Global IC Substrates for Memory Market Growth 2025-2031

Publication ID:

LPI03257238

Publication Date:

March 27, 2025

Pages:

115

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global IC Substrates for Memory market size is predicted to grow from US$ 2592 million in 2025 to US$ 3692 million in 2031; it is expected to grow at a CAGR of 6.1% from 2025 to 2031.
Semiconductor package substrates (IC substrates) play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards. Demand for high-speed, high-integration and low power consumption of ICs accompanying the rapid progress of electronics technology such as AI, Cloud computing, Intelligentization of automobiles, and due to the miniaturization and thinning of electronic devices typified by smart phone and wearable devices, semiconductor packages are required further high density, multilayer, low-profile.
This report studies the IC substrates for memory (also called memory substrate), including WBCSP, WB-BGA, and FCCSP, used in DRAM (Volatile memory), NAND Flash (Solid-state Drive, Embedded Storage, and Mobile Memory).
Memory devices refer to components that store information using mediums such as magnetic materials or semiconductors. Semiconductor memory specifically leverages semiconductor materials to store electric charges for information retention, with storage and retrieval processes manifested as the charging or discharging of these materials. As a critical branch of integrated circuits, semiconductor memory plays an essential role in modern electronics.
With the exponential growth in data storage demands driven by modern electronic information systems, the shipment volume of semiconductor memory has been experiencing sustained and significant growth. Simultaneously, breakthroughs in semiconductor wafer fabrication, aligned with Moore's Law, have consistently reduced the cost per unit of storage over the long term. As a result, despite short-term supply-demand fluctuations, the overall market scale exhibits a long-term growth trajectory.
Due to the tight integration of layout design and wafer manufacturing technologies, most leading semiconductor memory wafer manufacturers continue to operate under the IDM (Integrated Device Manufacturer) model. However, the IC packaging substrate market for memory devices is relatively fragmented and highly competitive. Key players in this sector are primarily located in regions such as China Taiwan, South Korea, Japan, and Mainland China. Representative companies include Unimicron Technology, Nanya PCB, Shinko Electric Industries, Samsung Electro-Mechanics, Zhen Ding Technology, Daeduck Electronics, LG InnoTek, Shennan Circuit, Shenzhen Fastprint Circuit Tech, and Shenzhen Hemei Jingyi Semiconductor Technology.
The 鈥淚C Substrates for Memory Industry Forecast鈥� looks at past sales and reviews total world IC Substrates for Memory sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Substrates for Memory sales for 2025 through 2031. With IC Substrates for Memory sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Substrates for Memory industry.
This Insight Report provides a comprehensive analysis of the global IC Substrates for Memory landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Substrates for Memory portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global IC Substrates for Memory market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Substrates for Memory and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Substrates for Memory.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Substrates for Memory market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
WB-CSP
WB-BGA
FCCSP
Segmentation by Application:
Memory Modules
Solid-state Drive
Embedded Storage
Mobile Memory
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Unimicron
Samsung Electro-Mechanics
Nan Ya PCB
Shinko Electric Industries
Zhen Ding Technology
Daeduck Electronics
LG InnoTek
DAISHO DENSHI
Korea Circuit
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Shenzhen Hemei Jingyi Semiconductor Technology
Hong Yuen Electronics
Huizhou China Eagle Electronic Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global IC Substrates for Memory market?
What factors are driving IC Substrates for Memory market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Substrates for Memory market opportunities vary by end market size?
How does IC Substrates for Memory break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global IC Substrates for Memory Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for IC Substrates for Memory by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for IC Substrates for Memory by Country/Region, 2020, 2024 & 2031
2.2 IC Substrates for Memory Segment by Type
2.2.1 WB-CSP
2.2.2 WB-BGA
2.2.3 FCCSP
2.3 IC Substrates for Memory Sales by Type
2.3.1 Global IC Substrates for Memory Sales Market Share by Type (2020-2025)
2.3.2 Global IC Substrates for Memory Revenue and Market Share by Type (2020-2025)
2.3.3 Global IC Substrates for Memory Sale Price by Type (2020-2025)
2.4 IC Substrates for Memory Segment by Application
2.4.1 Memory Modules
2.4.2 Solid-state Drive
2.4.3 Embedded Storage
2.4.4 Mobile Memory
2.5 IC Substrates for Memory Sales by Application
2.5.1 Global IC Substrates for Memory Sale Market Share by Application (2020-2025)
2.5.2 Global IC Substrates for Memory Revenue and Market Share by Application (2020-2025)
2.5.3 Global IC Substrates for Memory Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global IC Substrates for Memory Breakdown Data by Company
3.1.1 Global IC Substrates for Memory Annual Sales by Company (2020-2025)
3.1.2 Global IC Substrates for Memory Sales Market Share by Company (2020-2025)
3.2 Global IC Substrates for Memory Annual Revenue by Company (2020-2025)
3.2.1 Global IC Substrates for Memory Revenue by Company (2020-2025)
3.2.2 Global IC Substrates for Memory Revenue Market Share by Company (2020-2025)
3.3 Global IC Substrates for Memory Sale Price by Company
3.4 Key Manufacturers IC Substrates for Memory Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers IC Substrates for Memory Product Location Distribution
3.4.2 Players IC Substrates for Memory Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for IC Substrates for Memory by Geographic Region
4.1 World Historic IC Substrates for Memory Market Size by Geographic Region (2020-2025)
4.1.1 Global IC Substrates for Memory Annual Sales by Geographic Region (2020-2025)
4.1.2 Global IC Substrates for Memory Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic IC Substrates for Memory Market Size by Country/Region (2020-2025)
4.2.1 Global IC Substrates for Memory Annual Sales by Country/Region (2020-2025)
4.2.2 Global IC Substrates for Memory Annual Revenue by Country/Region (2020-2025)
4.3 Americas IC Substrates for Memory Sales Growth
4.4 APAC IC Substrates for Memory Sales Growth
4.5 Europe IC Substrates for Memory Sales Growth
4.6 Middle East & Africa IC Substrates for Memory Sales Growth
5 Americas
5.1 Americas IC Substrates for Memory Sales by Country
5.1.1 Americas IC Substrates for Memory Sales by Country (2020-2025)
5.1.2 Americas IC Substrates for Memory Revenue by Country (2020-2025)
5.2 Americas IC Substrates for Memory Sales by Type (2020-2025)
5.3 Americas IC Substrates for Memory Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC IC Substrates for Memory Sales by Region
6.1.1 APAC IC Substrates for Memory Sales by Region (2020-2025)
6.1.2 APAC IC Substrates for Memory Revenue by Region (2020-2025)
6.2 APAC IC Substrates for Memory Sales by Type (2020-2025)
6.3 APAC IC Substrates for Memory Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe IC Substrates for Memory by Country
7.1.1 Europe IC Substrates for Memory Sales by Country (2020-2025)
7.1.2 Europe IC Substrates for Memory Revenue by Country (2020-2025)
7.2 Europe IC Substrates for Memory Sales by Type (2020-2025)
7.3 Europe IC Substrates for Memory Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa IC Substrates for Memory by Country
8.1.1 Middle East & Africa IC Substrates for Memory Sales by Country (2020-2025)
8.1.2 Middle East & Africa IC Substrates for Memory Revenue by Country (2020-2025)
8.2 Middle East & Africa IC Substrates for Memory Sales by Type (2020-2025)
8.3 Middle East & Africa IC Substrates for Memory Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of IC Substrates for Memory
10.3 Manufacturing Process Analysis of IC Substrates for Memory
10.4 Industry Chain Structure of IC Substrates for Memory
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 IC Substrates for Memory Distributors
11.3 IC Substrates for Memory Customer
12 World Forecast Review for IC Substrates for Memory by Geographic Region
12.1 Global IC Substrates for Memory Market Size Forecast by Region
12.1.1 Global IC Substrates for Memory Forecast by Region (2026-2031)
12.1.2 Global IC Substrates for Memory Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global IC Substrates for Memory Forecast by Type (2026-2031)
12.7 Global IC Substrates for Memory Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Unimicron
13.1.1 Unimicron Company Information
13.1.2 Unimicron IC Substrates for Memory Product Portfolios and Specifications
13.1.3 Unimicron IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Unimicron Main Business Overview
13.1.5 Unimicron Latest Developments
13.2 Samsung Electro-Mechanics
13.2.1 Samsung Electro-Mechanics Company Information
13.2.2 Samsung Electro-Mechanics IC Substrates for Memory Product Portfolios and Specifications
13.2.3 Samsung Electro-Mechanics IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Samsung Electro-Mechanics Main Business Overview
13.2.5 Samsung Electro-Mechanics Latest Developments
13.3 Nan Ya PCB
13.3.1 Nan Ya PCB Company Information
13.3.2 Nan Ya PCB IC Substrates for Memory Product Portfolios and Specifications
13.3.3 Nan Ya PCB IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 Nan Ya PCB Main Business Overview
13.3.5 Nan Ya PCB Latest Developments
13.4 Shinko Electric Industries
13.4.1 Shinko Electric Industries Company Information
13.4.2 Shinko Electric Industries IC Substrates for Memory Product Portfolios and Specifications
13.4.3 Shinko Electric Industries IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Shinko Electric Industries Main Business Overview
13.4.5 Shinko Electric Industries Latest Developments
13.5 Zhen Ding Technology
13.5.1 Zhen Ding Technology Company Information
13.5.2 Zhen Ding Technology IC Substrates for Memory Product Portfolios and Specifications
13.5.3 Zhen Ding Technology IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Zhen Ding Technology Main Business Overview
13.5.5 Zhen Ding Technology Latest Developments
13.6 Daeduck Electronics
13.6.1 Daeduck Electronics Company Information
13.6.2 Daeduck Electronics IC Substrates for Memory Product Portfolios and Specifications
13.6.3 Daeduck Electronics IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Daeduck Electronics Main Business Overview
13.6.5 Daeduck Electronics Latest Developments
13.7 LG InnoTek
13.7.1 LG InnoTek Company Information
13.7.2 LG InnoTek IC Substrates for Memory Product Portfolios and Specifications
13.7.3 LG InnoTek IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 LG InnoTek Main Business Overview
13.7.5 LG InnoTek Latest Developments
13.8 DAISHO DENSHI
13.8.1 DAISHO DENSHI Company Information
13.8.2 DAISHO DENSHI IC Substrates for Memory Product Portfolios and Specifications
13.8.3 DAISHO DENSHI IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 DAISHO DENSHI Main Business Overview
13.8.5 DAISHO DENSHI Latest Developments
13.9 Korea Circuit
13.9.1 Korea Circuit Company Information
13.9.2 Korea Circuit IC Substrates for Memory Product Portfolios and Specifications
13.9.3 Korea Circuit IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Korea Circuit Main Business Overview
13.9.5 Korea Circuit Latest Developments
13.10 Shennan Circuit
13.10.1 Shennan Circuit Company Information
13.10.2 Shennan Circuit IC Substrates for Memory Product Portfolios and Specifications
13.10.3 Shennan Circuit IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Shennan Circuit Main Business Overview
13.10.5 Shennan Circuit Latest Developments
13.11 Shenzhen Fastprint Circuit Tech
13.11.1 Shenzhen Fastprint Circuit Tech Company Information
13.11.2 Shenzhen Fastprint Circuit Tech IC Substrates for Memory Product Portfolios and Specifications
13.11.3 Shenzhen Fastprint Circuit Tech IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 Shenzhen Fastprint Circuit Tech Main Business Overview
13.11.5 Shenzhen Fastprint Circuit Tech Latest Developments
13.12 Shenzhen Hemei Jingyi Semiconductor Technology
13.12.1 Shenzhen Hemei Jingyi Semiconductor Technology Company Information
13.12.2 Shenzhen Hemei Jingyi Semiconductor Technology IC Substrates for Memory Product Portfolios and Specifications
13.12.3 Shenzhen Hemei Jingyi Semiconductor Technology IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 Shenzhen Hemei Jingyi Semiconductor Technology Main Business Overview
13.12.5 Shenzhen Hemei Jingyi Semiconductor Technology Latest Developments
13.13 Hong Yuen Electronics
13.13.1 Hong Yuen Electronics Company Information
13.13.2 Hong Yuen Electronics IC Substrates for Memory Product Portfolios and Specifications
13.13.3 Hong Yuen Electronics IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.13.4 Hong Yuen Electronics Main Business Overview
13.13.5 Hong Yuen Electronics Latest Developments
13.14 Huizhou China Eagle Electronic Technology
13.14.1 Huizhou China Eagle Electronic Technology Company Information
13.14.2 Huizhou China Eagle Electronic Technology IC Substrates for Memory Product Portfolios and Specifications
13.14.3 Huizhou China Eagle Electronic Technology IC Substrates for Memory Sales, Revenue, Price and Gross Margin (2020-2025)
13.14.4 Huizhou China Eagle Electronic Technology Main Business Overview
13.14.5 Huizhou China Eagle Electronic Technology Latest Developments
14 Research Findings and Conclusion

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