Global Chip Encapsulation Material Market Growth (Status and Outlook) 2025-2031

Publication ID:

LPI04253112

Publication Date:

April 25, 2025

Pages:

102

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Manufacturing (Chemicals) [2]

Chemicals [3]

Description:

The global Chip Encapsulation Material market size is predicted to grow from US$ 27540 million in 2025 to US$ 37180 million in 2031; it is expected to grow at a CAGR of 5.1% from 2025 to 2031.
Global key players of chip encapsulation material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, etc. Global top five manufacturers hold a share over 19%. In terms of product, substrate is the largest segment, with a share over 32%. And in terms of application, the largest application is consumer electronics, with a share over 35%.
The 鈥淐hip Encapsulation Material Industry Forecast鈥� looks at past sales and reviews total world Chip Encapsulation Material sales in 2024, providing a comprehensive analysis by region and market sector of projected Chip Encapsulation Material sales for 2025 through 2031. With Chip Encapsulation Material sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chip Encapsulation Material industry.
This Insight Report provides a comprehensive analysis of the global Chip Encapsulation Material landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Chip Encapsulation Material portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Chip Encapsulation Material market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chip Encapsulation Material and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chip Encapsulation Material.
This report presents a comprehensive overview, market shares, and growth opportunities of Chip Encapsulation Material market by product type, application, key players and key regions and countries.
Segmentation by Type:
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Segmentation by Application:
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Chip Encapsulation Material Market Size (2020-2031)
2.1.2 Chip Encapsulation Material Market Size CAGR by Region (2020 VS 2024 VS 2031)
2.1.3 World Current & Future Analysis for Chip Encapsulation Material by Country/Region (2020, 2024 & 2031)
2.2 Chip Encapsulation Material Segment by Type
2.2.1 Substrates
2.2.2 Lead Frame
2.2.3 Bonding Wires
2.2.4 Encapsulating Resin
2.2.5 Others
2.3 Chip Encapsulation Material Market Size by Type
2.3.1 Chip Encapsulation Material Market Size CAGR by Type (2020 VS 2024 VS 2031)
2.3.2 Global Chip Encapsulation Material Market Size Market Share by Type (2020-2025)
2.4 Chip Encapsulation Material Segment by Application
2.4.1 Consumer Electronics
2.4.2 Automotive Electronics
2.4.3 IT and Communication Industry
2.4.4 Others
2.5 Chip Encapsulation Material Market Size by Application
2.5.1 Chip Encapsulation Material Market Size CAGR by Application (2020 VS 2024 VS 2031)
2.5.2 Global Chip Encapsulation Material Market Size Market Share by Application (2020-2025)
3 Chip Encapsulation Material Market Size by Player
3.1 Chip Encapsulation Material Market Size Market Share by Player
3.1.1 Global Chip Encapsulation Material Revenue by Player (2020-2025)
3.1.2 Global Chip Encapsulation Material Revenue Market Share by Player (2020-2025)
3.2 Global Chip Encapsulation Material Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Chip Encapsulation Material by Region
4.1 Chip Encapsulation Material Market Size by Region (2020-2025)
4.2 Global Chip Encapsulation Material Annual Revenue by Country/Region (2020-2025)
4.3 Americas Chip Encapsulation Material Market Size Growth (2020-2025)
4.4 APAC Chip Encapsulation Material Market Size Growth (2020-2025)
4.5 Europe Chip Encapsulation Material Market Size Growth (2020-2025)
4.6 Middle East & Africa Chip Encapsulation Material Market Size Growth (2020-2025)
5 Americas
5.1 Americas Chip Encapsulation Material Market Size by Country (2020-2025)
5.2 Americas Chip Encapsulation Material Market Size by Type (2020-2025)
5.3 Americas Chip Encapsulation Material Market Size by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Chip Encapsulation Material Market Size by Region (2020-2025)
6.2 APAC Chip Encapsulation Material Market Size by Type (2020-2025)
6.3 APAC Chip Encapsulation Material Market Size by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Chip Encapsulation Material Market Size by Country (2020-2025)
7.2 Europe Chip Encapsulation Material Market Size by Type (2020-2025)
7.3 Europe Chip Encapsulation Material Market Size by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Chip Encapsulation Material by Region (2020-2025)
8.2 Middle East & Africa Chip Encapsulation Material Market Size by Type (2020-2025)
8.3 Middle East & Africa Chip Encapsulation Material Market Size by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global Chip Encapsulation Material Market Forecast
10.1 Global Chip Encapsulation Material Forecast by Region (2026-2031)
10.1.1 Global Chip Encapsulation Material Forecast by Region (2026-2031)
10.1.2 Americas Chip Encapsulation Material Forecast
10.1.3 APAC Chip Encapsulation Material Forecast
10.1.4 Europe Chip Encapsulation Material Forecast
10.1.5 Middle East & Africa Chip Encapsulation Material Forecast
10.2 Americas Chip Encapsulation Material Forecast by Country (2026-2031)
10.2.1 United States Market Chip Encapsulation Material Forecast
10.2.2 Canada Market Chip Encapsulation Material Forecast
10.2.3 Mexico Market Chip Encapsulation Material Forecast
10.2.4 Brazil Market Chip Encapsulation Material Forecast
10.3 APAC Chip Encapsulation Material Forecast by Region (2026-2031)
10.3.1 China Chip Encapsulation Material Market Forecast
10.3.2 Japan Market Chip Encapsulation Material Forecast
10.3.3 Korea Market Chip Encapsulation Material Forecast
10.3.4 Southeast Asia Market Chip Encapsulation Material Forecast
10.3.5 India Market Chip Encapsulation Material Forecast
10.3.6 Australia Market Chip Encapsulation Material Forecast
10.4 Europe Chip Encapsulation Material Forecast by Country (2026-2031)
10.4.1 Germany Market Chip Encapsulation Material Forecast
10.4.2 France Market Chip Encapsulation Material Forecast
10.4.3 UK Market Chip Encapsulation Material Forecast
10.4.4 Italy Market Chip Encapsulation Material Forecast
10.4.5 Russia Market Chip Encapsulation Material Forecast
10.5 Middle East & Africa Chip Encapsulation Material Forecast by Region (2026-2031)
10.5.1 Egypt Market Chip Encapsulation Material Forecast
10.5.2 South Africa Market Chip Encapsulation Material Forecast
10.5.3 Israel Market Chip Encapsulation Material Forecast
10.5.4 Turkey Market Chip Encapsulation Material Forecast
10.6 Global Chip Encapsulation Material Forecast by Type (2026-2031)
10.7 Global Chip Encapsulation Material Forecast by Application (2026-2031)
10.7.1 GCC Countries Market Chip Encapsulation Material Forecast
11 Key Players Analysis
11.1 Shennan Circuit Company Limited
11.1.1 Shennan Circuit Company Limited Company Information
11.1.2 Shennan Circuit Company Limited Chip Encapsulation Material Product Offered
11.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.1.4 Shennan Circuit Company Limited Main Business Overview
11.1.5 Shennan Circuit Company Limited Latest Developments
11.2 Xingsen Technology
11.2.1 Xingsen Technology Company Information
11.2.2 Xingsen Technology Chip Encapsulation Material Product Offered
11.2.3 Xingsen Technology Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.2.4 Xingsen Technology Main Business Overview
11.2.5 Xingsen Technology Latest Developments
11.3 Kangqiang Electronics
11.3.1 Kangqiang Electronics Company Information
11.3.2 Kangqiang Electronics Chip Encapsulation Material Product Offered
11.3.3 Kangqiang Electronics Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.3.4 Kangqiang Electronics Main Business Overview
11.3.5 Kangqiang Electronics Latest Developments
11.4 Kyocera
11.4.1 Kyocera Company Information
11.4.2 Kyocera Chip Encapsulation Material Product Offered
11.4.3 Kyocera Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.4.4 Kyocera Main Business Overview
11.4.5 Kyocera Latest Developments
11.5 Mitsui High-tec, Inc.
11.5.1 Mitsui High-tec, Inc. Company Information
11.5.2 Mitsui High-tec, Inc. Chip Encapsulation Material Product Offered
11.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.5.4 Mitsui High-tec, Inc. Main Business Overview
11.5.5 Mitsui High-tec, Inc. Latest Developments
11.6 Chang Wah Technology
11.6.1 Chang Wah Technology Company Information
11.6.2 Chang Wah Technology Chip Encapsulation Material Product Offered
11.6.3 Chang Wah Technology Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.6.4 Chang Wah Technology Main Business Overview
11.6.5 Chang Wah Technology Latest Developments
11.7 Panasonic
11.7.1 Panasonic Company Information
11.7.2 Panasonic Chip Encapsulation Material Product Offered
11.7.3 Panasonic Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.7.4 Panasonic Main Business Overview
11.7.5 Panasonic Latest Developments
11.8 Henkel
11.8.1 Henkel Company Information
11.8.2 Henkel Chip Encapsulation Material Product Offered
11.8.3 Henkel Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.8.4 Henkel Main Business Overview
11.8.5 Henkel Latest Developments
11.9 Sumitomo Bakelite
11.9.1 Sumitomo Bakelite Company Information
11.9.2 Sumitomo Bakelite Chip Encapsulation Material Product Offered
11.9.3 Sumitomo Bakelite Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.9.4 Sumitomo Bakelite Main Business Overview
11.9.5 Sumitomo Bakelite Latest Developments
11.10 Heraeus
11.10.1 Heraeus Company Information
11.10.2 Heraeus Chip Encapsulation Material Product Offered
11.10.3 Heraeus Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.10.4 Heraeus Main Business Overview
11.10.5 Heraeus Latest Developments
11.11 Tanaka
11.11.1 Tanaka Company Information
11.11.2 Tanaka Chip Encapsulation Material Product Offered
11.11.3 Tanaka Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2025)
11.11.4 Tanaka Main Business Overview
11.11.5 Tanaka Latest Developments
12 Research Findings and Conclusion

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