The global IC Advanced Packaging Equipment market size is predicted to grow from US$ 7725 million in 2025 to US$ 13200 million in 2031; it is expected to grow at a CAGR of 9.3% from 2025 to 2031.
The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore"s Law", advanced packaging technology has become inevitable.
Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.
China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.
In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.
The 鈥淚C Advanced Packaging Equipment Industry Forecast鈥� looks at past sales and reviews total world IC Advanced Packaging Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Advanced Packaging Equipment sales for 2025 through 2031. With IC Advanced Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Advanced Packaging Equipment industry.
This Insight Report provides a comprehensive analysis of the global IC Advanced Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Advanced Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global IC Advanced Packaging Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Advanced Packaging Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Advanced Packaging Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Advanced Packaging Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other
Segmentation by Application:
Automotive Electronics
Consumer Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec
Key Questions Addressed in this Report
What is the 10-year outlook for the global IC Advanced Packaging Equipment market?
What factors are driving IC Advanced Packaging Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Advanced Packaging Equipment market opportunities vary by end market size?
How does IC Advanced Packaging Equipment break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global IC Advanced Packaging Equipment Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for IC Advanced Packaging Equipment by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for IC Advanced Packaging Equipment by Country/Region, 2020, 2024 & 2031
2.2 IC Advanced Packaging Equipment Segment by Type
2.2.1 Cutting Equipment
2.2.2 Solid Crystal Devices
2.2.3 Welding Equipment
2.2.4 Testing Equipment
2.2.5 Other
2.3 IC Advanced Packaging Equipment Sales by Type
2.3.1 Global IC Advanced Packaging Equipment Sales Market Share by Type (2020-2025)
2.3.2 Global IC Advanced Packaging Equipment Revenue and Market Share by Type (2020-2025)
2.3.3 Global IC Advanced Packaging Equipment Sale Price by Type (2020-2025)
2.4 IC Advanced Packaging Equipment Segment by Application
2.4.1 Automotive Electronics
2.4.2 Consumer Electronics
2.4.3 Other
2.5 IC Advanced Packaging Equipment Sales by Application
2.5.1 Global IC Advanced Packaging Equipment Sale Market Share by Application (2020-2025)
2.5.2 Global IC Advanced Packaging Equipment Revenue and Market Share by Application (2020-2025)
2.5.3 Global IC Advanced Packaging Equipment Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global IC Advanced Packaging Equipment Breakdown Data by Company
3.1.1 Global IC Advanced Packaging Equipment Annual Sales by Company (2020-2025)
3.1.2 Global IC Advanced Packaging Equipment Sales Market Share by Company (2020-2025)
3.2 Global IC Advanced Packaging Equipment Annual Revenue by Company (2020-2025)
3.2.1 Global IC Advanced Packaging Equipment Revenue by Company (2020-2025)
3.2.2 Global IC Advanced Packaging Equipment Revenue Market Share by Company (2020-2025)
3.3 Global IC Advanced Packaging Equipment Sale Price by Company
3.4 Key Manufacturers IC Advanced Packaging Equipment Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers IC Advanced Packaging Equipment Product Location Distribution
3.4.2 Players IC Advanced Packaging Equipment Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for IC Advanced Packaging Equipment by Geographic Region
4.1 World Historic IC Advanced Packaging Equipment Market Size by Geographic Region (2020-2025)
4.1.1 Global IC Advanced Packaging Equipment Annual Sales by Geographic Region (2020-2025)
4.1.2 Global IC Advanced Packaging Equipment Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic IC Advanced Packaging Equipment Market Size by Country/Region (2020-2025)
4.2.1 Global IC Advanced Packaging Equipment Annual Sales by Country/Region (2020-2025)
4.2.2 Global IC Advanced Packaging Equipment Annual Revenue by Country/Region (2020-2025)
4.3 Americas IC Advanced Packaging Equipment Sales Growth
4.4 APAC IC Advanced Packaging Equipment Sales Growth
4.5 Europe IC Advanced Packaging Equipment Sales Growth
4.6 Middle East & Africa IC Advanced Packaging Equipment Sales Growth
5 Americas
5.1 Americas IC Advanced Packaging Equipment Sales by Country
5.1.1 Americas IC Advanced Packaging Equipment Sales by Country (2020-2025)
5.1.2 Americas IC Advanced Packaging Equipment Revenue by Country (2020-2025)
5.2 Americas IC Advanced Packaging Equipment Sales by Type (2020-2025)
5.3 Americas IC Advanced Packaging Equipment Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC IC Advanced Packaging Equipment Sales by Region
6.1.1 APAC IC Advanced Packaging Equipment Sales by Region (2020-2025)
6.1.2 APAC IC Advanced Packaging Equipment Revenue by Region (2020-2025)
6.2 APAC IC Advanced Packaging Equipment Sales by Type (2020-2025)
6.3 APAC IC Advanced Packaging Equipment Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe IC Advanced Packaging Equipment by Country
7.1.1 Europe IC Advanced Packaging Equipment Sales by Country (2020-2025)
7.1.2 Europe IC Advanced Packaging Equipment Revenue by Country (2020-2025)
7.2 Europe IC Advanced Packaging Equipment Sales by Type (2020-2025)
7.3 Europe IC Advanced Packaging Equipment Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa IC Advanced Packaging Equipment by Country
8.1.1 Middle East & Africa IC Advanced Packaging Equipment Sales by Country (2020-2025)
8.1.2 Middle East & Africa IC Advanced Packaging Equipment Revenue by Country (2020-2025)
8.2 Middle East & Africa IC Advanced Packaging Equipment Sales by Type (2020-2025)
8.3 Middle East & Africa IC Advanced Packaging Equipment Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of IC Advanced Packaging Equipment
10.3 Manufacturing Process Analysis of IC Advanced Packaging Equipment
10.4 Industry Chain Structure of IC Advanced Packaging Equipment
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 IC Advanced Packaging Equipment Distributors
11.3 IC Advanced Packaging Equipment Customer
12 World Forecast Review for IC Advanced Packaging Equipment by Geographic Region
12.1 Global IC Advanced Packaging Equipment Market Size Forecast by Region
12.1.1 Global IC Advanced Packaging Equipment Forecast by Region (2026-2031)
12.1.2 Global IC Advanced Packaging Equipment Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global IC Advanced Packaging Equipment Forecast by Type (2026-2031)
12.7 Global IC Advanced Packaging Equipment Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 ASM Pacific
13.1.1 ASM Pacific Company Information
13.1.2 ASM Pacific IC Advanced Packaging Equipment Product Portfolios and Specifications
13.1.3 ASM Pacific IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 ASM Pacific Main Business Overview
13.1.5 ASM Pacific Latest Developments
13.2 Applied Material
13.2.1 Applied Material Company Information
13.2.2 Applied Material IC Advanced Packaging Equipment Product Portfolios and Specifications
13.2.3 Applied Material IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Applied Material Main Business Overview
13.2.5 Applied Material Latest Developments
13.3 Advantest
13.3.1 Advantest Company Information
13.3.2 Advantest IC Advanced Packaging Equipment Product Portfolios and Specifications
13.3.3 Advantest IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 Advantest Main Business Overview
13.3.5 Advantest Latest Developments
13.4 Kulicke&Soffa
13.4.1 Kulicke&Soffa Company Information
13.4.2 Kulicke&Soffa IC Advanced Packaging Equipment Product Portfolios and Specifications
13.4.3 Kulicke&Soffa IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Kulicke&Soffa Main Business Overview
13.4.5 Kulicke&Soffa Latest Developments
13.5 DISCO
13.5.1 DISCO Company Information
13.5.2 DISCO IC Advanced Packaging Equipment Product Portfolios and Specifications
13.5.3 DISCO IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 DISCO Main Business Overview
13.5.5 DISCO Latest Developments
13.6 Tokyo Seimitsu
13.6.1 Tokyo Seimitsu Company Information
13.6.2 Tokyo Seimitsu IC Advanced Packaging Equipment Product Portfolios and Specifications
13.6.3 Tokyo Seimitsu IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Tokyo Seimitsu Main Business Overview
13.6.5 Tokyo Seimitsu Latest Developments
13.7 BESI
13.7.1 BESI Company Information
13.7.2 BESI IC Advanced Packaging Equipment Product Portfolios and Specifications
13.7.3 BESI IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 BESI Main Business Overview
13.7.5 BESI Latest Developments
13.8 Hitachi
13.8.1 Hitachi Company Information
13.8.2 Hitachi IC Advanced Packaging Equipment Product Portfolios and Specifications
13.8.3 Hitachi IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Hitachi Main Business Overview
13.8.5 Hitachi Latest Developments
13.9 Teradyne
13.9.1 Teradyne Company Information
13.9.2 Teradyne IC Advanced Packaging Equipment Product Portfolios and Specifications
13.9.3 Teradyne IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Teradyne Main Business Overview
13.9.5 Teradyne Latest Developments
13.10 Hanmi
13.10.1 Hanmi Company Information
13.10.2 Hanmi IC Advanced Packaging Equipment Product Portfolios and Specifications
13.10.3 Hanmi IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Hanmi Main Business Overview
13.10.5 Hanmi Latest Developments
13.11 Toray Engineering
13.11.1 Toray Engineering Company Information
13.11.2 Toray Engineering IC Advanced Packaging Equipment Product Portfolios and Specifications
13.11.3 Toray Engineering IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 Toray Engineering Main Business Overview
13.11.5 Toray Engineering Latest Developments
13.12 Shinkawa
13.12.1 Shinkawa Company Information
13.12.2 Shinkawa IC Advanced Packaging Equipment Product Portfolios and Specifications
13.12.3 Shinkawa IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 Shinkawa Main Business Overview
13.12.5 Shinkawa Latest Developments
13.13 COHU Semiconductor
13.13.1 COHU Semiconductor Company Information
13.13.2 COHU Semiconductor IC Advanced Packaging Equipment Product Portfolios and Specifications
13.13.3 COHU Semiconductor IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.13.4 COHU Semiconductor Main Business Overview
13.13.5 COHU Semiconductor Latest Developments
13.14 TOWA
13.14.1 TOWA Company Information
13.14.2 TOWA IC Advanced Packaging Equipment Product Portfolios and Specifications
13.14.3 TOWA IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.14.4 TOWA Main Business Overview
13.14.5 TOWA Latest Developments
13.15 SUSS Microtec
13.15.1 SUSS Microtec Company Information
13.15.2 SUSS Microtec IC Advanced Packaging Equipment Product Portfolios and Specifications
13.15.3 SUSS Microtec IC Advanced Packaging Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
13.15.4 SUSS Microtec Main Business Overview
13.15.5 SUSS Microtec Latest Developments
14 Research Findings and Conclusion
听
听
*If Applicable.