The global IC Package Substrates market size was valued at US$ million in 2023. With growing demand in downstream market, the IC Package Substrates is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during review period.
The research report highlights the growth potential of the global IC Package Substrates market. IC Package Substrates are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of IC Package Substrates. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the IC Package Substrates market.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.
Key Features:
The report on IC Package Substrates market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the IC Package Substrates market. It may include historical data, market segmentation by Type (e.g., FC-BGA, FC-CSP), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the IC Package Substrates market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the IC Package Substrates market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the IC Package Substrates industry. This include advancements in IC Package Substrates technology, IC Package Substrates new entrants, IC Package Substrates new investment, and other innovations that are shaping the future of IC Package Substrates.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the IC Package Substrates market. It includes factors influencing customer ' purchasing decisions, preferences for IC Package Substrates product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the IC Package Substrates market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting IC Package Substrates market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the IC Package Substrates market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the IC Package Substrates industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the IC Package Substrates market.
Market Segmentation:
IC Package Substrates market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Segmentation by type
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Others
Segmentation by application
Smart Phone
PC (tablet and Laptop)
Wearable Device
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
LG InnoTek
Simmtech
Shennan Circuit
Shenzhen Fastprint Circuit Tech
ACCESS
Suntak Technology
National Center for Advanced Packaging (NCAP China)
Huizhou China Eagle Electronic Technology
DSBJ
Shenzhen Kinwong Electronic
AKM Meadville
Victory Giant Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global IC Package Substrates market?
What factors are driving IC Package Substrates market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Package Substrates market opportunities vary by end market size?
How does IC Package Substrates break out type, application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global IC Package Substrates Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for IC Package Substrates by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for IC Package Substrates by Country/Region, 2019, 2023 & 2030
2.2 IC Package Substrates Segment by Type
2.2.1 FC-BGA
2.2.2 FC-CSP
2.2.3 WB BGA
2.2.4 WB CSP
2.2.5 RF Module
2.2.6 Others
2.3 IC Package Substrates Sales by Type
2.3.1 Global IC Package Substrates Sales Market Share by Type (2019-2024)
2.3.2 Global IC Package Substrates Revenue and Market Share by Type (2019-2024)
2.3.3 Global IC Package Substrates Sale Price by Type (2019-2024)
2.4 IC Package Substrates Segment by Application
2.4.1 Smart Phone
2.4.2 PC (tablet and Laptop)
2.4.3 Wearable Device
2.4.4 Others
2.5 IC Package Substrates Sales by Application
2.5.1 Global IC Package Substrates Sale Market Share by Application (2019-2024)
2.5.2 Global IC Package Substrates Revenue and Market Share by Application (2019-2024)
2.5.3 Global IC Package Substrates Sale Price by Application (2019-2024)
3 Global IC Package Substrates by Company
3.1 Global IC Package Substrates Breakdown Data by Company
3.1.1 Global IC Package Substrates Annual Sales by Company (2019-2024)
3.1.2 Global IC Package Substrates Sales Market Share by Company (2019-2024)
3.2 Global IC Package Substrates Annual Revenue by Company (2019-2024)
3.2.1 Global IC Package Substrates Revenue by Company (2019-2024)
3.2.2 Global IC Package Substrates Revenue Market Share by Company (2019-2024)
3.3 Global IC Package Substrates Sale Price by Company
3.4 Key Manufacturers IC Package Substrates Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers IC Package Substrates Product Location Distribution
3.4.2 Players IC Package Substrates Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for IC Package Substrates by Geographic Region
4.1 World Historic IC Package Substrates Market Size by Geographic Region (2019-2024)
4.1.1 Global IC Package Substrates Annual Sales by Geographic Region (2019-2024)
4.1.2 Global IC Package Substrates Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic IC Package Substrates Market Size by Country/Region (2019-2024)
4.2.1 Global IC Package Substrates Annual Sales by Country/Region (2019-2024)
4.2.2 Global IC Package Substrates Annual Revenue by Country/Region (2019-2024)
4.3 Americas IC Package Substrates Sales Growth
4.4 APAC IC Package Substrates Sales Growth
4.5 Europe IC Package Substrates Sales Growth
4.6 Middle East & Africa IC Package Substrates Sales Growth
5 Americas
5.1 Americas IC Package Substrates Sales by Country
5.1.1 Americas IC Package Substrates Sales by Country (2019-2024)
5.1.2 Americas IC Package Substrates Revenue by Country (2019-2024)
5.2 Americas IC Package Substrates Sales by Type
5.3 Americas IC Package Substrates Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC IC Package Substrates Sales by Region
6.1.1 APAC IC Package Substrates Sales by Region (2019-2024)
6.1.2 APAC IC Package Substrates Revenue by Region (2019-2024)
6.2 APAC IC Package Substrates Sales by Type
6.3 APAC IC Package Substrates Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe IC Package Substrates by Country
7.1.1 Europe IC Package Substrates Sales by Country (2019-2024)
7.1.2 Europe IC Package Substrates Revenue by Country (2019-2024)
7.2 Europe IC Package Substrates Sales by Type
7.3 Europe IC Package Substrates Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa IC Package Substrates by Country
8.1.1 Middle East & Africa IC Package Substrates Sales by Country (2019-2024)
8.1.2 Middle East & Africa IC Package Substrates Revenue by Country (2019-2024)
8.2 Middle East & Africa IC Package Substrates Sales by Type
8.3 Middle East & Africa IC Package Substrates Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of IC Package Substrates
10.3 Manufacturing Process Analysis of IC Package Substrates
10.4 Industry Chain Structure of IC Package Substrates
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 IC Package Substrates Distributors
11.3 IC Package Substrates Customer
12 World Forecast Review for IC Package Substrates by Geographic Region
12.1 Global IC Package Substrates Market Size Forecast by Region
12.1.1 Global IC Package Substrates Forecast by Region (2025-2030)
12.1.2 Global IC Package Substrates Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global IC Package Substrates Forecast by Type
12.7 Global IC Package Substrates Forecast by Application
13 Key Players Analysis
13.1 Unimicron
13.1.1 Unimicron Company Information
13.1.2 Unimicron IC Package Substrates Product Portfolios and Specifications
13.1.3 Unimicron IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Unimicron Main Business Overview
13.1.5 Unimicron Latest Developments
13.2 Ibiden
13.2.1 Ibiden Company Information
13.2.2 Ibiden IC Package Substrates Product Portfolios and Specifications
13.2.3 Ibiden IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Ibiden Main Business Overview
13.2.5 Ibiden Latest Developments
13.3 Nan Ya PCB
13.3.1 Nan Ya PCB Company Information
13.3.2 Nan Ya PCB IC Package Substrates Product Portfolios and Specifications
13.3.3 Nan Ya PCB IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Nan Ya PCB Main Business Overview
13.3.5 Nan Ya PCB Latest Developments
13.4 Shinko Electric Industries
13.4.1 Shinko Electric Industries Company Information
13.4.2 Shinko Electric Industries IC Package Substrates Product Portfolios and Specifications
13.4.3 Shinko Electric Industries IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Shinko Electric Industries Main Business Overview
13.4.5 Shinko Electric Industries Latest Developments
13.5 Kinsus Interconnect Technology
13.5.1 Kinsus Interconnect Technology Company Information
13.5.2 Kinsus Interconnect Technology IC Package Substrates Product Portfolios and Specifications
13.5.3 Kinsus Interconnect Technology IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Kinsus Interconnect Technology Main Business Overview
13.5.5 Kinsus Interconnect Technology Latest Developments
13.6 AT&S
13.6.1 AT&S Company Information
13.6.2 AT&S IC Package Substrates Product Portfolios and Specifications
13.6.3 AT&S IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 AT&S Main Business Overview
13.6.5 AT&S Latest Developments
13.7 Semco
13.7.1 Semco Company Information
13.7.2 Semco IC Package Substrates Product Portfolios and Specifications
13.7.3 Semco IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Semco Main Business Overview
13.7.5 Semco Latest Developments
13.8 Kyocera
13.8.1 Kyocera Company Information
13.8.2 Kyocera IC Package Substrates Product Portfolios and Specifications
13.8.3 Kyocera IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Kyocera Main Business Overview
13.8.5 Kyocera Latest Developments
13.9 TOPPAN
13.9.1 TOPPAN Company Information
13.9.2 TOPPAN IC Package Substrates Product Portfolios and Specifications
13.9.3 TOPPAN IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 TOPPAN Main Business Overview
13.9.5 TOPPAN Latest Developments
13.10 Zhen Ding Technology
13.10.1 Zhen Ding Technology Company Information
13.10.2 Zhen Ding Technology IC Package Substrates Product Portfolios and Specifications
13.10.3 Zhen Ding Technology IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Zhen Ding Technology Main Business Overview
13.10.5 Zhen Ding Technology Latest Developments
13.11 Daeduck Electronics
13.11.1 Daeduck Electronics Company Information
13.11.2 Daeduck Electronics IC Package Substrates Product Portfolios and Specifications
13.11.3 Daeduck Electronics IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Daeduck Electronics Main Business Overview
13.11.5 Daeduck Electronics Latest Developments
13.12 ASE Material
13.12.1 ASE Material Company Information
13.12.2 ASE Material IC Package Substrates Product Portfolios and Specifications
13.12.3 ASE Material IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 ASE Material Main Business Overview
13.12.5 ASE Material Latest Developments
13.13 LG InnoTek
13.13.1 LG InnoTek Company Information
13.13.2 LG InnoTek IC Package Substrates Product Portfolios and Specifications
13.13.3 LG InnoTek IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 LG InnoTek Main Business Overview
13.13.5 LG InnoTek Latest Developments
13.14 Simmtech
13.14.1 Simmtech Company Information
13.14.2 Simmtech IC Package Substrates Product Portfolios and Specifications
13.14.3 Simmtech IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 Simmtech Main Business Overview
13.14.5 Simmtech Latest Developments
13.15 Shennan Circuit
13.15.1 Shennan Circuit Company Information
13.15.2 Shennan Circuit IC Package Substrates Product Portfolios and Specifications
13.15.3 Shennan Circuit IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Shennan Circuit Main Business Overview
13.15.5 Shennan Circuit Latest Developments
13.16 Shenzhen Fastprint Circuit Tech
13.16.1 Shenzhen Fastprint Circuit Tech Company Information
13.16.2 Shenzhen Fastprint Circuit Tech IC Package Substrates Product Portfolios and Specifications
13.16.3 Shenzhen Fastprint Circuit Tech IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 Shenzhen Fastprint Circuit Tech Main Business Overview
13.16.5 Shenzhen Fastprint Circuit Tech Latest Developments
13.17 ACCESS
13.17.1 ACCESS Company Information
13.17.2 ACCESS IC Package Substrates Product Portfolios and Specifications
13.17.3 ACCESS IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.17.4 ACCESS Main Business Overview
13.17.5 ACCESS Latest Developments
13.18 Suntak Technology
13.18.1 Suntak Technology Company Information
13.18.2 Suntak Technology IC Package Substrates Product Portfolios and Specifications
13.18.3 Suntak Technology IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.18.4 Suntak Technology Main Business Overview
13.18.5 Suntak Technology Latest Developments
13.19 National Center for Advanced Packaging (NCAP China)
13.19.1 National Center for Advanced Packaging (NCAP China) Company Information
13.19.2 National Center for Advanced Packaging (NCAP China) IC Package Substrates Product Portfolios and Specifications
13.19.3 National Center for Advanced Packaging (NCAP China) IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.19.4 National Center for Advanced Packaging (NCAP China) Main Business Overview
13.19.5 National Center for Advanced Packaging (NCAP China) Latest Developments
13.20 Huizhou China Eagle Electronic Technology
13.20.1 Huizhou China Eagle Electronic Technology Company Information
13.20.2 Huizhou China Eagle Electronic Technology IC Package Substrates Product Portfolios and Specifications
13.20.3 Huizhou China Eagle Electronic Technology IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.20.4 Huizhou China Eagle Electronic Technology Main Business Overview
13.20.5 Huizhou China Eagle Electronic Technology Latest Developments
13.21 DSBJ
13.21.1 DSBJ Company Information
13.21.2 DSBJ IC Package Substrates Product Portfolios and Specifications
13.21.3 DSBJ IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.21.4 DSBJ Main Business Overview
13.21.5 DSBJ Latest Developments
13.22 Shenzhen Kinwong Electronic
13.22.1 Shenzhen Kinwong Electronic Company Information
13.22.2 Shenzhen Kinwong Electronic IC Package Substrates Product Portfolios and Specifications
13.22.3 Shenzhen Kinwong Electronic IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.22.4 Shenzhen Kinwong Electronic Main Business Overview
13.22.5 Shenzhen Kinwong Electronic Latest Developments
13.23 AKM Meadville
13.23.1 AKM Meadville Company Information
13.23.2 AKM Meadville IC Package Substrates Product Portfolios and Specifications
13.23.3 AKM Meadville IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.23.4 AKM Meadville Main Business Overview
13.23.5 AKM Meadville Latest Developments
13.24 Victory Giant Technology
13.24.1 Victory Giant Technology Company Information
13.24.2 Victory Giant Technology IC Package Substrates Product Portfolios and Specifications
13.24.3 Victory Giant Technology IC Package Substrates Sales, Revenue, Price and Gross Margin (2019-2024)
13.24.4 Victory Giant Technology Main Business Overview
13.24.5 Victory Giant Technology Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
