Global Bonding Materials for The Semiconductor Market Growth 2024-2030

Publication ID:

LPI08250024

Publication Date:

August 26, 2024

Pages:

129

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Manufacturing (Chemicals) [2]

Chemicals [3]

Description:

Bonding materials for the semiconductor industry in this report refers to the products along this line 鈥渁dhesives for optical path link-up; ultra violet adhesives for precise fixing; die-attach adhesives; thermally conductive adhesives (Epoxy or Silicone); and adhesives for structural bonding鈥�.
The global Bonding Materials for The Semiconductor market size is projected to grow from US$ million in 2023 to US$ million in 2030; it is expected to grow at a CAGR of % from 2024 to 2030.
The 鈥淏onding Materials for The Semiconductor Industry Forecast鈥� looks at past sales and reviews total world Bonding Materials for The Semiconductor sales in 2023, providing a comprehensive analysis by region and market sector of projected Bonding Materials for The Semiconductor sales for 2024 through 2030. With Bonding Materials for The Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Bonding Materials for The Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Bonding Materials for The Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Bonding Materials for The Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Bonding Materials for The Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Bonding Materials for The Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Bonding Materials for The Semiconductor.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report presents a comprehensive overview, market shares, and growth opportunities of Bonding Materials for The Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by type
Adhesives for Optical Path Link-up
Ultra Violet Adhesives for Precise Fixing
Die-attach Adhesives
Thermally Conductive Adhesives
Structutal Bonding Adhesives
Segmentation by application
Encapsulation and General Potting
Heat Sink Bonding
Sensor Bonding
Magnet Bonding
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
NTTAT
AMS Technologies
Henkel
Dexerials
Dupont
DELO Addhesive
Permabond
Nagase Group (EMS)
Panacol Adhesives (Honle Group)
NAMICS
Creative Materials
NCTECH
Hernon Manufacturing
LORD (Parker)
DOW
3M
Key Questions Addressed in this Report
What is the 10-year outlook for the global Bonding Materials for The Semiconductor market?
What factors are driving Bonding Materials for The Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Bonding Materials for The Semiconductor market opportunities vary by end market size?
How does Bonding Materials for The Semiconductor break out type, application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Bonding Materials for The Semiconductor Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Bonding Materials for The Semiconductor by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Bonding Materials for The Semiconductor by Country/Region, 2019, 2023 & 2030
2.2 Bonding Materials for The Semiconductor Segment by Type
2.2.1 Adhesives for Optical Path Link-up
2.2.2 Ultra Violet Adhesives for Precise Fixing
2.2.3 Die-attach Adhesives
2.2.4 Thermally Conductive Adhesives
2.2.5 Structutal Bonding Adhesives
2.3 Bonding Materials for The Semiconductor Sales by Type
2.3.1 Global Bonding Materials for The Semiconductor Sales Market Share by Type (2019-2024)
2.3.2 Global Bonding Materials for The Semiconductor Revenue and Market Share by Type (2019-2024)
2.3.3 Global Bonding Materials for The Semiconductor Sale Price by Type (2019-2024)
2.4 Bonding Materials for The Semiconductor Segment by Application
2.4.1 Encapsulation and General Potting
2.4.2 Heat Sink Bonding
2.4.3 Sensor Bonding
2.4.4 Magnet Bonding
2.4.5 Others
2.5 Bonding Materials for The Semiconductor Sales by Application
2.5.1 Global Bonding Materials for The Semiconductor Sale Market Share by Application (2019-2024)
2.5.2 Global Bonding Materials for The Semiconductor Revenue and Market Share by Application (2019-2024)
2.5.3 Global Bonding Materials for The Semiconductor Sale Price by Application (2019-2024)
3 Global Bonding Materials for The Semiconductor by Company
3.1 Global Bonding Materials for The Semiconductor Breakdown Data by Company
3.1.1 Global Bonding Materials for The Semiconductor Annual Sales by Company (2019-2024)
3.1.2 Global Bonding Materials for The Semiconductor Sales Market Share by Company (2019-2024)
3.2 Global Bonding Materials for The Semiconductor Annual Revenue by Company (2019-2024)
3.2.1 Global Bonding Materials for The Semiconductor Revenue by Company (2019-2024)
3.2.2 Global Bonding Materials for The Semiconductor Revenue Market Share by Company (2019-2024)
3.3 Global Bonding Materials for The Semiconductor Sale Price by Company
3.4 Key Manufacturers Bonding Materials for The Semiconductor Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Bonding Materials for The Semiconductor Product Location Distribution
3.4.2 Players Bonding Materials for The Semiconductor Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for Bonding Materials for The Semiconductor by Geographic Region
4.1 World Historic Bonding Materials for The Semiconductor Market Size by Geographic Region (2019-2024)
4.1.1 Global Bonding Materials for The Semiconductor Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Bonding Materials for The Semiconductor Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Bonding Materials for The Semiconductor Market Size by Country/Region (2019-2024)
4.2.1 Global Bonding Materials for The Semiconductor Annual Sales by Country/Region (2019-2024)
4.2.2 Global Bonding Materials for The Semiconductor Annual Revenue by Country/Region (2019-2024)
4.3 Americas Bonding Materials for The Semiconductor Sales Growth
4.4 APAC Bonding Materials for The Semiconductor Sales Growth
4.5 Europe Bonding Materials for The Semiconductor Sales Growth
4.6 Middle East & Africa Bonding Materials for The Semiconductor Sales Growth
5 Americas
5.1 Americas Bonding Materials for The Semiconductor Sales by Country
5.1.1 Americas Bonding Materials for The Semiconductor Sales by Country (2019-2024)
5.1.2 Americas Bonding Materials for The Semiconductor Revenue by Country (2019-2024)
5.2 Americas Bonding Materials for The Semiconductor Sales by Type
5.3 Americas Bonding Materials for The Semiconductor Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Bonding Materials for The Semiconductor Sales by Region
6.1.1 APAC Bonding Materials for The Semiconductor Sales by Region (2019-2024)
6.1.2 APAC Bonding Materials for The Semiconductor Revenue by Region (2019-2024)
6.2 APAC Bonding Materials for The Semiconductor Sales by Type
6.3 APAC Bonding Materials for The Semiconductor Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Bonding Materials for The Semiconductor by Country
7.1.1 Europe Bonding Materials for The Semiconductor Sales by Country (2019-2024)
7.1.2 Europe Bonding Materials for The Semiconductor Revenue by Country (2019-2024)
7.2 Europe Bonding Materials for The Semiconductor Sales by Type
7.3 Europe Bonding Materials for The Semiconductor Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Bonding Materials for The Semiconductor by Country
8.1.1 Middle East & Africa Bonding Materials for The Semiconductor Sales by Country (2019-2024)
8.1.2 Middle East & Africa Bonding Materials for The Semiconductor Revenue by Country (2019-2024)
8.2 Middle East & Africa Bonding Materials for The Semiconductor Sales by Type
8.3 Middle East & Africa Bonding Materials for The Semiconductor Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Bonding Materials for The Semiconductor
10.3 Manufacturing Process Analysis of Bonding Materials for The Semiconductor
10.4 Industry Chain Structure of Bonding Materials for The Semiconductor
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Bonding Materials for The Semiconductor Distributors
11.3 Bonding Materials for The Semiconductor Customer
12 World Forecast Review for Bonding Materials for The Semiconductor by Geographic Region
12.1 Global Bonding Materials for The Semiconductor Market Size Forecast by Region
12.1.1 Global Bonding Materials for The Semiconductor Forecast by Region (2025-2030)
12.1.2 Global Bonding Materials for The Semiconductor Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global Bonding Materials for The Semiconductor Forecast by Type
12.7 Global Bonding Materials for The Semiconductor Forecast by Application
13 Key Players Analysis
13.1 NTTAT
13.1.1 NTTAT Company Information
13.1.2 NTTAT Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.1.3 NTTAT Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 NTTAT Main Business Overview
13.1.5 NTTAT Latest Developments
13.2 AMS Technologies
13.2.1 AMS Technologies Company Information
13.2.2 AMS Technologies Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.2.3 AMS Technologies Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 AMS Technologies Main Business Overview
13.2.5 AMS Technologies Latest Developments
13.3 Henkel
13.3.1 Henkel Company Information
13.3.2 Henkel Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.3.3 Henkel Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Henkel Main Business Overview
13.3.5 Henkel Latest Developments
13.4 Dexerials
13.4.1 Dexerials Company Information
13.4.2 Dexerials Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.4.3 Dexerials Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Dexerials Main Business Overview
13.4.5 Dexerials Latest Developments
13.5 Dupont
13.5.1 Dupont Company Information
13.5.2 Dupont Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.5.3 Dupont Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Dupont Main Business Overview
13.5.5 Dupont Latest Developments
13.6 DELO Addhesive
13.6.1 DELO Addhesive Company Information
13.6.2 DELO Addhesive Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.6.3 DELO Addhesive Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 DELO Addhesive Main Business Overview
13.6.5 DELO Addhesive Latest Developments
13.7 Permabond
13.7.1 Permabond Company Information
13.7.2 Permabond Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.7.3 Permabond Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Permabond Main Business Overview
13.7.5 Permabond Latest Developments
13.8 Nagase Group (EMS)
13.8.1 Nagase Group (EMS) Company Information
13.8.2 Nagase Group (EMS) Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.8.3 Nagase Group (EMS) Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Nagase Group (EMS) Main Business Overview
13.8.5 Nagase Group (EMS) Latest Developments
13.9 Panacol Adhesives (Honle Group)
13.9.1 Panacol Adhesives (Honle Group) Company Information
13.9.2 Panacol Adhesives (Honle Group) Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.9.3 Panacol Adhesives (Honle Group) Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Panacol Adhesives (Honle Group) Main Business Overview
13.9.5 Panacol Adhesives (Honle Group) Latest Developments
13.10 NAMICS
13.10.1 NAMICS Company Information
13.10.2 NAMICS Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.10.3 NAMICS Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 NAMICS Main Business Overview
13.10.5 NAMICS Latest Developments
13.11 Creative Materials
13.11.1 Creative Materials Company Information
13.11.2 Creative Materials Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.11.3 Creative Materials Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Creative Materials Main Business Overview
13.11.5 Creative Materials Latest Developments
13.12 NCTECH
13.12.1 NCTECH Company Information
13.12.2 NCTECH Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.12.3 NCTECH Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 NCTECH Main Business Overview
13.12.5 NCTECH Latest Developments
13.13 Hernon Manufacturing
13.13.1 Hernon Manufacturing Company Information
13.13.2 Hernon Manufacturing Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.13.3 Hernon Manufacturing Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 Hernon Manufacturing Main Business Overview
13.13.5 Hernon Manufacturing Latest Developments
13.14 LORD (Parker)
13.14.1 LORD (Parker) Company Information
13.14.2 LORD (Parker) Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.14.3 LORD (Parker) Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 LORD (Parker) Main Business Overview
13.14.5 LORD (Parker) Latest Developments
13.15 DOW
13.15.1 DOW Company Information
13.15.2 DOW Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.15.3 DOW Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 DOW Main Business Overview
13.15.5 DOW Latest Developments
13.16 3M
13.16.1 3M Company Information
13.16.2 3M Bonding Materials for The Semiconductor Product Portfolios and Specifications
13.16.3 3M Bonding Materials for The Semiconductor Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 3M Main Business Overview
13.16.5 3M Latest Developments
14 Research Findings and Conclusion

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