The global Flip-Chip Package Substrate market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
The 鈥淔lip-Chip Package Substrate Industry Forecast鈥� looks at past sales and reviews total world Flip-Chip Package Substrate sales in 2024, providing a comprehensive analysis by region and market sector of projected Flip-Chip Package Substrate sales for 2025 through 2031. With Flip-Chip Package Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Flip-Chip Package Substrate industry.
This Insight Report provides a comprehensive analysis of the global Flip-Chip Package Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Flip-Chip Package Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Flip-Chip Package Substrate market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Flip-Chip Package Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Flip-Chip Package Substrate.
This report presents a comprehensive overview, market shares, and growth opportunities of Flip-Chip Package Substrate market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
FCBGA
FCCSP
Segmentation by Application:
High-end servers
GPU
CPU and MPU
ASIC
FPGA
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Unimicron
Ibiden
Nan Ya PCB
Shiko Electric Industries
AT&S
Kinsus Interconnect Technology
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
Key Questions Addressed in this Report
What is the 10-year outlook for the global Flip-Chip Package Substrate market?
What factors are driving Flip-Chip Package Substrate market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Flip-Chip Package Substrate market opportunities vary by end market size?
How does Flip-Chip Package Substrate break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Flip-Chip Package Substrate Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Flip-Chip Package Substrate by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Flip-Chip Package Substrate by Country/Region, 2020, 2024 & 2031
2.2 Flip-Chip Package Substrate Segment by Type
2.2.1 FCBGA
2.2.2 FCCSP
2.3 Flip-Chip Package Substrate Sales by Type
2.3.1 Global Flip-Chip Package Substrate Sales Market Share by Type (2020-2025)
2.3.2 Global Flip-Chip Package Substrate Revenue and Market Share by Type (2020-2025)
2.3.3 Global Flip-Chip Package Substrate Sale Price by Type (2020-2025)
2.4 Flip-Chip Package Substrate Segment by Application
2.4.1 High-end servers
2.4.2 GPU
2.4.3 CPU and MPU
2.4.4 ASIC
2.4.5 FPGA
2.5 Flip-Chip Package Substrate Sales by Application
2.5.1 Global Flip-Chip Package Substrate Sale Market Share by Application (2020-2025)
2.5.2 Global Flip-Chip Package Substrate Revenue and Market Share by Application (2020-2025)
2.5.3 Global Flip-Chip Package Substrate Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Flip-Chip Package Substrate Breakdown Data by Company
3.1.1 Global Flip-Chip Package Substrate Annual Sales by Company (2020-2025)
3.1.2 Global Flip-Chip Package Substrate Sales Market Share by Company (2020-2025)
3.2 Global Flip-Chip Package Substrate Annual Revenue by Company (2020-2025)
3.2.1 Global Flip-Chip Package Substrate Revenue by Company (2020-2025)
3.2.2 Global Flip-Chip Package Substrate Revenue Market Share by Company (2020-2025)
3.3 Global Flip-Chip Package Substrate Sale Price by Company
3.4 Key Manufacturers Flip-Chip Package Substrate Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Flip-Chip Package Substrate Product Location Distribution
3.4.2 Players Flip-Chip Package Substrate Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Flip-Chip Package Substrate by Geographic Region
4.1 World Historic Flip-Chip Package Substrate Market Size by Geographic Region (2020-2025)
4.1.1 Global Flip-Chip Package Substrate Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Flip-Chip Package Substrate Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Flip-Chip Package Substrate Market Size by Country/Region (2020-2025)
4.2.1 Global Flip-Chip Package Substrate Annual Sales by Country/Region (2020-2025)
4.2.2 Global Flip-Chip Package Substrate Annual Revenue by Country/Region (2020-2025)
4.3 Americas Flip-Chip Package Substrate Sales Growth
4.4 APAC Flip-Chip Package Substrate Sales Growth
4.5 Europe Flip-Chip Package Substrate Sales Growth
4.6 Middle East & Africa Flip-Chip Package Substrate Sales Growth
5 Americas
5.1 Americas Flip-Chip Package Substrate Sales by Country
5.1.1 Americas Flip-Chip Package Substrate Sales by Country (2020-2025)
5.1.2 Americas Flip-Chip Package Substrate Revenue by Country (2020-2025)
5.2 Americas Flip-Chip Package Substrate Sales by Type (2020-2025)
5.3 Americas Flip-Chip Package Substrate Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Flip-Chip Package Substrate Sales by Region
6.1.1 APAC Flip-Chip Package Substrate Sales by Region (2020-2025)
6.1.2 APAC Flip-Chip Package Substrate Revenue by Region (2020-2025)
6.2 APAC Flip-Chip Package Substrate Sales by Type (2020-2025)
6.3 APAC Flip-Chip Package Substrate Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Flip-Chip Package Substrate by Country
7.1.1 Europe Flip-Chip Package Substrate Sales by Country (2020-2025)
7.1.2 Europe Flip-Chip Package Substrate Revenue by Country (2020-2025)
7.2 Europe Flip-Chip Package Substrate Sales by Type (2020-2025)
7.3 Europe Flip-Chip Package Substrate Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Flip-Chip Package Substrate by Country
8.1.1 Middle East & Africa Flip-Chip Package Substrate Sales by Country (2020-2025)
8.1.2 Middle East & Africa Flip-Chip Package Substrate Revenue by Country (2020-2025)
8.2 Middle East & Africa Flip-Chip Package Substrate Sales by Type (2020-2025)
8.3 Middle East & Africa Flip-Chip Package Substrate Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Flip-Chip Package Substrate
10.3 Manufacturing Process Analysis of Flip-Chip Package Substrate
10.4 Industry Chain Structure of Flip-Chip Package Substrate
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Flip-Chip Package Substrate Distributors
11.3 Flip-Chip Package Substrate Customer
12 World Forecast Review for Flip-Chip Package Substrate by Geographic Region
12.1 Global Flip-Chip Package Substrate Market Size Forecast by Region
12.1.1 Global Flip-Chip Package Substrate Forecast by Region (2026-2031)
12.1.2 Global Flip-Chip Package Substrate Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Flip-Chip Package Substrate Forecast by Type (2026-2031)
12.7 Global Flip-Chip Package Substrate Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Unimicron
13.1.1 Unimicron Company Information
13.1.2 Unimicron Flip-Chip Package Substrate Product Portfolios and Specifications
13.1.3 Unimicron Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Unimicron Main Business Overview
13.1.5 Unimicron Latest Developments
13.2 Ibiden
13.2.1 Ibiden Company Information
13.2.2 Ibiden Flip-Chip Package Substrate Product Portfolios and Specifications
13.2.3 Ibiden Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Ibiden Main Business Overview
13.2.5 Ibiden Latest Developments
13.3 Nan Ya PCB
13.3.1 Nan Ya PCB Company Information
13.3.2 Nan Ya PCB Flip-Chip Package Substrate Product Portfolios and Specifications
13.3.3 Nan Ya PCB Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 Nan Ya PCB Main Business Overview
13.3.5 Nan Ya PCB Latest Developments
13.4 Shiko Electric Industries
13.4.1 Shiko Electric Industries Company Information
13.4.2 Shiko Electric Industries Flip-Chip Package Substrate Product Portfolios and Specifications
13.4.3 Shiko Electric Industries Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Shiko Electric Industries Main Business Overview
13.4.5 Shiko Electric Industries Latest Developments
13.5 AT&S
13.5.1 AT&S Company Information
13.5.2 AT&S Flip-Chip Package Substrate Product Portfolios and Specifications
13.5.3 AT&S Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 AT&S Main Business Overview
13.5.5 AT&S Latest Developments
13.6 Kinsus Interconnect Technology
13.6.1 Kinsus Interconnect Technology Company Information
13.6.2 Kinsus Interconnect Technology Flip-Chip Package Substrate Product Portfolios and Specifications
13.6.3 Kinsus Interconnect Technology Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Kinsus Interconnect Technology Main Business Overview
13.6.5 Kinsus Interconnect Technology Latest Developments
13.7 Semco
13.7.1 Semco Company Information
13.7.2 Semco Flip-Chip Package Substrate Product Portfolios and Specifications
13.7.3 Semco Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 Semco Main Business Overview
13.7.5 Semco Latest Developments
13.8 Kyocera
13.8.1 Kyocera Company Information
13.8.2 Kyocera Flip-Chip Package Substrate Product Portfolios and Specifications
13.8.3 Kyocera Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Kyocera Main Business Overview
13.8.5 Kyocera Latest Developments
13.9 TOPPAN
13.9.1 TOPPAN Company Information
13.9.2 TOPPAN Flip-Chip Package Substrate Product Portfolios and Specifications
13.9.3 TOPPAN Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 TOPPAN Main Business Overview
13.9.5 TOPPAN Latest Developments
13.10 Zhen Ding Technology
13.10.1 Zhen Ding Technology Company Information
13.10.2 Zhen Ding Technology Flip-Chip Package Substrate Product Portfolios and Specifications
13.10.3 Zhen Ding Technology Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Zhen Ding Technology Main Business Overview
13.10.5 Zhen Ding Technology Latest Developments
13.11 Daeduck Electronics
13.11.1 Daeduck Electronics Company Information
13.11.2 Daeduck Electronics Flip-Chip Package Substrate Product Portfolios and Specifications
13.11.3 Daeduck Electronics Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 Daeduck Electronics Main Business Overview
13.11.5 Daeduck Electronics Latest Developments
13.12 ASE Material
13.12.1 ASE Material Company Information
13.12.2 ASE Material Flip-Chip Package Substrate Product Portfolios and Specifications
13.12.3 ASE Material Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 ASE Material Main Business Overview
13.12.5 ASE Material Latest Developments
13.13 ACCESS
13.13.1 ACCESS Company Information
13.13.2 ACCESS Flip-Chip Package Substrate Product Portfolios and Specifications
13.13.3 ACCESS Flip-Chip Package Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
13.13.4 ACCESS Main Business Overview
13.13.5 ACCESS Latest Developments
14 Research Findings and Conclusion
听
听
*If Applicable.
