The global IC Advanced Packaging Equipment market size was valued at US$ 6510.5 million in 2023. With growing demand in downstream market, the IC Advanced Packaging Equipment is forecast to a readjusted size of US$ 12160 million by 2030 with a CAGR of 9.3% during review period.
The research report highlights the growth potential of the global IC Advanced Packaging Equipment market. IC Advanced Packaging Equipment are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of IC Advanced Packaging Equipment. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the IC Advanced Packaging Equipment market.
The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.
Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.
China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.
In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.
Key Features:
The report on IC Advanced Packaging Equipment market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the IC Advanced Packaging Equipment market. It may include historical data, market segmentation by Type (e.g., Cutting Equipment, Solid Crystal Devices), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the IC Advanced Packaging Equipment market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the IC Advanced Packaging Equipment market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the IC Advanced Packaging Equipment industry. This include advancements in IC Advanced Packaging Equipment technology, IC Advanced Packaging Equipment new entrants, IC Advanced Packaging Equipment new investment, and other innovations that are shaping the future of IC Advanced Packaging Equipment.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the IC Advanced Packaging Equipment market. It includes factors influencing customer ' purchasing decisions, preferences for IC Advanced Packaging Equipment product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the IC Advanced Packaging Equipment market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting IC Advanced Packaging Equipment market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the IC Advanced Packaging Equipment market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the IC Advanced Packaging Equipment industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the IC Advanced Packaging Equipment market.
Market Segmentation:
IC Advanced Packaging Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Segmentation by type
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other
Segmentation by application
Automotive Electronics
Consumer Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec
Key Questions Addressed in this Report
What is the 10-year outlook for the global IC Advanced Packaging Equipment market?
What factors are driving IC Advanced Packaging Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Advanced Packaging Equipment market opportunities vary by end market size?
How does IC Advanced Packaging Equipment break out type, application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global IC Advanced Packaging Equipment Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for IC Advanced Packaging Equipment by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for IC Advanced Packaging Equipment by Country/Region, 2019, 2023 & 2030
2.2 IC Advanced Packaging Equipment Segment by Type
2.2.1 Cutting Equipment
2.2.2 Solid Crystal Devices
2.2.3 Welding Equipment
2.2.4 Testing Equipment
2.2.5 Other
2.3 IC Advanced Packaging Equipment Sales by Type
2.3.1 Global IC Advanced Packaging Equipment Sales Market Share by Type (2019-2024)
2.3.2 Global IC Advanced Packaging Equipment Revenue and Market Share by Type (2019-2024)
2.3.3 Global IC Advanced Packaging Equipment Sale Price by Type (2019-2024)
2.4 IC Advanced Packaging Equipment Segment by Application
2.4.1 Automotive Electronics
2.4.2 Consumer Electronics
2.4.3 Other
2.5 IC Advanced Packaging Equipment Sales by Application
2.5.1 Global IC Advanced Packaging Equipment Sale Market Share by Application (2019-2024)
2.5.2 Global IC Advanced Packaging Equipment Revenue and Market Share by Application (2019-2024)
2.5.3 Global IC Advanced Packaging Equipment Sale Price by Application (2019-2024)
3 Global IC Advanced Packaging Equipment by Company
3.1 Global IC Advanced Packaging Equipment Breakdown Data by Company
3.1.1 Global IC Advanced Packaging Equipment Annual Sales by Company (2019-2024)
3.1.2 Global IC Advanced Packaging Equipment Sales Market Share by Company (2019-2024)
3.2 Global IC Advanced Packaging Equipment Annual Revenue by Company (2019-2024)
3.2.1 Global IC Advanced Packaging Equipment Revenue by Company (2019-2024)
3.2.2 Global IC Advanced Packaging Equipment Revenue Market Share by Company (2019-2024)
3.3 Global IC Advanced Packaging Equipment Sale Price by Company
3.4 Key Manufacturers IC Advanced Packaging Equipment Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers IC Advanced Packaging Equipment Product Location Distribution
3.4.2 Players IC Advanced Packaging Equipment Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for IC Advanced Packaging Equipment by Geographic Region
4.1 World Historic IC Advanced Packaging Equipment Market Size by Geographic Region (2019-2024)
4.1.1 Global IC Advanced Packaging Equipment Annual Sales by Geographic Region (2019-2024)
4.1.2 Global IC Advanced Packaging Equipment Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic IC Advanced Packaging Equipment Market Size by Country/Region (2019-2024)
4.2.1 Global IC Advanced Packaging Equipment Annual Sales by Country/Region (2019-2024)
4.2.2 Global IC Advanced Packaging Equipment Annual Revenue by Country/Region (2019-2024)
4.3 Americas IC Advanced Packaging Equipment Sales Growth
4.4 APAC IC Advanced Packaging Equipment Sales Growth
4.5 Europe IC Advanced Packaging Equipment Sales Growth
4.6 Middle East & Africa IC Advanced Packaging Equipment Sales Growth
5 Americas
5.1 Americas IC Advanced Packaging Equipment Sales by Country
5.1.1 Americas IC Advanced Packaging Equipment Sales by Country (2019-2024)
5.1.2 Americas IC Advanced Packaging Equipment Revenue by Country (2019-2024)
5.2 Americas IC Advanced Packaging Equipment Sales by Type
5.3 Americas IC Advanced Packaging Equipment Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC IC Advanced Packaging Equipment Sales by Region
6.1.1 APAC IC Advanced Packaging Equipment Sales by Region (2019-2024)
6.1.2 APAC IC Advanced Packaging Equipment Revenue by Region (2019-2024)
6.2 APAC IC Advanced Packaging Equipment Sales by Type
6.3 APAC IC Advanced Packaging Equipment Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe IC Advanced Packaging Equipment by Country
7.1.1 Europe IC Advanced Packaging Equipment Sales by Country (2019-2024)
7.1.2 Europe IC Advanced Packaging Equipment Revenue by Country (2019-2024)
7.2 Europe IC Advanced Packaging Equipment Sales by Type
7.3 Europe IC Advanced Packaging Equipment Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa IC Advanced Packaging Equipment by Country
8.1.1 Middle East & Africa IC Advanced Packaging Equipment Sales by Country (2019-2024)
8.1.2 Middle East & Africa IC Advanced Packaging Equipment Revenue by Country (2019-2024)
8.2 Middle East & Africa IC Advanced Packaging Equipment Sales by Type
8.3 Middle East & Africa IC Advanced Packaging Equipment Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of IC Advanced Packaging Equipment
10.3 Manufacturing Process Analysis of IC Advanced Packaging Equipment
10.4 Industry Chain Structure of IC Advanced Packaging Equipment
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 IC Advanced Packaging Equipment Distributors
11.3 IC Advanced Packaging Equipment Customer
12 World Forecast Review for IC Advanced Packaging Equipment by Geographic Region
12.1 Global IC Advanced Packaging Equipment Market Size Forecast by Region
12.1.1 Global IC Advanced Packaging Equipment Forecast by Region (2025-2030)
12.1.2 Global IC Advanced Packaging Equipment Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global IC Advanced Packaging Equipment Forecast by Type
12.7 Global IC Advanced Packaging Equipment Forecast by Application
13 Key Players Analysis
13.1 ASM Pacific
13.1.1 ASM Pacific Company Information
13.1.2 ASM Pacific IC Advanced Packaging Equipment Product Portfolios and Specifications
13.1.3 ASM Pacific IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 ASM Pacific Main Business Overview
13.1.5 ASM Pacific Latest Developments
13.2 Applied Material
13.2.1 Applied Material Company Information
13.2.2 Applied Material IC Advanced Packaging Equipment Product Portfolios and Specifications
13.2.3 Applied Material IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Applied Material Main Business Overview
13.2.5 Applied Material Latest Developments
13.3 Advantest
13.3.1 Advantest Company Information
13.3.2 Advantest IC Advanced Packaging Equipment Product Portfolios and Specifications
13.3.3 Advantest IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Advantest Main Business Overview
13.3.5 Advantest Latest Developments
13.4 Kulicke&Soffa
13.4.1 Kulicke&Soffa Company Information
13.4.2 Kulicke&Soffa IC Advanced Packaging Equipment Product Portfolios and Specifications
13.4.3 Kulicke&Soffa IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Kulicke&Soffa Main Business Overview
13.4.5 Kulicke&Soffa Latest Developments
13.5 DISCO
13.5.1 DISCO Company Information
13.5.2 DISCO IC Advanced Packaging Equipment Product Portfolios and Specifications
13.5.3 DISCO IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 DISCO Main Business Overview
13.5.5 DISCO Latest Developments
13.6 Tokyo Seimitsu
13.6.1 Tokyo Seimitsu Company Information
13.6.2 Tokyo Seimitsu IC Advanced Packaging Equipment Product Portfolios and Specifications
13.6.3 Tokyo Seimitsu IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Tokyo Seimitsu Main Business Overview
13.6.5 Tokyo Seimitsu Latest Developments
13.7 BESI
13.7.1 BESI Company Information
13.7.2 BESI IC Advanced Packaging Equipment Product Portfolios and Specifications
13.7.3 BESI IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 BESI Main Business Overview
13.7.5 BESI Latest Developments
13.8 Hitachi
13.8.1 Hitachi Company Information
13.8.2 Hitachi IC Advanced Packaging Equipment Product Portfolios and Specifications
13.8.3 Hitachi IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Hitachi Main Business Overview
13.8.5 Hitachi Latest Developments
13.9 Teradyne
13.9.1 Teradyne Company Information
13.9.2 Teradyne IC Advanced Packaging Equipment Product Portfolios and Specifications
13.9.3 Teradyne IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Teradyne Main Business Overview
13.9.5 Teradyne Latest Developments
13.10 Hanmi
13.10.1 Hanmi Company Information
13.10.2 Hanmi IC Advanced Packaging Equipment Product Portfolios and Specifications
13.10.3 Hanmi IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Hanmi Main Business Overview
13.10.5 Hanmi Latest Developments
13.11 Toray Engineering
13.11.1 Toray Engineering Company Information
13.11.2 Toray Engineering IC Advanced Packaging Equipment Product Portfolios and Specifications
13.11.3 Toray Engineering IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Toray Engineering Main Business Overview
13.11.5 Toray Engineering Latest Developments
13.12 Shinkawa
13.12.1 Shinkawa Company Information
13.12.2 Shinkawa IC Advanced Packaging Equipment Product Portfolios and Specifications
13.12.3 Shinkawa IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Shinkawa Main Business Overview
13.12.5 Shinkawa Latest Developments
13.13 COHU Semiconductor
13.13.1 COHU Semiconductor Company Information
13.13.2 COHU Semiconductor IC Advanced Packaging Equipment Product Portfolios and Specifications
13.13.3 COHU Semiconductor IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 COHU Semiconductor Main Business Overview
13.13.5 COHU Semiconductor Latest Developments
13.14 TOWA
13.14.1 TOWA Company Information
13.14.2 TOWA IC Advanced Packaging Equipment Product Portfolios and Specifications
13.14.3 TOWA IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 TOWA Main Business Overview
13.14.5 TOWA Latest Developments
13.15 SUSS Microtec
13.15.1 SUSS Microtec Company Information
13.15.2 SUSS Microtec IC Advanced Packaging Equipment Product Portfolios and Specifications
13.15.3 SUSS Microtec IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 SUSS Microtec Main Business Overview
13.15.5 SUSS Microtec Latest Developments
14 Research Findings and Conclusion
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*If Applicable.