The global Chip Packaging market size was valued at US$ 30470 million in 2023. With growing demand in downstream market, the Chip Packaging is forecast to a readjusted size of US$ 48120 million by 2030 with a CAGR of 6.7% during review period.
The research report highlights the growth potential of the global Chip Packaging market. Chip Packaging are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Chip Packaging. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Chip Packaging market.
Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.
The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.
From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.
Key Features:
The report on Chip Packaging market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the Chip Packaging market. It may include historical data, market segmentation by Type (e.g., Traditional Packaging, Advanced Packaging), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Chip Packaging market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Chip Packaging market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Chip Packaging industry. This include advancements in Chip Packaging technology, Chip Packaging new entrants, Chip Packaging new investment, and other innovations that are shaping the future of Chip Packaging.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Chip Packaging market. It includes factors influencing customer ' purchasing decisions, preferences for Chip Packaging product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Chip Packaging market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Chip Packaging market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Chip Packaging market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Chip Packaging industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Chip Packaging market.
Market Segmentation:
Chip Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
Traditional Packaging
Advanced Packaging
Segmentation by application
Automotive and Traffic
Consumer Electronics
Communication
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Chip Packaging Market Size 2019-2030
2.1.2 Chip Packaging Market Size CAGR by Region 2019 VS 2023 VS 2030
2.2 Chip Packaging Segment by Type
2.2.1 Traditional Packaging
2.2.2 Advanced Packaging
2.3 Chip Packaging Market Size by Type
2.3.1 Chip Packaging Market Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Chip Packaging Market Size Market Share by Type (2019-2024)
2.4 Chip Packaging Segment by Application
2.4.1 Automotive and Traffic
2.4.2 Consumer Electronics
2.4.3 Communication
2.4.4 Other
2.5 Chip Packaging Market Size by Application
2.5.1 Chip Packaging Market Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Chip Packaging Market Size Market Share by Application (2019-2024)
3 Chip Packaging Market Size by Player
3.1 Chip Packaging Market Size Market Share by Players
3.1.1 Global Chip Packaging Revenue by Players (2019-2024)
3.1.2 Global Chip Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Chip Packaging Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Chip Packaging by Regions
4.1 Chip Packaging Market Size by Regions (2019-2024)
4.2 Americas Chip Packaging Market Size Growth (2019-2024)
4.3 APAC Chip Packaging Market Size Growth (2019-2024)
4.4 Europe Chip Packaging Market Size Growth (2019-2024)
4.5 Middle East & Africa Chip Packaging Market Size Growth (2019-2024)
5 Americas
5.1 Americas Chip Packaging Market Size by Country (2019-2024)
5.2 Americas Chip Packaging Market Size by Type (2019-2024)
5.3 Americas Chip Packaging Market Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Chip Packaging Market Size by Region (2019-2024)
6.2 APAC Chip Packaging Market Size by Type (2019-2024)
6.3 APAC Chip Packaging Market Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Chip Packaging by Country (2019-2024)
7.2 Europe Chip Packaging Market Size by Type (2019-2024)
7.3 Europe Chip Packaging Market Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Chip Packaging by Region (2019-2024)
8.2 Middle East & Africa Chip Packaging Market Size by Type (2019-2024)
8.3 Middle East & Africa Chip Packaging Market Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global Chip Packaging Market Forecast
10.1 Global Chip Packaging Forecast by Regions (2025-2030)
10.1.1 Global Chip Packaging Forecast by Regions (2025-2030)
10.1.2 Americas Chip Packaging Forecast
10.1.3 APAC Chip Packaging Forecast
10.1.4 Europe Chip Packaging Forecast
10.1.5 Middle East & Africa Chip Packaging Forecast
10.2 Americas Chip Packaging Forecast by Country (2025-2030)
10.2.1 United States Chip Packaging Market Forecast
10.2.2 Canada Chip Packaging Market Forecast
10.2.3 Mexico Chip Packaging Market Forecast
10.2.4 Brazil Chip Packaging Market Forecast
10.3 APAC Chip Packaging Forecast by Region (2025-2030)
10.3.1 China Chip Packaging Market Forecast
10.3.2 Japan Chip Packaging Market Forecast
10.3.3 Korea Chip Packaging Market Forecast
10.3.4 Southeast Asia Chip Packaging Market Forecast
10.3.5 India Chip Packaging Market Forecast
10.3.6 Australia Chip Packaging Market Forecast
10.4 Europe Chip Packaging Forecast by Country (2025-2030)
10.4.1 Germany Chip Packaging Market Forecast
10.4.2 France Chip Packaging Market Forecast
10.4.3 UK Chip Packaging Market Forecast
10.4.4 Italy Chip Packaging Market Forecast
10.4.5 Russia Chip Packaging Market Forecast
10.5 Middle East & Africa Chip Packaging Forecast by Region (2025-2030)
10.5.1 Egypt Chip Packaging Market Forecast
10.5.2 South Africa Chip Packaging Market Forecast
10.5.3 Israel Chip Packaging Market Forecast
10.5.4 Turkey Chip Packaging Market Forecast
10.5.5 GCC Countries Chip Packaging Market Forecast
10.6 Global Chip Packaging Forecast by Type (2025-2030)
10.7 Global Chip Packaging Forecast by Application (2025-2030)
11 Key Players Analysis
11.1 ASE Group
11.1.1 ASE Group Company Information
11.1.2 ASE Group Chip Packaging Product Offered
11.1.3 ASE Group Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.1.4 ASE Group Main Business Overview
11.1.5 ASE Group Latest Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Information
11.2.2 Amkor Technology Chip Packaging Product Offered
11.2.3 Amkor Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.2.4 Amkor Technology Main Business Overview
11.2.5 Amkor Technology Latest Developments
11.3 JCET
11.3.1 JCET Company Information
11.3.2 JCET Chip Packaging Product Offered
11.3.3 JCET Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.3.4 JCET Main Business Overview
11.3.5 JCET Latest Developments
11.4 Siliconware Precision Industries
11.4.1 Siliconware Precision Industries Company Information
11.4.2 Siliconware Precision Industries Chip Packaging Product Offered
11.4.3 Siliconware Precision Industries Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.4.4 Siliconware Precision Industries Main Business Overview
11.4.5 Siliconware Precision Industries Latest Developments
11.5 Powertech Technology
11.5.1 Powertech Technology Company Information
11.5.2 Powertech Technology Chip Packaging Product Offered
11.5.3 Powertech Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.5.4 Powertech Technology Main Business Overview
11.5.5 Powertech Technology Latest Developments
11.6 TongFu Microelectronics
11.6.1 TongFu Microelectronics Company Information
11.6.2 TongFu Microelectronics Chip Packaging Product Offered
11.6.3 TongFu Microelectronics Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.6.4 TongFu Microelectronics Main Business Overview
11.6.5 TongFu Microelectronics Latest Developments
11.7 Tianshui Huatian Technology
11.7.1 Tianshui Huatian Technology Company Information
11.7.2 Tianshui Huatian Technology Chip Packaging Product Offered
11.7.3 Tianshui Huatian Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.7.4 Tianshui Huatian Technology Main Business Overview
11.7.5 Tianshui Huatian Technology Latest Developments
11.8 UTAC
11.8.1 UTAC Company Information
11.8.2 UTAC Chip Packaging Product Offered
11.8.3 UTAC Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.8.4 UTAC Main Business Overview
11.8.5 UTAC Latest Developments
11.9 Chipbond Technology
11.9.1 Chipbond Technology Company Information
11.9.2 Chipbond Technology Chip Packaging Product Offered
11.9.3 Chipbond Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.9.4 Chipbond Technology Main Business Overview
11.9.5 Chipbond Technology Latest Developments
11.10 Hana Micron
11.10.1 Hana Micron Company Information
11.10.2 Hana Micron Chip Packaging Product Offered
11.10.3 Hana Micron Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.10.4 Hana Micron Main Business Overview
11.10.5 Hana Micron Latest Developments
11.11 OSE
11.11.1 OSE Company Information
11.11.2 OSE Chip Packaging Product Offered
11.11.3 OSE Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.11.4 OSE Main Business Overview
11.11.5 OSE Latest Developments
11.12 Walton Advanced Engineering
11.12.1 Walton Advanced Engineering Company Information
11.12.2 Walton Advanced Engineering Chip Packaging Product Offered
11.12.3 Walton Advanced Engineering Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.12.4 Walton Advanced Engineering Main Business Overview
11.12.5 Walton Advanced Engineering Latest Developments
11.13 NEPES
11.13.1 NEPES Company Information
11.13.2 NEPES Chip Packaging Product Offered
11.13.3 NEPES Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.13.4 NEPES Main Business Overview
11.13.5 NEPES Latest Developments
11.14 Unisem
11.14.1 Unisem Company Information
11.14.2 Unisem Chip Packaging Product Offered
11.14.3 Unisem Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.14.4 Unisem Main Business Overview
11.14.5 Unisem Latest Developments
11.15 ChipMOS
11.15.1 ChipMOS Company Information
11.15.2 ChipMOS Chip Packaging Product Offered
11.15.3 ChipMOS Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.15.4 ChipMOS Main Business Overview
11.15.5 ChipMOS Latest Developments
11.16 Signetics
11.16.1 Signetics Company Information
11.16.2 Signetics Chip Packaging Product Offered
11.16.3 Signetics Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.16.4 Signetics Main Business Overview
11.16.5 Signetics Latest Developments
11.17 Carsem
11.17.1 Carsem Company Information
11.17.2 Carsem Chip Packaging Product Offered
11.17.3 Carsem Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.17.4 Carsem Main Business Overview
11.17.5 Carsem Latest Developments
11.18 King Yuan ELECTRONICS
11.18.1 King Yuan ELECTRONICS Company Information
11.18.2 King Yuan ELECTRONICS Chip Packaging Product Offered
11.18.3 King Yuan ELECTRONICS Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.18.4 King Yuan ELECTRONICS Main Business Overview
11.18.5 King Yuan ELECTRONICS Latest Developments
12 Research Findings and Conclusion
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*If Applicable.
