
The global Land Grid Array (LGA) Packaging market size is predicted to grow from US$ 458 million in 2025 to US$ 709 million in 2031; it is expected to grow at a CAGR of 7.6% from 2025 to 2031.
LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package outline. It is especially suitable for application that required high electrical performance.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
The “Land Grid Array (LGA) Packaging Industry Forecast” looks at past sales and reviews total world Land Grid Array (LGA) Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Land Grid Array (LGA) Packaging sales for 2025 through 2031. With Land Grid Array (LGA) Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Land Grid Array (LGA) Packaging industry.
This Insight Report provides a comprehensive analysis of the global Land Grid Array (LGA) Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Land Grid Array (LGA) Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Land Grid Array (LGA) Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Land Grid Array (LGA) Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Land Grid Array (LGA) Packaging.
This report presents a comprehensive overview, market shares, and growth opportunities of Land Grid Array (LGA) Packaging market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Hot Air Soldering
Infrared Soldering
Segmentation by Application:
Consumer Electronics
Automotive
Optoelectronic Components
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Orient Semiconductor Electronics
NXP
Maxim Integrated
Thales Group
Analog Devices
ASE Holdings
GS Nanotech
Amkor
Key Questions Addressed in this Report
What is the 10-year outlook for the global Land Grid Array (LGA) Packaging market?
What factors are driving Land Grid Array (LGA) Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Land Grid Array (LGA) Packaging market opportunities vary by end market size?
How does Land Grid Array (LGA) Packaging break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Land Grid Array (LGA) Packaging Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Land Grid Array (LGA) Packaging by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Land Grid Array (LGA) Packaging by Country/Region, 2020, 2024 & 2031
2.2 Land Grid Array (LGA) Packaging Segment by Type
2.2.1 Hot Air Soldering
2.2.2 Infrared Soldering
2.3 Land Grid Array (LGA) Packaging Sales by Type
2.3.1 Global Land Grid Array (LGA) Packaging Sales Market Share by Type (2020-2025)
2.3.2 Global Land Grid Array (LGA) Packaging Revenue and Market Share by Type (2020-2025)
2.3.3 Global Land Grid Array (LGA) Packaging Sale Price by Type (2020-2025)
2.4 Land Grid Array (LGA) Packaging Segment by Application
2.4.1 Consumer Electronics
2.4.2 Automotive
2.4.3 Optoelectronic Components
2.4.4 Others
2.5 Land Grid Array (LGA) Packaging Sales by Application
2.5.1 Global Land Grid Array (LGA) Packaging Sale Market Share by Application (2020-2025)
2.5.2 Global Land Grid Array (LGA) Packaging Revenue and Market Share by Application (2020-2025)
2.5.3 Global Land Grid Array (LGA) Packaging Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Land Grid Array (LGA) Packaging Breakdown Data by Company
3.1.1 Global Land Grid Array (LGA) Packaging Annual Sales by Company (2020-2025)
3.1.2 Global Land Grid Array (LGA) Packaging Sales Market Share by Company (2020-2025)
3.2 Global Land Grid Array (LGA) Packaging Annual Revenue by Company (2020-2025)
3.2.1 Global Land Grid Array (LGA) Packaging Revenue by Company (2020-2025)
3.2.2 Global Land Grid Array (LGA) Packaging Revenue Market Share by Company (2020-2025)
3.3 Global Land Grid Array (LGA) Packaging Sale Price by Company
3.4 Key Manufacturers Land Grid Array (LGA) Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Land Grid Array (LGA) Packaging Product Location Distribution
3.4.2 Players Land Grid Array (LGA) Packaging Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Land Grid Array (LGA) Packaging by Geographic Region
4.1 World Historic Land Grid Array (LGA) Packaging Market Size by Geographic Region (2020-2025)
4.1.1 Global Land Grid Array (LGA) Packaging Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Land Grid Array (LGA) Packaging Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Land Grid Array (LGA) Packaging Market Size by Country/Region (2020-2025)
4.2.1 Global Land Grid Array (LGA) Packaging Annual Sales by Country/Region (2020-2025)
4.2.2 Global Land Grid Array (LGA) Packaging Annual Revenue by Country/Region (2020-2025)
4.3 Americas Land Grid Array (LGA) Packaging Sales Growth
4.4 APAC Land Grid Array (LGA) Packaging Sales Growth
4.5 Europe Land Grid Array (LGA) Packaging Sales Growth
4.6 Middle East & Africa Land Grid Array (LGA) Packaging Sales Growth
5 Americas
5.1 Americas Land Grid Array (LGA) Packaging Sales by Country
5.1.1 Americas Land Grid Array (LGA) Packaging Sales by Country (2020-2025)
5.1.2 Americas Land Grid Array (LGA) Packaging Revenue by Country (2020-2025)
5.2 Americas Land Grid Array (LGA) Packaging Sales by Type (2020-2025)
5.3 Americas Land Grid Array (LGA) Packaging Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Land Grid Array (LGA) Packaging Sales by Region
6.1.1 APAC Land Grid Array (LGA) Packaging Sales by Region (2020-2025)
6.1.2 APAC Land Grid Array (LGA) Packaging Revenue by Region (2020-2025)
6.2 APAC Land Grid Array (LGA) Packaging Sales by Type (2020-2025)
6.3 APAC Land Grid Array (LGA) Packaging Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Land Grid Array (LGA) Packaging by Country
7.1.1 Europe Land Grid Array (LGA) Packaging Sales by Country (2020-2025)
7.1.2 Europe Land Grid Array (LGA) Packaging Revenue by Country (2020-2025)
7.2 Europe Land Grid Array (LGA) Packaging Sales by Type (2020-2025)
7.3 Europe Land Grid Array (LGA) Packaging Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Land Grid Array (LGA) Packaging by Country
8.1.1 Middle East & Africa Land Grid Array (LGA) Packaging Sales by Country (2020-2025)
8.1.2 Middle East & Africa Land Grid Array (LGA) Packaging Revenue by Country (2020-2025)
8.2 Middle East & Africa Land Grid Array (LGA) Packaging Sales by Type (2020-2025)
8.3 Middle East & Africa Land Grid Array (LGA) Packaging Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Land Grid Array (LGA) Packaging
10.3 Manufacturing Process Analysis of Land Grid Array (LGA) Packaging
10.4 Industry Chain Structure of Land Grid Array (LGA) Packaging
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Land Grid Array (LGA) Packaging Distributors
11.3 Land Grid Array (LGA) Packaging Customer
12 World Forecast Review for Land Grid Array (LGA) Packaging by Geographic Region
12.1 Global Land Grid Array (LGA) Packaging Market Size Forecast by Region
12.1.1 Global Land Grid Array (LGA) Packaging Forecast by Region (2026-2031)
12.1.2 Global Land Grid Array (LGA) Packaging Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Land Grid Array (LGA) Packaging Forecast by Type (2026-2031)
12.7 Global Land Grid Array (LGA) Packaging Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Orient Semiconductor Electronics
13.1.1 Orient Semiconductor Electronics Company Information
13.1.2 Orient Semiconductor Electronics Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.1.3 Orient Semiconductor Electronics Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Orient Semiconductor Electronics Main Business Overview
13.1.5 Orient Semiconductor Electronics Latest Developments
13.2 NXP
13.2.1 NXP Company Information
13.2.2 NXP Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.2.3 NXP Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 NXP Main Business Overview
13.2.5 NXP Latest Developments
13.3 Maxim Integrated
13.3.1 Maxim Integrated Company Information
13.3.2 Maxim Integrated Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.3.3 Maxim Integrated Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 Maxim Integrated Main Business Overview
13.3.5 Maxim Integrated Latest Developments
13.4 Thales Group
13.4.1 Thales Group Company Information
13.4.2 Thales Group Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.4.3 Thales Group Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Thales Group Main Business Overview
13.4.5 Thales Group Latest Developments
13.5 Analog Devices
13.5.1 Analog Devices Company Information
13.5.2 Analog Devices Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.5.3 Analog Devices Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Analog Devices Main Business Overview
13.5.5 Analog Devices Latest Developments
13.6 ASE Holdings
13.6.1 ASE Holdings Company Information
13.6.2 ASE Holdings Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.6.3 ASE Holdings Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 ASE Holdings Main Business Overview
13.6.5 ASE Holdings Latest Developments
13.7 GS Nanotech
13.7.1 GS Nanotech Company Information
13.7.2 GS Nanotech Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.7.3 GS Nanotech Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 GS Nanotech Main Business Overview
13.7.5 GS Nanotech Latest Developments
13.8 Amkor
13.8.1 Amkor Company Information
13.8.2 Amkor Land Grid Array (LGA) Packaging Product Portfolios and Specifications
13.8.3 Amkor Land Grid Array (LGA) Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Amkor Main Business Overview
13.8.5 Amkor Latest Developments
14 Research Findings and Conclusion
*If Applicable.
