Global LGA Package Core Board Market Growth 2025-2031

Publication ID:

LPI02261371

Publication Date:

February 21, 2025

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global LGA Package Core Board market size is predicted to grow from US$ 106 million in 2025 to US$ 153 million in 2031; it is expected to grow at a CAGR of 6.3% from 2025 to 2031.
The LGA packaged core board is a highly integrated embedded hardware platform that integrates core components such as processors, storage, and peripheral interfaces based on LGA packaging technology. Due to its high performance, excellent heat dissipation performance, and high-density electrical connections, the LGA packaged core board is widely used in embedded computing, industrial control, communications, smart hardware, and other fields, and is suitable for application scenarios that require powerful computing power, compact design, and high reliability.
United States market for LGA Package Core Board is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for LGA Package Core Board is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for LGA Package Core Board is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key LGA Package Core Board players cover Portwell, Myir-tech, ZLG, Firefly, Forlinx, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
The 鈥淟GA Package Core Board Industry Forecast鈥� looks at past sales and reviews total world LGA Package Core Board sales in 2024, providing a comprehensive analysis by region and market sector of projected LGA Package Core Board sales for 2025 through 2031. With LGA Package Core Board sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world LGA Package Core Board industry.
This Insight Report provides a comprehensive analysis of the global LGA Package Core Board landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on LGA Package Core Board portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global LGA Package Core Board market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for LGA Package Core Board and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global LGA Package Core Board.
This report presents a comprehensive overview, market shares, and growth opportunities of LGA Package Core Board market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Main Frequency: 1.6-1.8GHZ
Main Frequency: 1.8-2 GHZ
Other
Segmentation by Application:
PC
Servers and Edge Computing
Cloud Terminals
Industrial Control
Smart Cars
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Portwell
Myir-tech
ZLG
Firefly
Forlinx
Fuzhou Nnewn
SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY
Key Questions Addressed in this Report
What is the 10-year outlook for the global LGA Package Core Board market?
What factors are driving LGA Package Core Board market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do LGA Package Core Board market opportunities vary by end market size?
How does LGA Package Core Board break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global LGA Package Core Board Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for LGA Package Core Board by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for LGA Package Core Board by Country/Region, 2020, 2024 & 2031
2.2 LGA Package Core Board Segment by Type
2.2.1 Main Frequency: 1.6-1.8GHZ
2.2.2 Main Frequency: 1.8-2 GHZ
2.2.3 Other
2.3 LGA Package Core Board Sales by Type
2.3.1 Global LGA Package Core Board Sales Market Share by Type (2020-2025)
2.3.2 Global LGA Package Core Board Revenue and Market Share by Type (2020-2025)
2.3.3 Global LGA Package Core Board Sale Price by Type (2020-2025)
2.4 LGA Package Core Board Segment by Application
2.4.1 PC
2.4.2 Servers and Edge Computing
2.4.3 Cloud Terminals
2.4.4 Industrial Control
2.4.5 Smart Cars
2.4.6 Others
2.5 LGA Package Core Board Sales by Application
2.5.1 Global LGA Package Core Board Sale Market Share by Application (2020-2025)
2.5.2 Global LGA Package Core Board Revenue and Market Share by Application (2020-2025)
2.5.3 Global LGA Package Core Board Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global LGA Package Core Board Breakdown Data by Company
3.1.1 Global LGA Package Core Board Annual Sales by Company (2020-2025)
3.1.2 Global LGA Package Core Board Sales Market Share by Company (2020-2025)
3.2 Global LGA Package Core Board Annual Revenue by Company (2020-2025)
3.2.1 Global LGA Package Core Board Revenue by Company (2020-2025)
3.2.2 Global LGA Package Core Board Revenue Market Share by Company (2020-2025)
3.3 Global LGA Package Core Board Sale Price by Company
3.4 Key Manufacturers LGA Package Core Board Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers LGA Package Core Board Product Location Distribution
3.4.2 Players LGA Package Core Board Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for LGA Package Core Board by Geographic Region
4.1 World Historic LGA Package Core Board Market Size by Geographic Region (2020-2025)
4.1.1 Global LGA Package Core Board Annual Sales by Geographic Region (2020-2025)
4.1.2 Global LGA Package Core Board Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic LGA Package Core Board Market Size by Country/Region (2020-2025)
4.2.1 Global LGA Package Core Board Annual Sales by Country/Region (2020-2025)
4.2.2 Global LGA Package Core Board Annual Revenue by Country/Region (2020-2025)
4.3 Americas LGA Package Core Board Sales Growth
4.4 APAC LGA Package Core Board Sales Growth
4.5 Europe LGA Package Core Board Sales Growth
4.6 Middle East & Africa LGA Package Core Board Sales Growth
5 Americas
5.1 Americas LGA Package Core Board Sales by Country
5.1.1 Americas LGA Package Core Board Sales by Country (2020-2025)
5.1.2 Americas LGA Package Core Board Revenue by Country (2020-2025)
5.2 Americas LGA Package Core Board Sales by Type (2020-2025)
5.3 Americas LGA Package Core Board Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC LGA Package Core Board Sales by Region
6.1.1 APAC LGA Package Core Board Sales by Region (2020-2025)
6.1.2 APAC LGA Package Core Board Revenue by Region (2020-2025)
6.2 APAC LGA Package Core Board Sales by Type (2020-2025)
6.3 APAC LGA Package Core Board Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe LGA Package Core Board by Country
7.1.1 Europe LGA Package Core Board Sales by Country (2020-2025)
7.1.2 Europe LGA Package Core Board Revenue by Country (2020-2025)
7.2 Europe LGA Package Core Board Sales by Type (2020-2025)
7.3 Europe LGA Package Core Board Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa LGA Package Core Board by Country
8.1.1 Middle East & Africa LGA Package Core Board Sales by Country (2020-2025)
8.1.2 Middle East & Africa LGA Package Core Board Revenue by Country (2020-2025)
8.2 Middle East & Africa LGA Package Core Board Sales by Type (2020-2025)
8.3 Middle East & Africa LGA Package Core Board Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of LGA Package Core Board
10.3 Manufacturing Process Analysis of LGA Package Core Board
10.4 Industry Chain Structure of LGA Package Core Board
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 LGA Package Core Board Distributors
11.3 LGA Package Core Board Customer
12 World Forecast Review for LGA Package Core Board by Geographic Region
12.1 Global LGA Package Core Board Market Size Forecast by Region
12.1.1 Global LGA Package Core Board Forecast by Region (2026-2031)
12.1.2 Global LGA Package Core Board Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global LGA Package Core Board Forecast by Type (2026-2031)
12.7 Global LGA Package Core Board Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Portwell
13.1.1 Portwell Company Information
13.1.2 Portwell LGA Package Core Board Product Portfolios and Specifications
13.1.3 Portwell LGA Package Core Board Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Portwell Main Business Overview
13.1.5 Portwell Latest Developments
13.2 Myir-tech
13.2.1 Myir-tech Company Information
13.2.2 Myir-tech LGA Package Core Board Product Portfolios and Specifications
13.2.3 Myir-tech LGA Package Core Board Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Myir-tech Main Business Overview
13.2.5 Myir-tech Latest Developments
13.3 ZLG
13.3.1 ZLG Company Information
13.3.2 ZLG LGA Package Core Board Product Portfolios and Specifications
13.3.3 ZLG LGA Package Core Board Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 ZLG Main Business Overview
13.3.5 ZLG Latest Developments
13.4 Firefly
13.4.1 Firefly Company Information
13.4.2 Firefly LGA Package Core Board Product Portfolios and Specifications
13.4.3 Firefly LGA Package Core Board Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Firefly Main Business Overview
13.4.5 Firefly Latest Developments
13.5 Forlinx
13.5.1 Forlinx Company Information
13.5.2 Forlinx LGA Package Core Board Product Portfolios and Specifications
13.5.3 Forlinx LGA Package Core Board Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Forlinx Main Business Overview
13.5.5 Forlinx Latest Developments
13.6 Fuzhou Nnewn
13.6.1 Fuzhou Nnewn Company Information
13.6.2 Fuzhou Nnewn LGA Package Core Board Product Portfolios and Specifications
13.6.3 Fuzhou Nnewn LGA Package Core Board Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Fuzhou Nnewn Main Business Overview
13.6.5 Fuzhou Nnewn Latest Developments
13.7 SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY
13.7.1 SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY Company Information
13.7.2 SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY LGA Package Core Board Product Portfolios and Specifications
13.7.3 SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY LGA Package Core Board Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY Main Business Overview
13.7.5 SHENZHEN RONGPIN ELECTRONIC TECHNOLOGY Latest Developments
14 Research Findings and Conclusion

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