

The flat high speed die bonder is a device used for semiconductor packaging. It is used to solidify the combination of semiconductor chips and packaging glue to ensure a strong connection and stability between the chip and the package. The flat high speed die bonder has the characteristics of high-speed solidification, planar design, high-precision control, automation, and good adaptability, and is widely used in the field of semiconductor packaging.
The global Flat High Speed Die Bonder market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The “Flat High Speed Die Bonder Industry Forecast” looks at past sales and reviews total world Flat High Speed Die Bonder sales in 2023, providing a comprehensive analysis by region and market sector of projected Flat High Speed Die Bonder sales for 2024 through 2030. With Flat High Speed Die Bonder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Flat High Speed Die Bonder industry.
This Insight Report provides a comprehensive analysis of the global Flat High Speed Die Bonder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Flat High Speed Die Bonder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Flat High Speed Die Bonder market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Flat High Speed Die Bonder and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Flat High Speed Die Bonder.
United States market for Flat High Speed Die Bonder is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Flat High Speed Die Bonder is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Flat High Speed Die Bonder is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Flat High Speed Die Bonder players cover ASM International NV, Besi, MRSI Systems, Yamaha Robotics Holdings, AKIM Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Flat High Speed Die Bonder market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Single Head
Double Head
Six Head
Segmentation by Application:
LED
COB
Filament
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASM International NV
Besi
MRSI Systems
Yamaha Robotics Holdings
AKIM Corporation
ASMPT
ITEC
Tresky GmbH
People and Technology
Toray Engineering
Kulicke & Soffa
Fasford Technology
QUICK INTELLIGENT EQUIPMENT
Jongshiann Enterprise
Suzhou Yimeide Technology
Shenzhen Xinyichang Technology
Shenzhen Jiasite Photoelectric Equipment
Key Questions Addressed in this Report
What is the 10-year outlook for the global Flat High Speed Die Bonder market?
What factors are driving Flat High Speed Die Bonder market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Flat High Speed Die Bonder market opportunities vary by end market size?
How does Flat High Speed Die Bonder break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Flat High Speed Die Bonder Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Flat High Speed Die Bonder by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Flat High Speed Die Bonder by Country/Region, 2019, 2023 & 2030
2.2 Flat High Speed Die Bonder Segment by Type
2.2.1 Single Head
2.2.2 Double Head
2.2.3 Six Head
2.3 Flat High Speed Die Bonder Sales by Type
2.3.1 Global Flat High Speed Die Bonder Sales Market Share by Type (2019-2024)
2.3.2 Global Flat High Speed Die Bonder Revenue and Market Share by Type (2019-2024)
2.3.3 Global Flat High Speed Die Bonder Sale Price by Type (2019-2024)
2.4 Flat High Speed Die Bonder Segment by Application
2.4.1 LED
2.4.2 COB
2.4.3 Filament
2.4.4 Others
2.5 Flat High Speed Die Bonder Sales by Application
2.5.1 Global Flat High Speed Die Bonder Sale Market Share by Application (2019-2024)
2.5.2 Global Flat High Speed Die Bonder Revenue and Market Share by Application (2019-2024)
2.5.3 Global Flat High Speed Die Bonder Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Flat High Speed Die Bonder Breakdown Data by Company
3.1.1 Global Flat High Speed Die Bonder Annual Sales by Company (2019-2024)
3.1.2 Global Flat High Speed Die Bonder Sales Market Share by Company (2019-2024)
3.2 Global Flat High Speed Die Bonder Annual Revenue by Company (2019-2024)
3.2.1 Global Flat High Speed Die Bonder Revenue by Company (2019-2024)
3.2.2 Global Flat High Speed Die Bonder Revenue Market Share by Company (2019-2024)
3.3 Global Flat High Speed Die Bonder Sale Price by Company
3.4 Key Manufacturers Flat High Speed Die Bonder Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Flat High Speed Die Bonder Product Location Distribution
3.4.2 Players Flat High Speed Die Bonder Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Flat High Speed Die Bonder by Geographic Region
4.1 World Historic Flat High Speed Die Bonder Market Size by Geographic Region (2019-2024)
4.1.1 Global Flat High Speed Die Bonder Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Flat High Speed Die Bonder Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Flat High Speed Die Bonder Market Size by Country/Region (2019-2024)
4.2.1 Global Flat High Speed Die Bonder Annual Sales by Country/Region (2019-2024)
4.2.2 Global Flat High Speed Die Bonder Annual Revenue by Country/Region (2019-2024)
4.3 Americas Flat High Speed Die Bonder Sales Growth
4.4 APAC Flat High Speed Die Bonder Sales Growth
4.5 Europe Flat High Speed Die Bonder Sales Growth
4.6 Middle East & Africa Flat High Speed Die Bonder Sales Growth
5 Americas
5.1 Americas Flat High Speed Die Bonder Sales by Country
5.1.1 Americas Flat High Speed Die Bonder Sales by Country (2019-2024)
5.1.2 Americas Flat High Speed Die Bonder Revenue by Country (2019-2024)
5.2 Americas Flat High Speed Die Bonder Sales by Type (2019-2024)
5.3 Americas Flat High Speed Die Bonder Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Flat High Speed Die Bonder Sales by Region
6.1.1 APAC Flat High Speed Die Bonder Sales by Region (2019-2024)
6.1.2 APAC Flat High Speed Die Bonder Revenue by Region (2019-2024)
6.2 APAC Flat High Speed Die Bonder Sales by Type (2019-2024)
6.3 APAC Flat High Speed Die Bonder Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Flat High Speed Die Bonder by Country
7.1.1 Europe Flat High Speed Die Bonder Sales by Country (2019-2024)
7.1.2 Europe Flat High Speed Die Bonder Revenue by Country (2019-2024)
7.2 Europe Flat High Speed Die Bonder Sales by Type (2019-2024)
7.3 Europe Flat High Speed Die Bonder Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Flat High Speed Die Bonder by Country
8.1.1 Middle East & Africa Flat High Speed Die Bonder Sales by Country (2019-2024)
8.1.2 Middle East & Africa Flat High Speed Die Bonder Revenue by Country (2019-2024)
8.2 Middle East & Africa Flat High Speed Die Bonder Sales by Type (2019-2024)
8.3 Middle East & Africa Flat High Speed Die Bonder Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Flat High Speed Die Bonder
10.3 Manufacturing Process Analysis of Flat High Speed Die Bonder
10.4 Industry Chain Structure of Flat High Speed Die Bonder
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Flat High Speed Die Bonder Distributors
11.3 Flat High Speed Die Bonder Customer
12 World Forecast Review for Flat High Speed Die Bonder by Geographic Region
12.1 Global Flat High Speed Die Bonder Market Size Forecast by Region
12.1.1 Global Flat High Speed Die Bonder Forecast by Region (2025-2030)
12.1.2 Global Flat High Speed Die Bonder Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Flat High Speed Die Bonder Forecast by Type (2025-2030)
12.7 Global Flat High Speed Die Bonder Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 ASM International NV
13.1.1 ASM International NV Company Information
13.1.2 ASM International NV Flat High Speed Die Bonder Product Portfolios and Specifications
13.1.3 ASM International NV Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 ASM International NV Main Business Overview
13.1.5 ASM International NV Latest Developments
13.2 Besi
13.2.1 Besi Company Information
13.2.2 Besi Flat High Speed Die Bonder Product Portfolios and Specifications
13.2.3 Besi Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Besi Main Business Overview
13.2.5 Besi Latest Developments
13.3 MRSI Systems
13.3.1 MRSI Systems Company Information
13.3.2 MRSI Systems Flat High Speed Die Bonder Product Portfolios and Specifications
13.3.3 MRSI Systems Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 MRSI Systems Main Business Overview
13.3.5 MRSI Systems Latest Developments
13.4 Yamaha Robotics Holdings
13.4.1 Yamaha Robotics Holdings Company Information
13.4.2 Yamaha Robotics Holdings Flat High Speed Die Bonder Product Portfolios and Specifications
13.4.3 Yamaha Robotics Holdings Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Yamaha Robotics Holdings Main Business Overview
13.4.5 Yamaha Robotics Holdings Latest Developments
13.5 AKIM Corporation
13.5.1 AKIM Corporation Company Information
13.5.2 AKIM Corporation Flat High Speed Die Bonder Product Portfolios and Specifications
13.5.3 AKIM Corporation Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 AKIM Corporation Main Business Overview
13.5.5 AKIM Corporation Latest Developments
13.6 ASMPT
13.6.1 ASMPT Company Information
13.6.2 ASMPT Flat High Speed Die Bonder Product Portfolios and Specifications
13.6.3 ASMPT Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 ASMPT Main Business Overview
13.6.5 ASMPT Latest Developments
13.7 ITEC
13.7.1 ITEC Company Information
13.7.2 ITEC Flat High Speed Die Bonder Product Portfolios and Specifications
13.7.3 ITEC Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 ITEC Main Business Overview
13.7.5 ITEC Latest Developments
13.8 Tresky GmbH
13.8.1 Tresky GmbH Company Information
13.8.2 Tresky GmbH Flat High Speed Die Bonder Product Portfolios and Specifications
13.8.3 Tresky GmbH Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Tresky GmbH Main Business Overview
13.8.5 Tresky GmbH Latest Developments
13.9 People and Technology
13.9.1 People and Technology Company Information
13.9.2 People and Technology Flat High Speed Die Bonder Product Portfolios and Specifications
13.9.3 People and Technology Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 People and Technology Main Business Overview
13.9.5 People and Technology Latest Developments
13.10 Toray Engineering
13.10.1 Toray Engineering Company Information
13.10.2 Toray Engineering Flat High Speed Die Bonder Product Portfolios and Specifications
13.10.3 Toray Engineering Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Toray Engineering Main Business Overview
13.10.5 Toray Engineering Latest Developments
13.11 Kulicke & Soffa
13.11.1 Kulicke & Soffa Company Information
13.11.2 Kulicke & Soffa Flat High Speed Die Bonder Product Portfolios and Specifications
13.11.3 Kulicke & Soffa Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Kulicke & Soffa Main Business Overview
13.11.5 Kulicke & Soffa Latest Developments
13.12 Fasford Technology
13.12.1 Fasford Technology Company Information
13.12.2 Fasford Technology Flat High Speed Die Bonder Product Portfolios and Specifications
13.12.3 Fasford Technology Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Fasford Technology Main Business Overview
13.12.5 Fasford Technology Latest Developments
13.13 QUICK INTELLIGENT EQUIPMENT
13.13.1 QUICK INTELLIGENT EQUIPMENT Company Information
13.13.2 QUICK INTELLIGENT EQUIPMENT Flat High Speed Die Bonder Product Portfolios and Specifications
13.13.3 QUICK INTELLIGENT EQUIPMENT Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 QUICK INTELLIGENT EQUIPMENT Main Business Overview
13.13.5 QUICK INTELLIGENT EQUIPMENT Latest Developments
13.14 Jongshiann Enterprise
13.14.1 Jongshiann Enterprise Company Information
13.14.2 Jongshiann Enterprise Flat High Speed Die Bonder Product Portfolios and Specifications
13.14.3 Jongshiann Enterprise Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 Jongshiann Enterprise Main Business Overview
13.14.5 Jongshiann Enterprise Latest Developments
13.15 Suzhou Yimeide Technology
13.15.1 Suzhou Yimeide Technology Company Information
13.15.2 Suzhou Yimeide Technology Flat High Speed Die Bonder Product Portfolios and Specifications
13.15.3 Suzhou Yimeide Technology Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Suzhou Yimeide Technology Main Business Overview
13.15.5 Suzhou Yimeide Technology Latest Developments
13.16 Shenzhen Xinyichang Technology
13.16.1 Shenzhen Xinyichang Technology Company Information
13.16.2 Shenzhen Xinyichang Technology Flat High Speed Die Bonder Product Portfolios and Specifications
13.16.3 Shenzhen Xinyichang Technology Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 Shenzhen Xinyichang Technology Main Business Overview
13.16.5 Shenzhen Xinyichang Technology Latest Developments
13.17 Shenzhen Jiasite Photoelectric Equipment
13.17.1 Shenzhen Jiasite Photoelectric Equipment Company Information
13.17.2 Shenzhen Jiasite Photoelectric Equipment Flat High Speed Die Bonder Product Portfolios and Specifications
13.17.3 Shenzhen Jiasite Photoelectric Equipment Flat High Speed Die Bonder Sales, Revenue, Price and Gross Margin (2019-2024)
13.17.4 Shenzhen Jiasite Photoelectric Equipment Main Business Overview
13.17.5 Shenzhen Jiasite Photoelectric Equipment Latest Developments
14 Research Findings and Conclusion
*If Applicable.