12 TSMC
11.13 China Wafer Level CSP
11.14 Interconnect Systems
12 Research Findings and Conclusion

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