Global Glass Substrate for Semiconductor Packaging Market Growth (Status and Outlook) 2025-2031

Publication ID:

LPI04253654

Publication Date:

April 28, 2025

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global Glass Substrate for Semiconductor Packaging market size is predicted to grow from US$ 238 million in 2025 to US$ 591 million in 2031; it is expected to grow at a CAGR of 16.3% from 2025 to 2031.
A glass substrate for semiconductor packaging refers to a specially designed glass material used as a base or platform for constructing and assembling electronic components, particularly semiconductors. It provides a stable and inert surface for mounting and connecting delicate semiconductor devices, such as integrated circuits (ICs), microprocessors, and memory chips. Glass substrates used in semiconductor packaging are engineered to possess specific characteristics that make them suitable for this application. These characteristics include high thermal conductivity, low coefficient of thermal expansion (CTE), electrical insulation properties, chemical resistance, and excellent dimensional stability. The glass substrate serves as a foundation for placing and interconnecting chips, allowing for the creation of complex electronic circuits. Additionally, it can provide protection against moisture, dust, and mechanical stress, enhancing the durability and reliability of the semiconductors. Compared to currently used organic substrates, glass substrates offer better thermal and mechanical stability and ultra-low flatness. These properties promote the increase in chip surface area and the number of chiplets on a single package. A dynamic that allows, in short, to improve the design rules necessary for artificial intelligence products and future data centers by an order of magnitude.
Global key players of Glass Substrate for Semiconductor Packaging include AGC, Schott, Corning, Hoya, Ohara, etc. The top five players hold a share about 90%. Asia-Pacific is the largest market, and has a share about 80%, followed by North America and Europe with share 16% and 3%, separately. In terms of product type, Coefficient of Thermal Expansion (CTE), above 5 ppm/掳C is the largest segment, occupied for a share of 65%. In terms of application, Wafer Level Packaging has a share about 60 percent.
The 鈥淕lass Substrate for Semiconductor Packaging Industry Forecast鈥� looks at past sales and reviews total world Glass Substrate for Semiconductor Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Glass Substrate for Semiconductor Packaging sales for 2025 through 2031. With Glass Substrate for Semiconductor Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Glass Substrate for Semiconductor Packaging industry.
This Insight Report provides a comprehensive analysis of the global Glass Substrate for Semiconductor Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Glass Substrate for Semiconductor Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Glass Substrate for Semiconductor Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Glass Substrate for Semiconductor Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Glass Substrate for Semiconductor Packaging.
This report presents a comprehensive overview, market shares, and growth opportunities of Glass Substrate for Semiconductor Packaging market by product type, application, key players and key regions and countries.
Segmentation by Type:
Coefficient of Thermal Expansion (CTE), above 5 ppm/掳C
Coefficient of Thermal Expansion (CTE), below 5 ppm/掳C
Segmentation by Application:
Wafer Level Packaging
Panel Level Packaging
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
AGC
Schott
Corning
Hoya
Ohara
CrysTop Glass
WGTech

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Glass Substrate for Semiconductor Packaging Market Size (2020-2031)
2.1.2 Glass Substrate for Semiconductor Packaging Market Size CAGR by Region (2020 VS 2024 VS 2031)
2.1.3 World Current & Future Analysis for Glass Substrate for Semiconductor Packaging by Country/Region (2020, 2024 & 2031)
2.2 Glass Substrate for Semiconductor Packaging Segment by Type
2.2.1 Coefficient of Thermal Expansion (CTE), above 5 ppm/掳C
2.2.2 Coefficient of Thermal Expansion (CTE), below 5 ppm/掳C
2.3 Glass Substrate for Semiconductor Packaging Market Size by Type
2.3.1 Glass Substrate for Semiconductor Packaging Market Size CAGR by Type (2020 VS 2024 VS 2031)
2.3.2 Global Glass Substrate for Semiconductor Packaging Market Size Market Share by Type (2020-2025)
2.4 Glass Substrate for Semiconductor Packaging Segment by Application
2.4.1 Wafer Level Packaging
2.4.2 Panel Level Packaging
2.5 Glass Substrate for Semiconductor Packaging Market Size by Application
2.5.1 Glass Substrate for Semiconductor Packaging Market Size CAGR by Application (2020 VS 2024 VS 2031)
2.5.2 Global Glass Substrate for Semiconductor Packaging Market Size Market Share by Application (2020-2025)
3 Glass Substrate for Semiconductor Packaging Market Size by Player
3.1 Glass Substrate for Semiconductor Packaging Market Size Market Share by Player
3.1.1 Global Glass Substrate for Semiconductor Packaging Revenue by Player (2020-2025)
3.1.2 Global Glass Substrate for Semiconductor Packaging Revenue Market Share by Player (2020-2025)
3.2 Global Glass Substrate for Semiconductor Packaging Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Glass Substrate for Semiconductor Packaging by Region
4.1 Glass Substrate for Semiconductor Packaging Market Size by Region (2020-2025)
4.2 Global Glass Substrate for Semiconductor Packaging Annual Revenue by Country/Region (2020-2025)
4.3 Americas Glass Substrate for Semiconductor Packaging Market Size Growth (2020-2025)
4.4 APAC Glass Substrate for Semiconductor Packaging Market Size Growth (2020-2025)
4.5 Europe Glass Substrate for Semiconductor Packaging Market Size Growth (2020-2025)
4.6 Middle East & Africa Glass Substrate for Semiconductor Packaging Market Size Growth (2020-2025)
5 Americas
5.1 Americas Glass Substrate for Semiconductor Packaging Market Size by Country (2020-2025)
5.2 Americas Glass Substrate for Semiconductor Packaging Market Size by Type (2020-2025)
5.3 Americas Glass Substrate for Semiconductor Packaging Market Size by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Glass Substrate for Semiconductor Packaging Market Size by Region (2020-2025)
6.2 APAC Glass Substrate for Semiconductor Packaging Market Size by Type (2020-2025)
6.3 APAC Glass Substrate for Semiconductor Packaging Market Size by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Glass Substrate for Semiconductor Packaging Market Size by Country (2020-2025)
7.2 Europe Glass Substrate for Semiconductor Packaging Market Size by Type (2020-2025)
7.3 Europe Glass Substrate for Semiconductor Packaging Market Size by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Glass Substrate for Semiconductor Packaging by Region (2020-2025)
8.2 Middle East & Africa Glass Substrate for Semiconductor Packaging Market Size by Type (2020-2025)
8.3 Middle East & Africa Glass Substrate for Semiconductor Packaging Market Size by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global Glass Substrate for Semiconductor Packaging Market Forecast
10.1 Global Glass Substrate for Semiconductor Packaging Forecast by Region (2026-2031)
10.1.1 Global Glass Substrate for Semiconductor Packaging Forecast by Region (2026-2031)
10.1.2 Americas Glass Substrate for Semiconductor Packaging Forecast
10.1.3 APAC Glass Substrate for Semiconductor Packaging Forecast
10.1.4 Europe Glass Substrate for Semiconductor Packaging Forecast
10.1.5 Middle East & Africa Glass Substrate for Semiconductor Packaging Forecast
10.2 Americas Glass Substrate for Semiconductor Packaging Forecast by Country (2026-2031)
10.2.1 United States Market Glass Substrate for Semiconductor Packaging Forecast
10.2.2 Canada Market Glass Substrate for Semiconductor Packaging Forecast
10.2.3 Mexico Market Glass Substrate for Semiconductor Packaging Forecast
10.2.4 Brazil Market Glass Substrate for Semiconductor Packaging Forecast
10.3 APAC Glass Substrate for Semiconductor Packaging Forecast by Region (2026-2031)
10.3.1 China Glass Substrate for Semiconductor Packaging Market Forecast
10.3.2 Japan Market Glass Substrate for Semiconductor Packaging Forecast
10.3.3 Korea Market Glass Substrate for Semiconductor Packaging Forecast
10.3.4 Southeast Asia Market Glass Substrate for Semiconductor Packaging Forecast
10.3.5 India Market Glass Substrate for Semiconductor Packaging Forecast
10.3.6 Australia Market Glass Substrate for Semiconductor Packaging Forecast
10.4 Europe Glass Substrate for Semiconductor Packaging Forecast by Country (2026-2031)
10.4.1 Germany Market Glass Substrate for Semiconductor Packaging Forecast
10.4.2 France Market Glass Substrate for Semiconductor Packaging Forecast
10.4.3 UK Market Glass Substrate for Semiconductor Packaging Forecast
10.4.4 Italy Market Glass Substrate for Semiconductor Packaging Forecast
10.4.5 Russia Market Glass Substrate for Semiconductor Packaging Forecast
10.5 Middle East & Africa Glass Substrate for Semiconductor Packaging Forecast by Region (2026-2031)
10.5.1 Egypt Market Glass Substrate for Semiconductor Packaging Forecast
10.5.2 South Africa Market Glass Substrate for Semiconductor Packaging Forecast
10.5.3 Israel Market Glass Substrate for Semiconductor Packaging Forecast
10.5.4 Turkey Market Glass Substrate for Semiconductor Packaging Forecast
10.6 Global Glass Substrate for Semiconductor Packaging Forecast by Type (2026-2031)
10.7 Global Glass Substrate for Semiconductor Packaging Forecast by Application (2026-2031)
10.7.1 GCC Countries Market Glass Substrate for Semiconductor Packaging Forecast
11 Key Players Analysis
11.1 AGC
11.1.1 AGC Company Information
11.1.2 AGC Glass Substrate for Semiconductor Packaging Product Offered
11.1.3 AGC Glass Substrate for Semiconductor Packaging Revenue, Gross Margin and Market Share (2020-2025)
11.1.4 AGC Main Business Overview
11.1.5 AGC Latest Developments
11.2 Schott
11.2.1 Schott Company Information
11.2.2 Schott Glass Substrate for Semiconductor Packaging Product Offered
11.2.3 Schott Glass Substrate for Semiconductor Packaging Revenue, Gross Margin and Market Share (2020-2025)
11.2.4 Schott Main Business Overview
11.2.5 Schott Latest Developments
11.3 Corning
11.3.1 Corning Company Information
11.3.2 Corning Glass Substrate for Semiconductor Packaging Product Offered
11.3.3 Corning Glass Substrate for Semiconductor Packaging Revenue, Gross Margin and Market Share (2020-2025)
11.3.4 Corning Main Business Overview
11.3.5 Corning Latest Developments
11.4 Hoya
11.4.1 Hoya Company Information
11.4.2 Hoya Glass Substrate for Semiconductor Packaging Product Offered
11.4.3 Hoya Glass Substrate for Semiconductor Packaging Revenue, Gross Margin and Market Share (2020-2025)
11.4.4 Hoya Main Business Overview
11.4.5 Hoya Latest Developments
11.5 Ohara
11.5.1 Ohara Company Information
11.5.2 Ohara Glass Substrate for Semiconductor Packaging Product Offered
11.5.3 Ohara Glass Substrate for Semiconductor Packaging Revenue, Gross Margin and Market Share (2020-2025)
11.5.4 Ohara Main Business Overview
11.5.5 Ohara Latest Developments
11.6 CrysTop Glass
11.6.1 CrysTop Glass Company Information
11.6.2 CrysTop Glass Glass Substrate for Semiconductor Packaging Product Offered
11.6.3 CrysTop Glass Glass Substrate for Semiconductor Packaging Revenue, Gross Margin and Market Share (2020-2025)
11.6.4 CrysTop Glass Main Business Overview
11.6.5 CrysTop Glass Latest Developments
11.7 WGTech
11.7.1 WGTech Company Information
11.7.2 WGTech Glass Substrate for Semiconductor Packaging Product Offered
11.7.3 WGTech Glass Substrate for Semiconductor Packaging Revenue, Gross Margin and Market Share (2020-2025)
11.7.4 WGTech Main Business Overview
11.7.5 WGTech Latest Developments
12 Research Findings and Conclusion

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