Global Fan-out Panel-level Packaging Market Growth (Status and Outlook) 2024-2030

Publication ID:

LPI03247797

Publication Date:

March 26, 2024

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

IT Services [2]

Software [3]

Computing & Electronics [4]

Description:

The global Fan-out Panel-level Packaging market size was valued at US$ 1340 million in 2023. With growing demand in downstream market, the Fan-out Panel-level Packaging is forecast to a readjusted size of US$ 4925 million by 2030 with a CAGR of 20.4% during review period.
The research report highlights the growth potential of the global Fan-out Panel-level Packaging market. Fan-out Panel-level Packaging are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Fan-out Panel-level Packaging. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Fan-out Panel-level Packaging market.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Key Features:
The report on Fan-out Panel-level Packaging market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the Fan-out Panel-level Packaging market. It may include historical data, market segmentation by Type (e.g., System-in-package (SiP), Heterogeneous Integration), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Fan-out Panel-level Packaging market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Fan-out Panel-level Packaging market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Fan-out Panel-level Packaging industry. This include advancements in Fan-out Panel-level Packaging technology, Fan-out Panel-level Packaging new entrants, Fan-out Panel-level Packaging new investment, and other innovations that are shaping the future of Fan-out Panel-level Packaging.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Fan-out Panel-level Packaging market. It includes factors influencing customer ' purchasing decisions, preferences for Fan-out Panel-level Packaging product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Fan-out Panel-level Packaging market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Fan-out Panel-level Packaging market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Fan-out Panel-level Packaging market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Fan-out Panel-level Packaging industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Fan-out Panel-level Packaging market.
Market Segmentation:
Fan-out Panel-level Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
System-in-package (SiP)
Heterogeneous Integration
Segmentation by application
Wireless Devices
Power Management Units
Radar Devices
Processing Units
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Amkor Technology
Deca Technologies
Lam Research Corporation
Qualcomm Technologies
Siliconware Precision Industries
SPTS Technologies
STATS ChipPAC
Samsung
TSMC

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Fan-out Panel-level Packaging Market Size 2019-2030
2.1.2 Fan-out Panel-level Packaging Market Size CAGR by Region 2019 VS 2023 VS 2030
2.2 Fan-out Panel-level Packaging Segment by Type
2.2.1 System-in-package (SiP)
2.2.2 Heterogeneous Integration
2.3 Fan-out Panel-level Packaging Market Size by Type
2.3.1 Fan-out Panel-level Packaging Market Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Fan-out Panel-level Packaging Market Size Market Share by Type (2019-2024)
2.4 Fan-out Panel-level Packaging Segment by Application
2.4.1 Wireless Devices
2.4.2 Power Management Units
2.4.3 Radar Devices
2.4.4 Processing Units
2.4.5 Others
2.5 Fan-out Panel-level Packaging Market Size by Application
2.5.1 Fan-out Panel-level Packaging Market Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Fan-out Panel-level Packaging Market Size Market Share by Application (2019-2024)
3 Fan-out Panel-level Packaging Market Size by Player
3.1 Fan-out Panel-level Packaging Market Size Market Share by Players
3.1.1 Global Fan-out Panel-level Packaging Revenue by Players (2019-2024)
3.1.2 Global Fan-out Panel-level Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Fan-out Panel-level Packaging Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Fan-out Panel-level Packaging by Regions
4.1 Fan-out Panel-level Packaging Market Size by Regions (2019-2024)
4.2 Americas Fan-out Panel-level Packaging Market Size Growth (2019-2024)
4.3 APAC Fan-out Panel-level Packaging Market Size Growth (2019-2024)
4.4 Europe Fan-out Panel-level Packaging Market Size Growth (2019-2024)
4.5 Middle East & Africa Fan-out Panel-level Packaging Market Size Growth (2019-2024)
5 Americas
5.1 Americas Fan-out Panel-level Packaging Market Size by Country (2019-2024)
5.2 Americas Fan-out Panel-level Packaging Market Size by Type (2019-2024)
5.3 Americas Fan-out Panel-level Packaging Market Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Fan-out Panel-level Packaging Market Size by Region (2019-2024)
6.2 APAC Fan-out Panel-level Packaging Market Size by Type (2019-2024)
6.3 APAC Fan-out Panel-level Packaging Market Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Fan-out Panel-level Packaging by Country (2019-2024)
7.2 Europe Fan-out Panel-level Packaging Market Size by Type (2019-2024)
7.3 Europe Fan-out Panel-level Packaging Market Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Fan-out Panel-level Packaging by Region (2019-2024)
8.2 Middle East & Africa Fan-out Panel-level Packaging Market Size by Type (2019-2024)
8.3 Middle East & Africa Fan-out Panel-level Packaging Market Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global Fan-out Panel-level Packaging Market Forecast
10.1 Global Fan-out Panel-level Packaging Forecast by Regions (2025-2030)
10.1.1 Global Fan-out Panel-level Packaging Forecast by Regions (2025-2030)
10.1.2 Americas Fan-out Panel-level Packaging Forecast
10.1.3 APAC Fan-out Panel-level Packaging Forecast
10.1.4 Europe Fan-out Panel-level Packaging Forecast
10.1.5 Middle East & Africa Fan-out Panel-level Packaging Forecast
10.2 Americas Fan-out Panel-level Packaging Forecast by Country (2025-2030)
10.2.1 United States Fan-out Panel-level Packaging Market Forecast
10.2.2 Canada Fan-out Panel-level Packaging Market Forecast
10.2.3 Mexico Fan-out Panel-level Packaging Market Forecast
10.2.4 Brazil Fan-out Panel-level Packaging Market Forecast
10.3 APAC Fan-out Panel-level Packaging Forecast by Region (2025-2030)
10.3.1 China Fan-out Panel-level Packaging Market Forecast
10.3.2 Japan Fan-out Panel-level Packaging Market Forecast
10.3.3 Korea Fan-out Panel-level Packaging Market Forecast
10.3.4 Southeast Asia Fan-out Panel-level Packaging Market Forecast
10.3.5 India Fan-out Panel-level Packaging Market Forecast
10.3.6 Australia Fan-out Panel-level Packaging Market Forecast
10.4 Europe Fan-out Panel-level Packaging Forecast by Country (2025-2030)
10.4.1 Germany Fan-out Panel-level Packaging Market Forecast
10.4.2 France Fan-out Panel-level Packaging Market Forecast
10.4.3 UK Fan-out Panel-level Packaging Market Forecast
10.4.4 Italy Fan-out Panel-level Packaging Market Forecast
10.4.5 Russia Fan-out Panel-level Packaging Market Forecast
10.5 Middle East & Africa Fan-out Panel-level Packaging Forecast by Region (2025-2030)
10.5.1 Egypt Fan-out Panel-level Packaging Market Forecast
10.5.2 South Africa Fan-out Panel-level Packaging Market Forecast
10.5.3 Israel Fan-out Panel-level Packaging Market Forecast
10.5.4 Turkey Fan-out Panel-level Packaging Market Forecast
10.5.5 GCC Countries Fan-out Panel-level Packaging Market Forecast
10.6 Global Fan-out Panel-level Packaging Forecast by Type (2025-2030)
10.7 Global Fan-out Panel-level Packaging Forecast by Application (2025-2030)

11 Key Players Analysis
11.1 Amkor Technology
11.1.1 Amkor Technology Company Information
11.1.2 Amkor Technology Fan-out Panel-level Packaging Product Offered
11.1.3 Amkor Technology Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.1.4 Amkor Technology Main Business Overview
11.1.5 Amkor Technology Latest Developments
11.2 Deca Technologies
11.2.1 Deca Technologies Company Information
11.2.2 Deca Technologies Fan-out Panel-level Packaging Product Offered
11.2.3 Deca Technologies Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.2.4 Deca Technologies Main Business Overview
11.2.5 Deca Technologies Latest Developments
11.3 Lam Research Corporation
11.3.1 Lam Research Corporation Company Information
11.3.2 Lam Research Corporation Fan-out Panel-level Packaging Product Offered
11.3.3 Lam Research Corporation Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.3.4 Lam Research Corporation Main Business Overview
11.3.5 Lam Research Corporation Latest Developments
11.4 Qualcomm Technologies
11.4.1 Qualcomm Technologies Company Information
11.4.2 Qualcomm Technologies Fan-out Panel-level Packaging Product Offered
11.4.3 Qualcomm Technologies Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.4.4 Qualcomm Technologies Main Business Overview
11.4.5 Qualcomm Technologies Latest Developments
11.5 Siliconware Precision Industries
11.5.1 Siliconware Precision Industries Company Information
11.5.2 Siliconware Precision Industries Fan-out Panel-level Packaging Product Offered
11.5.3 Siliconware Precision Industries Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.5.4 Siliconware Precision Industries Main Business Overview
11.5.5 Siliconware Precision Industries Latest Developments
11.6 SPTS Technologies
11.6.1 SPTS Technologies Company Information
11.6.2 SPTS Technologies Fan-out Panel-level Packaging Product Offered
11.6.3 SPTS Technologies Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.6.4 SPTS Technologies Main Business Overview
11.6.5 SPTS Technologies Latest Developments
11.7 STATS ChipPAC
11.7.1 STATS ChipPAC Company Information
11.7.2 STATS ChipPAC Fan-out Panel-level Packaging Product Offered
11.7.3 STATS ChipPAC Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.7.4 STATS ChipPAC Main Business Overview
11.7.5 STATS ChipPAC Latest Developments
11.8 Samsung
11.8.1 Samsung Company Information
11.8.2 Samsung Fan-out Panel-level Packaging Product Offered
11.8.3 Samsung Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.8.4 Samsung Main Business Overview
11.8.5 Samsung Latest Developments
11.9 TSMC
11.9.1 TSMC Company Information
11.9.2 TSMC Fan-out Panel-level Packaging Product Offered
11.9.3 TSMC Fan-out Panel-level Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.9.4 TSMC Main Business Overview
11.9.5 TSMC Latest Developments
12 Research Findings and Conclusion

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