The global IC Packaging and Testing Service market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
The 鈥淚C Packaging and Testing Service Industry Forecast鈥� looks at past sales and reviews total world IC Packaging and Testing Service sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Packaging and Testing Service sales for 2025 through 2031. With IC Packaging and Testing Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Packaging and Testing Service industry.
This Insight Report provides a comprehensive analysis of the global IC Packaging and Testing Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on IC Packaging and Testing Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global IC Packaging and Testing Service market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Packaging and Testing Service and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Packaging and Testing Service.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging and Testing Service market by product type, application, key players and key regions and countries.
Segmentation by Type:
IDM
OSAT
Segmentation by Application:
Communication
Automotive Electronics
Industrial
Consumer Electronics
Computing and Networking
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global IC Packaging and Testing Service Market Size (2020-2031)
2.1.2 IC Packaging and Testing Service Market Size CAGR by Region (2020 VS 2024 VS 2031)
2.1.3 World Current & Future Analysis for IC Packaging and Testing Service by Country/Region (2020, 2024 & 2031)
2.2 IC Packaging and Testing Service Segment by Type
2.2.1 IDM
2.2.2 OSAT
2.3 IC Packaging and Testing Service Market Size by Type
2.3.1 IC Packaging and Testing Service Market Size CAGR by Type (2020 VS 2024 VS 2031)
2.3.2 Global IC Packaging and Testing Service Market Size Market Share by Type (2020-2025)
2.4 IC Packaging and Testing Service Segment by Application
2.4.1 Communication
2.4.2 Automotive Electronics
2.4.3 Industrial
2.4.4 Consumer Electronics
2.4.5 Computing and Networking
2.4.6 Other
2.5 IC Packaging and Testing Service Market Size by Application
2.5.1 IC Packaging and Testing Service Market Size CAGR by Application (2020 VS 2024 VS 2031)
2.5.2 Global IC Packaging and Testing Service Market Size Market Share by Application (2020-2025)
3 IC Packaging and Testing Service Market Size by Player
3.1 IC Packaging and Testing Service Market Size Market Share by Player
3.1.1 Global IC Packaging and Testing Service Revenue by Player (2020-2025)
3.1.2 Global IC Packaging and Testing Service Revenue Market Share by Player (2020-2025)
3.2 Global IC Packaging and Testing Service Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 IC Packaging and Testing Service by Region
4.1 IC Packaging and Testing Service Market Size by Region (2020-2025)
4.2 Global IC Packaging and Testing Service Annual Revenue by Country/Region (2020-2025)
4.3 Americas IC Packaging and Testing Service Market Size Growth (2020-2025)
4.4 APAC IC Packaging and Testing Service Market Size Growth (2020-2025)
4.5 Europe IC Packaging and Testing Service Market Size Growth (2020-2025)
4.6 Middle East & Africa IC Packaging and Testing Service Market Size Growth (2020-2025)
5 Americas
5.1 Americas IC Packaging and Testing Service Market Size by Country (2020-2025)
5.2 Americas IC Packaging and Testing Service Market Size by Type (2020-2025)
5.3 Americas IC Packaging and Testing Service Market Size by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC IC Packaging and Testing Service Market Size by Region (2020-2025)
6.2 APAC IC Packaging and Testing Service Market Size by Type (2020-2025)
6.3 APAC IC Packaging and Testing Service Market Size by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe IC Packaging and Testing Service Market Size by Country (2020-2025)
7.2 Europe IC Packaging and Testing Service Market Size by Type (2020-2025)
7.3 Europe IC Packaging and Testing Service Market Size by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa IC Packaging and Testing Service by Region (2020-2025)
8.2 Middle East & Africa IC Packaging and Testing Service Market Size by Type (2020-2025)
8.3 Middle East & Africa IC Packaging and Testing Service Market Size by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global IC Packaging and Testing Service Market Forecast
10.1 Global IC Packaging and Testing Service Forecast by Region (2026-2031)
10.1.1 Global IC Packaging and Testing Service Forecast by Region (2026-2031)
10.1.2 Americas IC Packaging and Testing Service Forecast
10.1.3 APAC IC Packaging and Testing Service Forecast
10.1.4 Europe IC Packaging and Testing Service Forecast
10.1.5 Middle East & Africa IC Packaging and Testing Service Forecast
10.2 Americas IC Packaging and Testing Service Forecast by Country (2026-2031)
10.2.1 United States Market IC Packaging and Testing Service Forecast
10.2.2 Canada Market IC Packaging and Testing Service Forecast
10.2.3 Mexico Market IC Packaging and Testing Service Forecast
10.2.4 Brazil Market IC Packaging and Testing Service Forecast
10.3 APAC IC Packaging and Testing Service Forecast by Region (2026-2031)
10.3.1 China IC Packaging and Testing Service Market Forecast
10.3.2 Japan Market IC Packaging and Testing Service Forecast
10.3.3 Korea Market IC Packaging and Testing Service Forecast
10.3.4 Southeast Asia Market IC Packaging and Testing Service Forecast
10.3.5 India Market IC Packaging and Testing Service Forecast
10.3.6 Australia Market IC Packaging and Testing Service Forecast
10.4 Europe IC Packaging and Testing Service Forecast by Country (2026-2031)
10.4.1 Germany Market IC Packaging and Testing Service Forecast
10.4.2 France Market IC Packaging and Testing Service Forecast
10.4.3 UK Market IC Packaging and Testing Service Forecast
10.4.4 Italy Market IC Packaging and Testing Service Forecast
10.4.5 Russia Market IC Packaging and Testing Service Forecast
10.5 Middle East & Africa IC Packaging and Testing Service Forecast by Region (2026-2031)
10.5.1 Egypt Market IC Packaging and Testing Service Forecast
10.5.2 South Africa Market IC Packaging and Testing Service Forecast
10.5.3 Israel Market IC Packaging and Testing Service Forecast
10.5.4 Turkey Market IC Packaging and Testing Service Forecast
10.6 Global IC Packaging and Testing Service Forecast by Type (2026-2031)
10.7 Global IC Packaging and Testing Service Forecast by Application (2026-2031)
10.7.1 GCC Countries Market IC Packaging and Testing Service Forecast
11 Key Players Analysis
11.1 Intel
11.1.1 Intel Company Information
11.1.2 Intel IC Packaging and Testing Service Product Offered
11.1.3 Intel IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.1.4 Intel Main Business Overview
11.1.5 Intel Latest Developments
11.2 Samsung
11.2.1 Samsung Company Information
11.2.2 Samsung IC Packaging and Testing Service Product Offered
11.2.3 Samsung IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.2.4 Samsung Main Business Overview
11.2.5 Samsung Latest Developments
11.3 SK Hynix
11.3.1 SK Hynix Company Information
11.3.2 SK Hynix IC Packaging and Testing Service Product Offered
11.3.3 SK Hynix IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.3.4 SK Hynix Main Business Overview
11.3.5 SK Hynix Latest Developments
11.4 Micron
11.4.1 Micron Company Information
11.4.2 Micron IC Packaging and Testing Service Product Offered
11.4.3 Micron IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.4.4 Micron Main Business Overview
11.4.5 Micron Latest Developments
11.5 ASE Group
11.5.1 ASE Group Company Information
11.5.2 ASE Group IC Packaging and Testing Service Product Offered
11.5.3 ASE Group IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.5.4 ASE Group Main Business Overview
11.5.5 ASE Group Latest Developments
11.6 Amkor Technology, Inc.
11.6.1 Amkor Technology, Inc. Company Information
11.6.2 Amkor Technology, Inc. IC Packaging and Testing Service Product Offered
11.6.3 Amkor Technology, Inc. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.6.4 Amkor Technology, Inc. Main Business Overview
11.6.5 Amkor Technology, Inc. Latest Developments
11.7 Huatian Technology
11.7.1 Huatian Technology Company Information
11.7.2 Huatian Technology IC Packaging and Testing Service Product Offered
11.7.3 Huatian Technology IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.7.4 Huatian Technology Main Business Overview
11.7.5 Huatian Technology Latest Developments
11.8 Powertech Technology, Inc.
11.8.1 Powertech Technology, Inc. Company Information
11.8.2 Powertech Technology, Inc. IC Packaging and Testing Service Product Offered
11.8.3 Powertech Technology, Inc. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.8.4 Powertech Technology, Inc. Main Business Overview
11.8.5 Powertech Technology, Inc. Latest Developments
11.9 Chipbond
11.9.1 Chipbond Company Information
11.9.2 Chipbond IC Packaging and Testing Service Product Offered
11.9.3 Chipbond IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.9.4 Chipbond Main Business Overview
11.9.5 Chipbond Latest Developments
11.10 Presto Engineering
11.10.1 Presto Engineering Company Information
11.10.2 Presto Engineering IC Packaging and Testing Service Product Offered
11.10.3 Presto Engineering IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.10.4 Presto Engineering Main Business Overview
11.10.5 Presto Engineering Latest Developments
11.11 JECT
11.11.1 JECT Company Information
11.11.2 JECT IC Packaging and Testing Service Product Offered
11.11.3 JECT IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.11.4 JECT Main Business Overview
11.11.5 JECT Latest Developments
11.12 Siliconware Precision Industries Co., Ltd.
11.12.1 Siliconware Precision Industries Co., Ltd. Company Information
11.12.2 Siliconware Precision Industries Co., Ltd. IC Packaging and Testing Service Product Offered
11.12.3 Siliconware Precision Industries Co., Ltd. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.12.4 Siliconware Precision Industries Co., Ltd. Main Business Overview
11.12.5 Siliconware Precision Industries Co., Ltd. Latest Developments
11.13 Tongfu Microelectronics
11.13.1 Tongfu Microelectronics Company Information
11.13.2 Tongfu Microelectronics IC Packaging and Testing Service Product Offered
11.13.3 Tongfu Microelectronics IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.13.4 Tongfu Microelectronics Main Business Overview
11.13.5 Tongfu Microelectronics Latest Developments
11.14 Tower Semiconductor
11.14.1 Tower Semiconductor Company Information
11.14.2 Tower Semiconductor IC Packaging and Testing Service Product Offered
11.14.3 Tower Semiconductor IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.14.4 Tower Semiconductor Main Business Overview
11.14.5 Tower Semiconductor Latest Developments
11.15 Qualcomm
11.15.1 Qualcomm Company Information
11.15.2 Qualcomm IC Packaging and Testing Service Product Offered
11.15.3 Qualcomm IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.15.4 Qualcomm Main Business Overview
11.15.5 Qualcomm Latest Developments
11.16 MediaTek
11.16.1 MediaTek Company Information
11.16.2 MediaTek IC Packaging and Testing Service Product Offered
11.16.3 MediaTek IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.16.4 MediaTek Main Business Overview
11.16.5 MediaTek Latest Developments
11.17 UMC
11.17.1 UMC Company Information
11.17.2 UMC IC Packaging and Testing Service Product Offered
11.17.3 UMC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.17.4 UMC Main Business Overview
11.17.5 UMC Latest Developments
11.18 Apple
11.18.1 Apple Company Information
11.18.2 Apple IC Packaging and Testing Service Product Offered
11.18.3 Apple IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.18.4 Apple Main Business Overview
11.18.5 Apple Latest Developments
11.19 IBM
11.19.1 IBM Company Information
11.19.2 IBM IC Packaging and Testing Service Product Offered
11.19.3 IBM IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.19.4 IBM Main Business Overview
11.19.5 IBM Latest Developments
11.20 Graphcore
11.20.1 Graphcore Company Information
11.20.2 Graphcore IC Packaging and Testing Service Product Offered
11.20.3 Graphcore IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.20.4 Graphcore Main Business Overview
11.20.5 Graphcore Latest Developments
11.21 ADLINK
11.21.1 ADLINK Company Information
11.21.2 ADLINK IC Packaging and Testing Service Product Offered
11.21.3 ADLINK IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.21.4 ADLINK Main Business Overview
11.21.5 ADLINK Latest Developments
11.22 Kioxia
11.22.1 Kioxia Company Information
11.22.2 Kioxia IC Packaging and Testing Service Product Offered
11.22.3 Kioxia IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.22.4 Kioxia Main Business Overview
11.22.5 Kioxia Latest Developments
11.23 Texas Instruments
11.23.1 Texas Instruments Company Information
11.23.2 Texas Instruments IC Packaging and Testing Service Product Offered
11.23.3 Texas Instruments IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.23.4 Texas Instruments Main Business Overview
11.23.5 Texas Instruments Latest Developments
11.24 TSMC
11.24.1 TSMC Company Information
11.24.2 TSMC IC Packaging and Testing Service Product Offered
11.24.3 TSMC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.24.4 TSMC Main Business Overview
11.24.5 TSMC Latest Developments
11.25 Analog Devices
11.25.1 Analog Devices Company Information
11.25.2 Analog Devices IC Packaging and Testing Service Product Offered
11.25.3 Analog Devices IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.25.4 Analog Devices Main Business Overview
11.25.5 Analog Devices Latest Developments
11.26 Sony
11.26.1 Sony Company Information
11.26.2 Sony IC Packaging and Testing Service Product Offered
11.26.3 Sony IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.26.4 Sony Main Business Overview
11.26.5 Sony Latest Developments
11.27 Infineon
11.27.1 Infineon Company Information
11.27.2 Infineon IC Packaging and Testing Service Product Offered
11.27.3 Infineon IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.27.4 Infineon Main Business Overview
11.27.5 Infineon Latest Developments
11.28 Bosch
11.28.1 Bosch Company Information
11.28.2 Bosch IC Packaging and Testing Service Product Offered
11.28.3 Bosch IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.28.4 Bosch Main Business Overview
11.28.5 Bosch Latest Developments
11.29 onsemi
11.29.1 onsemi Company Information
11.29.2 onsemi IC Packaging and Testing Service Product Offered
11.29.3 onsemi IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.29.4 onsemi Main Business Overview
11.29.5 onsemi Latest Developments
11.30 Mitsubishi Electric
11.30.1 Mitsubishi Electric Company Information
11.30.2 Mitsubishi Electric IC Packaging and Testing Service Product Offered
11.30.3 Mitsubishi Electric IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.30.4 Mitsubishi Electric Main Business Overview
11.30.5 Mitsubishi Electric Latest Developments
11.31 Micross
11.31.1 Micross Company Information
11.31.2 Micross IC Packaging and Testing Service Product Offered
11.31.3 Micross IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.31.4 Micross Main Business Overview
11.31.5 Micross Latest Developments
11.32 UTAC
11.32.1 UTAC Company Information
11.32.2 UTAC IC Packaging and Testing Service Product Offered
11.32.3 UTAC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.32.4 UTAC Main Business Overview
11.32.5 UTAC Latest Developments
11.33 KYEC
11.33.1 KYEC Company Information
11.33.2 KYEC IC Packaging and Testing Service Product Offered
11.33.3 KYEC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.33.4 KYEC Main Business Overview
11.33.5 KYEC Latest Developments
11.34 ChipMOS
11.34.1 ChipMOS Company Information
11.34.2 ChipMOS IC Packaging and Testing Service Product Offered
11.34.3 ChipMOS IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.34.4 ChipMOS Main Business Overview
11.34.5 ChipMOS Latest Developments
11.35 China Resources Group
11.35.1 China Resources Group Company Information
11.35.2 China Resources Group IC Packaging and Testing Service Product Offered
11.35.3 China Resources Group IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2020-2025)
11.35.4 China Resources Group Main Business Overview
11.35.5 China Resources Group Latest Developments
12 Research Findings and Conclusion
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*If Applicable.
