Global Glass Substrate for Chip Scale Package Market Growth 2024-2030

Publication ID:

LPI07243414

Publication Date:

July 16, 2024

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

Glass substrates are increasingly being utilized in chip scale packages (CSP) due to their unique properties that offer significant advantages over traditional materials like silicon and organic substrates. Glass substrates have a low coefficient of thermal expansion (CTE), closely matching that of silicon. This reduces stress and potential failure due to thermal cycling, enhancing the reliability of the package.
The global Glass Substrate for Chip Scale Package market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The 鈥淕lass Substrate for Chip Scale Package Industry Forecast鈥� looks at past sales and reviews total world Glass Substrate for Chip Scale Package sales in 2023, providing a comprehensive analysis by region and market sector of projected Glass Substrate for Chip Scale Package sales for 2024 through 2030. With Glass Substrate for Chip Scale Package sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Glass Substrate for Chip Scale Package industry.
This Insight Report provides a comprehensive analysis of the global Glass Substrate for Chip Scale Package landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Glass Substrate for Chip Scale Package portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Glass Substrate for Chip Scale Package market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Glass Substrate for Chip Scale Package and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Glass Substrate for Chip Scale Package.
United States market for Glass Substrate for Chip Scale Package is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Glass Substrate for Chip Scale Package is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Glass Substrate for Chip Scale Package is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Glass Substrate for Chip Scale Package players cover Dai Nippon Printing Co., Ltd., Corning, SCHOTT Glass, RENA Technologies, TECNISCO, LTD., etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Glass Substrate for Chip Scale Package market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Small Size
Medium Size
Large Size
Segmentation by Application:
2.5D/3D Wafer Level Packaging
MEMS Sensor
RF Devices
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Dai Nippon Printing Co., Ltd.
Corning
SCHOTT Glass
RENA Technologies
TECNISCO, LTD.
Samtec
WG Tech
Leaman
Hubei W-olf Photoelectric Technology Co., Ltd.
AGC
Key Questions Addressed in this Report
What is the 10-year outlook for the global Glass Substrate for Chip Scale Package market?
What factors are driving Glass Substrate for Chip Scale Package market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Glass Substrate for Chip Scale Package market opportunities vary by end market size?
How does Glass Substrate for Chip Scale Package break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Glass Substrate for Chip Scale Package Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Glass Substrate for Chip Scale Package by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Glass Substrate for Chip Scale Package by Country/Region, 2019, 2023 & 2030
2.2 Glass Substrate for Chip Scale Package Segment by Type
2.2.1 Small Size
2.2.2 Medium Size
2.2.3 Large Size
2.3 Glass Substrate for Chip Scale Package Sales by Type
2.3.1 Global Glass Substrate for Chip Scale Package Sales Market Share by Type (2019-2024)
2.3.2 Global Glass Substrate for Chip Scale Package Revenue and Market Share by Type (2019-2024)
2.3.3 Global Glass Substrate for Chip Scale Package Sale Price by Type (2019-2024)
2.4 Glass Substrate for Chip Scale Package Segment by Application
2.4.1 2.5D/3D Wafer Level Packaging
2.4.2 MEMS Sensor
2.4.3 RF Devices
2.4.4 Others
2.5 Glass Substrate for Chip Scale Package Sales by Application
2.5.1 Global Glass Substrate for Chip Scale Package Sale Market Share by Application (2019-2024)
2.5.2 Global Glass Substrate for Chip Scale Package Revenue and Market Share by Application (2019-2024)
2.5.3 Global Glass Substrate for Chip Scale Package Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Glass Substrate for Chip Scale Package Breakdown Data by Company
3.1.1 Global Glass Substrate for Chip Scale Package Annual Sales by Company (2019-2024)
3.1.2 Global Glass Substrate for Chip Scale Package Sales Market Share by Company (2019-2024)
3.2 Global Glass Substrate for Chip Scale Package Annual Revenue by Company (2019-2024)
3.2.1 Global Glass Substrate for Chip Scale Package Revenue by Company (2019-2024)
3.2.2 Global Glass Substrate for Chip Scale Package Revenue Market Share by Company (2019-2024)
3.3 Global Glass Substrate for Chip Scale Package Sale Price by Company
3.4 Key Manufacturers Glass Substrate for Chip Scale Package Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Glass Substrate for Chip Scale Package Product Location Distribution
3.4.2 Players Glass Substrate for Chip Scale Package Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Glass Substrate for Chip Scale Package by Geographic Region
4.1 World Historic Glass Substrate for Chip Scale Package Market Size by Geographic Region (2019-2024)
4.1.1 Global Glass Substrate for Chip Scale Package Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Glass Substrate for Chip Scale Package Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Glass Substrate for Chip Scale Package Market Size by Country/Region (2019-2024)
4.2.1 Global Glass Substrate for Chip Scale Package Annual Sales by Country/Region (2019-2024)
4.2.2 Global Glass Substrate for Chip Scale Package Annual Revenue by Country/Region (2019-2024)
4.3 Americas Glass Substrate for Chip Scale Package Sales Growth
4.4 APAC Glass Substrate for Chip Scale Package Sales Growth
4.5 Europe Glass Substrate for Chip Scale Package Sales Growth
4.6 Middle East & Africa Glass Substrate for Chip Scale Package Sales Growth
5 Americas
5.1 Americas Glass Substrate for Chip Scale Package Sales by Country
5.1.1 Americas Glass Substrate for Chip Scale Package Sales by Country (2019-2024)
5.1.2 Americas Glass Substrate for Chip Scale Package Revenue by Country (2019-2024)
5.2 Americas Glass Substrate for Chip Scale Package Sales by Type (2019-2024)
5.3 Americas Glass Substrate for Chip Scale Package Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Glass Substrate for Chip Scale Package Sales by Region
6.1.1 APAC Glass Substrate for Chip Scale Package Sales by Region (2019-2024)
6.1.2 APAC Glass Substrate for Chip Scale Package Revenue by Region (2019-2024)
6.2 APAC Glass Substrate for Chip Scale Package Sales by Type (2019-2024)
6.3 APAC Glass Substrate for Chip Scale Package Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Glass Substrate for Chip Scale Package by Country
7.1.1 Europe Glass Substrate for Chip Scale Package Sales by Country (2019-2024)
7.1.2 Europe Glass Substrate for Chip Scale Package Revenue by Country (2019-2024)
7.2 Europe Glass Substrate for Chip Scale Package Sales by Type (2019-2024)
7.3 Europe Glass Substrate for Chip Scale Package Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Glass Substrate for Chip Scale Package by Country
8.1.1 Middle East & Africa Glass Substrate for Chip Scale Package Sales by Country (2019-2024)
8.1.2 Middle East & Africa Glass Substrate for Chip Scale Package Revenue by Country (2019-2024)
8.2 Middle East & Africa Glass Substrate for Chip Scale Package Sales by Type (2019-2024)
8.3 Middle East & Africa Glass Substrate for Chip Scale Package Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Glass Substrate for Chip Scale Package
10.3 Manufacturing Process Analysis of Glass Substrate for Chip Scale Package
10.4 Industry Chain Structure of Glass Substrate for Chip Scale Package
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Glass Substrate for Chip Scale Package Distributors
11.3 Glass Substrate for Chip Scale Package Customer
12 World Forecast Review for Glass Substrate for Chip Scale Package by Geographic Region
12.1 Global Glass Substrate for Chip Scale Package Market Size Forecast by Region
12.1.1 Global Glass Substrate for Chip Scale Package Forecast by Region (2025-2030)
12.1.2 Global Glass Substrate for Chip Scale Package Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Glass Substrate for Chip Scale Package Forecast by Type (2025-2030)
12.7 Global Glass Substrate for Chip Scale Package Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Dai Nippon Printing Co., Ltd.
13.1.1 Dai Nippon Printing Co., Ltd. Company Information
13.1.2 Dai Nippon Printing Co., Ltd. Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.1.3 Dai Nippon Printing Co., Ltd. Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Dai Nippon Printing Co., Ltd. Main Business Overview
13.1.5 Dai Nippon Printing Co., Ltd. Latest Developments
13.2 Corning
13.2.1 Corning Company Information
13.2.2 Corning Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.2.3 Corning Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Corning Main Business Overview
13.2.5 Corning Latest Developments
13.3 SCHOTT Glass
13.3.1 SCHOTT Glass Company Information
13.3.2 SCHOTT Glass Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.3.3 SCHOTT Glass Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 SCHOTT Glass Main Business Overview
13.3.5 SCHOTT Glass Latest Developments
13.4 RENA Technologies
13.4.1 RENA Technologies Company Information
13.4.2 RENA Technologies Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.4.3 RENA Technologies Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 RENA Technologies Main Business Overview
13.4.5 RENA Technologies Latest Developments
13.5 TECNISCO, LTD.
13.5.1 TECNISCO, LTD. Company Information
13.5.2 TECNISCO, LTD. Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.5.3 TECNISCO, LTD. Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 TECNISCO, LTD. Main Business Overview
13.5.5 TECNISCO, LTD. Latest Developments
13.6 Samtec
13.6.1 Samtec Company Information
13.6.2 Samtec Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.6.3 Samtec Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Samtec Main Business Overview
13.6.5 Samtec Latest Developments
13.7 WG Tech
13.7.1 WG Tech Company Information
13.7.2 WG Tech Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.7.3 WG Tech Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 WG Tech Main Business Overview
13.7.5 WG Tech Latest Developments
13.8 Leaman
13.8.1 Leaman Company Information
13.8.2 Leaman Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.8.3 Leaman Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Leaman Main Business Overview
13.8.5 Leaman Latest Developments
13.9 Hubei W-olf Photoelectric Technology Co., Ltd.
13.9.1 Hubei W-olf Photoelectric Technology Co., Ltd. Company Information
13.9.2 Hubei W-olf Photoelectric Technology Co., Ltd. Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.9.3 Hubei W-olf Photoelectric Technology Co., Ltd. Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Hubei W-olf Photoelectric Technology Co., Ltd. Main Business Overview
13.9.5 Hubei W-olf Photoelectric Technology Co., Ltd. Latest Developments
13.10 AGC
13.10.1 AGC Company Information
13.10.2 AGC Glass Substrate for Chip Scale Package Product Portfolios and Specifications
13.10.3 AGC Glass Substrate for Chip Scale Package Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 AGC Main Business Overview
13.10.5 AGC Latest Developments
14 Research Findings and Conclusion

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