
The term "AI Server PCB" typically refers to the printed circuit board (PCB) used in an Artificial Intelligence (AI) server. An AI server is a computer system specifically designed to handle complex AI tasks, such as machine learning and deep learning algorithms. The PCB in an AI server plays a crucial role in providing connectivity and electrical pathways for various components, including processors, memory modules, storage devices, network interfaces, power management circuits, and other peripherals.
The global AI Server HDI (high-density interconnect) PCB market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The “AI Server HDI (high-density interconnect) PCB Industry Forecast” looks at past sales and reviews total world AI Server HDI (high-density interconnect) PCB sales in 2023, providing a comprehensive analysis by region and market sector of projected AI Server HDI (high-density interconnect) PCB sales for 2024 through 2030. With AI Server HDI (high-density interconnect) PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world AI Server HDI (high-density interconnect) PCB industry.
This Insight Report provides a comprehensive analysis of the global AI Server HDI (high-density interconnect) PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on AI Server HDI (high-density interconnect) PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global AI Server HDI (high-density interconnect) PCB market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for AI Server HDI (high-density interconnect) PCB and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global AI Server HDI (high-density interconnect) PCB.
United States market for AI Server HDI (high-density interconnect) PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for AI Server HDI (high-density interconnect) PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for AI Server HDI (high-density interconnect) PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key AI Server HDI (high-density interconnect) PCB players cover Victory Giant Technology, Wus Printed Circuit, GCE, Unimicron, SCC, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of AI Server HDI (high-density interconnect) PCB market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
20 Layers
24 Layers
Other
Segmentation by Application:
Universal Server
Logical Server
Training Server
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Victory Giant Technology
Wus Printed Circuit
GCE
Unimicron
SCC
Olympic Country
Shengyi Technology
Compeq Co
Zhending
HannStar Board
Key Questions Addressed in this Report
What is the 10-year outlook for the global AI Server HDI (high-density interconnect) PCB market?
What factors are driving AI Server HDI (high-density interconnect) PCB market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do AI Server HDI (high-density interconnect) PCB market opportunities vary by end market size?
How does AI Server HDI (high-density interconnect) PCB break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global AI Server HDI (high-density interconnect) PCB Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for AI Server HDI (high-density interconnect) PCB by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for AI Server HDI (high-density interconnect) PCB by Country/Region, 2019, 2023 & 2030
2.2 AI Server HDI (high-density interconnect) PCB Segment by Type
2.2.1 20 Layers
2.2.2 24 Layers
2.2.3 Other
2.3 AI Server HDI (high-density interconnect) PCB Sales by Type
2.3.1 Global AI Server HDI (high-density interconnect) PCB Sales Market Share by Type (2019-2024)
2.3.2 Global AI Server HDI (high-density interconnect) PCB Revenue and Market Share by Type (2019-2024)
2.3.3 Global AI Server HDI (high-density interconnect) PCB Sale Price by Type (2019-2024)
2.4 AI Server HDI (high-density interconnect) PCB Segment by Application
2.4.1 Universal Server
2.4.2 Logical Server
2.4.3 Training Server
2.5 AI Server HDI (high-density interconnect) PCB Sales by Application
2.5.1 Global AI Server HDI (high-density interconnect) PCB Sale Market Share by Application (2019-2024)
2.5.2 Global AI Server HDI (high-density interconnect) PCB Revenue and Market Share by Application (2019-2024)
2.5.3 Global AI Server HDI (high-density interconnect) PCB Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global AI Server HDI (high-density interconnect) PCB Breakdown Data by Company
3.1.1 Global AI Server HDI (high-density interconnect) PCB Annual Sales by Company (2019-2024)
3.1.2 Global AI Server HDI (high-density interconnect) PCB Sales Market Share by Company (2019-2024)
3.2 Global AI Server HDI (high-density interconnect) PCB Annual Revenue by Company (2019-2024)
3.2.1 Global AI Server HDI (high-density interconnect) PCB Revenue by Company (2019-2024)
3.2.2 Global AI Server HDI (high-density interconnect) PCB Revenue Market Share by Company (2019-2024)
3.3 Global AI Server HDI (high-density interconnect) PCB Sale Price by Company
3.4 Key Manufacturers AI Server HDI (high-density interconnect) PCB Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers AI Server HDI (high-density interconnect) PCB Product Location Distribution
3.4.2 Players AI Server HDI (high-density interconnect) PCB Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for AI Server HDI (high-density interconnect) PCB by Geographic Region
4.1 World Historic AI Server HDI (high-density interconnect) PCB Market Size by Geographic Region (2019-2024)
4.1.1 Global AI Server HDI (high-density interconnect) PCB Annual Sales by Geographic Region (2019-2024)
4.1.2 Global AI Server HDI (high-density interconnect) PCB Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic AI Server HDI (high-density interconnect) PCB Market Size by Country/Region (2019-2024)
4.2.1 Global AI Server HDI (high-density interconnect) PCB Annual Sales by Country/Region (2019-2024)
4.2.2 Global AI Server HDI (high-density interconnect) PCB Annual Revenue by Country/Region (2019-2024)
4.3 Americas AI Server HDI (high-density interconnect) PCB Sales Growth
4.4 APAC AI Server HDI (high-density interconnect) PCB Sales Growth
4.5 Europe AI Server HDI (high-density interconnect) PCB Sales Growth
4.6 Middle East & Africa AI Server HDI (high-density interconnect) PCB Sales Growth
5 Americas
5.1 Americas AI Server HDI (high-density interconnect) PCB Sales by Country
5.1.1 Americas AI Server HDI (high-density interconnect) PCB Sales by Country (2019-2024)
5.1.2 Americas AI Server HDI (high-density interconnect) PCB Revenue by Country (2019-2024)
5.2 Americas AI Server HDI (high-density interconnect) PCB Sales by Type (2019-2024)
5.3 Americas AI Server HDI (high-density interconnect) PCB Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC AI Server HDI (high-density interconnect) PCB Sales by Region
6.1.1 APAC AI Server HDI (high-density interconnect) PCB Sales by Region (2019-2024)
6.1.2 APAC AI Server HDI (high-density interconnect) PCB Revenue by Region (2019-2024)
6.2 APAC AI Server HDI (high-density interconnect) PCB Sales by Type (2019-2024)
6.3 APAC AI Server HDI (high-density interconnect) PCB Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe AI Server HDI (high-density interconnect) PCB by Country
7.1.1 Europe AI Server HDI (high-density interconnect) PCB Sales by Country (2019-2024)
7.1.2 Europe AI Server HDI (high-density interconnect) PCB Revenue by Country (2019-2024)
7.2 Europe AI Server HDI (high-density interconnect) PCB Sales by Type (2019-2024)
7.3 Europe AI Server HDI (high-density interconnect) PCB Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa AI Server HDI (high-density interconnect) PCB by Country
8.1.1 Middle East & Africa AI Server HDI (high-density interconnect) PCB Sales by Country (2019-2024)
8.1.2 Middle East & Africa AI Server HDI (high-density interconnect) PCB Revenue by Country (2019-2024)
8.2 Middle East & Africa AI Server HDI (high-density interconnect) PCB Sales by Type (2019-2024)
8.3 Middle East & Africa AI Server HDI (high-density interconnect) PCB Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of AI Server HDI (high-density interconnect) PCB
10.3 Manufacturing Process Analysis of AI Server HDI (high-density interconnect) PCB
10.4 Industry Chain Structure of AI Server HDI (high-density interconnect) PCB
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 AI Server HDI (high-density interconnect) PCB Distributors
11.3 AI Server HDI (high-density interconnect) PCB Customer
12 World Forecast Review for AI Server HDI (high-density interconnect) PCB by Geographic Region
12.1 Global AI Server HDI (high-density interconnect) PCB Market Size Forecast by Region
12.1.1 Global AI Server HDI (high-density interconnect) PCB Forecast by Region (2025-2030)
12.1.2 Global AI Server HDI (high-density interconnect) PCB Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global AI Server HDI (high-density interconnect) PCB Forecast by Type (2025-2030)
12.7 Global AI Server HDI (high-density interconnect) PCB Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Victory Giant Technology
13.1.1 Victory Giant Technology Company Information
13.1.2 Victory Giant Technology AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.1.3 Victory Giant Technology AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Victory Giant Technology Main Business Overview
13.1.5 Victory Giant Technology Latest Developments
13.2 Wus Printed Circuit
13.2.1 Wus Printed Circuit Company Information
13.2.2 Wus Printed Circuit AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.2.3 Wus Printed Circuit AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Wus Printed Circuit Main Business Overview
13.2.5 Wus Printed Circuit Latest Developments
13.3 GCE
13.3.1 GCE Company Information
13.3.2 GCE AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.3.3 GCE AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 GCE Main Business Overview
13.3.5 GCE Latest Developments
13.4 Unimicron
13.4.1 Unimicron Company Information
13.4.2 Unimicron AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.4.3 Unimicron AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Unimicron Main Business Overview
13.4.5 Unimicron Latest Developments
13.5 SCC
13.5.1 SCC Company Information
13.5.2 SCC AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.5.3 SCC AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 SCC Main Business Overview
13.5.5 SCC Latest Developments
13.6 Olympic Country
13.6.1 Olympic Country Company Information
13.6.2 Olympic Country AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.6.3 Olympic Country AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Olympic Country Main Business Overview
13.6.5 Olympic Country Latest Developments
13.7 Shengyi Technology
13.7.1 Shengyi Technology Company Information
13.7.2 Shengyi Technology AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.7.3 Shengyi Technology AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Shengyi Technology Main Business Overview
13.7.5 Shengyi Technology Latest Developments
13.8 Compeq Co
13.8.1 Compeq Co Company Information
13.8.2 Compeq Co AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.8.3 Compeq Co AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Compeq Co Main Business Overview
13.8.5 Compeq Co Latest Developments
13.9 Zhending
13.9.1 Zhending Company Information
13.9.2 Zhending AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.9.3 Zhending AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Zhending Main Business Overview
13.9.5 Zhending Latest Developments
13.10 HannStar Board
13.10.1 HannStar Board Company Information
13.10.2 HannStar Board AI Server HDI (high-density interconnect) PCB Product Portfolios and Specifications
13.10.3 HannStar Board AI Server HDI (high-density interconnect) PCB Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 HannStar Board Main Business Overview
13.10.5 HannStar Board Latest Developments
14 Research Findings and Conclusion
*If Applicable.
