The global Chip Scale Package (CSP) market size was valued at US$ million in 2023. With growing demand in downstream market, the Chip Scale Package (CSP) is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during review period.
The research report highlights the growth potential of the global Chip Scale Package (CSP) market. Chip Scale Package (CSP) are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Chip Scale Package (CSP). Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Chip Scale Package (CSP) market.
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Key Features:
The report on Chip Scale Package (CSP) market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the Chip Scale Package (CSP) market. It may include historical data, market segmentation by Type (e.g., Traditional Packaging, Advanced Packaging), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Chip Scale Package (CSP) market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Chip Scale Package (CSP) market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Chip Scale Package (CSP) industry. This include advancements in Chip Scale Package (CSP) technology, Chip Scale Package (CSP) new entrants, Chip Scale Package (CSP) new investment, and other innovations that are shaping the future of Chip Scale Package (CSP).
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Chip Scale Package (CSP) market. It includes factors influencing customer ' purchasing decisions, preferences for Chip Scale Package (CSP) product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Chip Scale Package (CSP) market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Chip Scale Package (CSP) market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Chip Scale Package (CSP) market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Chip Scale Package (CSP) industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Chip Scale Package (CSP) market.
Market Segmentation:
Chip Scale Package (CSP) market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
Traditional Packaging
Advanced Packaging
Segmentation by application
Automotive and Traffic
Consumer Electronics
Communication
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Group
Amkor Technology
JCET
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Chip Scale Package (CSP) Market Size 2019-2030
2.1.2 Chip Scale Package (CSP) Market Size CAGR by Region 2019 VS 2023 VS 2030
2.2 Chip Scale Package (CSP) Segment by Type
2.2.1 Traditional Packaging
2.2.2 Advanced Packaging
2.3 Chip Scale Package (CSP) Market Size by Type
2.3.1 Chip Scale Package (CSP) Market Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Chip Scale Package (CSP) Market Size Market Share by Type (2019-2024)
2.4 Chip Scale Package (CSP) Segment by Application
2.4.1 Automotive and Traffic
2.4.2 Consumer Electronics
2.4.3 Communication
2.4.4 Other
2.5 Chip Scale Package (CSP) Market Size by Application
2.5.1 Chip Scale Package (CSP) Market Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Chip Scale Package (CSP) Market Size Market Share by Application (2019-2024)
3 Chip Scale Package (CSP) Market Size by Player
3.1 Chip Scale Package (CSP) Market Size Market Share by Players
3.1.1 Global Chip Scale Package (CSP) Revenue by Players (2019-2024)
3.1.2 Global Chip Scale Package (CSP) Revenue Market Share by Players (2019-2024)
3.2 Global Chip Scale Package (CSP) Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Chip Scale Package (CSP) by Regions
4.1 Chip Scale Package (CSP) Market Size by Regions (2019-2024)
4.2 Americas Chip Scale Package (CSP) Market Size Growth (2019-2024)
4.3 APAC Chip Scale Package (CSP) Market Size Growth (2019-2024)
4.4 Europe Chip Scale Package (CSP) Market Size Growth (2019-2024)
4.5 Middle East & Africa Chip Scale Package (CSP) Market Size Growth (2019-2024)
5 Americas
5.1 Americas Chip Scale Package (CSP) Market Size by Country (2019-2024)
5.2 Americas Chip Scale Package (CSP) Market Size by Type (2019-2024)
5.3 Americas Chip Scale Package (CSP) Market Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Chip Scale Package (CSP) Market Size by Region (2019-2024)
6.2 APAC Chip Scale Package (CSP) Market Size by Type (2019-2024)
6.3 APAC Chip Scale Package (CSP) Market Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Chip Scale Package (CSP) by Country (2019-2024)
7.2 Europe Chip Scale Package (CSP) Market Size by Type (2019-2024)
7.3 Europe Chip Scale Package (CSP) Market Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Chip Scale Package (CSP) by Region (2019-2024)
8.2 Middle East & Africa Chip Scale Package (CSP) Market Size by Type (2019-2024)
8.3 Middle East & Africa Chip Scale Package (CSP) Market Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global Chip Scale Package (CSP) Market Forecast
10.1 Global Chip Scale Package (CSP) Forecast by Regions (2025-2030)
10.1.1 Global Chip Scale Package (CSP) Forecast by Regions (2025-2030)
10.1.2 Americas Chip Scale Package (CSP) Forecast
10.1.3 APAC Chip Scale Package (CSP) Forecast
10.1.4 Europe Chip Scale Package (CSP) Forecast
10.1.5 Middle East & Africa Chip Scale Package (CSP) Forecast
10.2 Americas Chip Scale Package (CSP) Forecast by Country (2025-2030)
10.2.1 United States Chip Scale Package (CSP) Market Forecast
10.2.2 Canada Chip Scale Package (CSP) Market Forecast
10.2.3 Mexico Chip Scale Package (CSP) Market Forecast
10.2.4 Brazil Chip Scale Package (CSP) Market Forecast
10.3 APAC Chip Scale Package (CSP) Forecast by Region (2025-2030)
10.3.1 China Chip Scale Package (CSP) Market Forecast
10.3.2 Japan Chip Scale Package (CSP) Market Forecast
10.3.3 Korea Chip Scale Package (CSP) Market Forecast
10.3.4 Southeast Asia Chip Scale Package (CSP) Market Forecast
10.3.5 India Chip Scale Package (CSP) Market Forecast
10.3.6 Australia Chip Scale Package (CSP) Market Forecast
10.4 Europe Chip Scale Package (CSP) Forecast by Country (2025-2030)
10.4.1 Germany Chip Scale Package (CSP) Market Forecast
10.4.2 France Chip Scale Package (CSP) Market Forecast
10.4.3 UK Chip Scale Package (CSP) Market Forecast
10.4.4 Italy Chip Scale Package (CSP) Market Forecast
10.4.5 Russia Chip Scale Package (CSP) Market Forecast
10.5 Middle East & Africa Chip Scale Package (CSP) Forecast by Region (2025-2030)
10.5.1 Egypt Chip Scale Package (CSP) Market Forecast
10.5.2 South Africa Chip Scale Package (CSP) Market Forecast
10.5.3 Israel Chip Scale Package (CSP) Market Forecast
10.5.4 Turkey Chip Scale Package (CSP) Market Forecast
10.5.5 GCC Countries Chip Scale Package (CSP) Market Forecast
10.6 Global Chip Scale Package (CSP) Forecast by Type (2025-2030)
10.7 Global Chip Scale Package (CSP) Forecast by Application (2025-2030)
11 Key Players Analysis
11.1 ASE Group
11.1.1 ASE Group Company Information
11.1.2 ASE Group Chip Scale Package (CSP) Product Offered
11.1.3 ASE Group Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.1.4 ASE Group Main Business Overview
11.1.5 ASE Group Latest Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Information
11.2.2 Amkor Technology Chip Scale Package (CSP) Product Offered
11.2.3 Amkor Technology Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.2.4 Amkor Technology Main Business Overview
11.2.5 Amkor Technology Latest Developments
11.3 JCET
11.3.1 JCET Company Information
11.3.2 JCET Chip Scale Package (CSP) Product Offered
11.3.3 JCET Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.3.4 JCET Main Business Overview
11.3.5 JCET Latest Developments
11.4 Powertech Technology
11.4.1 Powertech Technology Company Information
11.4.2 Powertech Technology Chip Scale Package (CSP) Product Offered
11.4.3 Powertech Technology Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.4.4 Powertech Technology Main Business Overview
11.4.5 Powertech Technology Latest Developments
11.5 TongFu Microelectronics
11.5.1 TongFu Microelectronics Company Information
11.5.2 TongFu Microelectronics Chip Scale Package (CSP) Product Offered
11.5.3 TongFu Microelectronics Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.5.4 TongFu Microelectronics Main Business Overview
11.5.5 TongFu Microelectronics Latest Developments
11.6 Tianshui Huatian Technology
11.6.1 Tianshui Huatian Technology Company Information
11.6.2 Tianshui Huatian Technology Chip Scale Package (CSP) Product Offered
11.6.3 Tianshui Huatian Technology Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.6.4 Tianshui Huatian Technology Main Business Overview
11.6.5 Tianshui Huatian Technology Latest Developments
11.7 UTAC
11.7.1 UTAC Company Information
11.7.2 UTAC Chip Scale Package (CSP) Product Offered
11.7.3 UTAC Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.7.4 UTAC Main Business Overview
11.7.5 UTAC Latest Developments
11.8 Chipbond Technology
11.8.1 Chipbond Technology Company Information
11.8.2 Chipbond Technology Chip Scale Package (CSP) Product Offered
11.8.3 Chipbond Technology Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.8.4 Chipbond Technology Main Business Overview
11.8.5 Chipbond Technology Latest Developments
11.9 Hana Micron
11.9.1 Hana Micron Company Information
11.9.2 Hana Micron Chip Scale Package (CSP) Product Offered
11.9.3 Hana Micron Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.9.4 Hana Micron Main Business Overview
11.9.5 Hana Micron Latest Developments
11.10 OSE
11.10.1 OSE Company Information
11.10.2 OSE Chip Scale Package (CSP) Product Offered
11.10.3 OSE Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.10.4 OSE Main Business Overview
11.10.5 OSE Latest Developments
11.11 Walton Advanced Engineering
11.11.1 Walton Advanced Engineering Company Information
11.11.2 Walton Advanced Engineering Chip Scale Package (CSP) Product Offered
11.11.3 Walton Advanced Engineering Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.11.4 Walton Advanced Engineering Main Business Overview
11.11.5 Walton Advanced Engineering Latest Developments
11.12 NEPES
11.12.1 NEPES Company Information
11.12.2 NEPES Chip Scale Package (CSP) Product Offered
11.12.3 NEPES Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.12.4 NEPES Main Business Overview
11.12.5 NEPES Latest Developments
11.13 Unisem
11.13.1 Unisem Company Information
11.13.2 Unisem Chip Scale Package (CSP) Product Offered
11.13.3 Unisem Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.13.4 Unisem Main Business Overview
11.13.5 Unisem Latest Developments
11.14 ChipMOS
11.14.1 ChipMOS Company Information
11.14.2 ChipMOS Chip Scale Package (CSP) Product Offered
11.14.3 ChipMOS Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.14.4 ChipMOS Main Business Overview
11.14.5 ChipMOS Latest Developments
11.15 Signetics
11.15.1 Signetics Company Information
11.15.2 Signetics Chip Scale Package (CSP) Product Offered
11.15.3 Signetics Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.15.4 Signetics Main Business Overview
11.15.5 Signetics Latest Developments
11.16 Carsem
11.16.1 Carsem Company Information
11.16.2 Carsem Chip Scale Package (CSP) Product Offered
11.16.3 Carsem Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.16.4 Carsem Main Business Overview
11.16.5 Carsem Latest Developments
11.17 King Yuan ELECTRONICS
11.17.1 King Yuan ELECTRONICS Company Information
11.17.2 King Yuan ELECTRONICS Chip Scale Package (CSP) Product Offered
11.17.3 King Yuan ELECTRONICS Chip Scale Package (CSP) Revenue, Gross Margin and Market Share (2019-2024)
11.17.4 King Yuan ELECTRONICS Main Business Overview
11.17.5 King Yuan ELECTRONICS Latest Developments
12 Research Findings and Conclusion
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*If Applicable.
