Global Non Conductive Adhesive for Electronics Market Growth 2024-2030

Publication ID:

LPI07244512

Publication Date:

July 4, 2024

Pages:

131

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Manufacturing (Chemicals) [2]

Chemicals [3]

Description:

A non-conductive adhesive is a type of adhesive that does not conduct electricity when applied or cured. This property makes it suitable for bonding electronic components without creating electrical connections between them, which could cause short circuits or interference.
The global Non Conductive Adhesive for Electronics market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The 鈥淣on Conductive Adhesive for Electronics Industry Forecast鈥� looks at past sales and reviews total world Non Conductive Adhesive for Electronics sales in 2023, providing a comprehensive analysis by region and market sector of projected Non Conductive Adhesive for Electronics sales for 2024 through 2030. With Non Conductive Adhesive for Electronics sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Non Conductive Adhesive for Electronics industry.
This Insight Report provides a comprehensive analysis of the global Non Conductive Adhesive for Electronics landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Non Conductive Adhesive for Electronics portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Non Conductive Adhesive for Electronics market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Non Conductive Adhesive for Electronics and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Non Conductive Adhesive for Electronics.
United States market for Non Conductive Adhesive for Electronics is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Non Conductive Adhesive for Electronics is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Non Conductive Adhesive for Electronics is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Non Conductive Adhesive for Electronics players cover Caplinq, Henkel Corporation, Dow, Inc., 3M Company, Huntsman Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Non Conductive Adhesive for Electronics market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Epoxy Resin-Based Adhesives
Acrylic-Based Adhesives
Silicone-Based Adhesives
Polyurethane-Based Adhesives
Others
Segmentation by Application:
Electronics Assembly
Flip Chip Bonding
LCD Panel Assembly
Flexible Electronics
Photonics Packaging
Semiconductor Packaging
Automotive Electronics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Caplinq
Henkel Corporation
Dow, Inc.
3M Company
Huntsman Corporation
LORD Corporation
H.B. Fuller Company
Permabond Engineering Adhesives
Master Bond Inc.
Loctite (Henkel Corporation)
Cyberbond LLC
Bostik, Inc.
Chemtronics
Panacol-Elosol GmbH
Avery Dennison Corporation
Dymax Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global Non Conductive Adhesive for Electronics market?
What factors are driving Non Conductive Adhesive for Electronics market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Non Conductive Adhesive for Electronics market opportunities vary by end market size?
How does Non Conductive Adhesive for Electronics break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Non Conductive Adhesive for Electronics Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Non Conductive Adhesive for Electronics by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Non Conductive Adhesive for Electronics by Country/Region, 2019, 2023 & 2030
2.2 Non Conductive Adhesive for Electronics Segment by Type
2.2.1 Epoxy Resin-Based Adhesives
2.2.2 Acrylic-Based Adhesives
2.2.3 Silicone-Based Adhesives
2.2.4 Polyurethane-Based Adhesives
2.2.5 Others
2.3 Non Conductive Adhesive for Electronics Sales by Type
2.3.1 Global Non Conductive Adhesive for Electronics Sales Market Share by Type (2019-2024)
2.3.2 Global Non Conductive Adhesive for Electronics Revenue and Market Share by Type (2019-2024)
2.3.3 Global Non Conductive Adhesive for Electronics Sale Price by Type (2019-2024)
2.4 Non Conductive Adhesive for Electronics Segment by Application
2.4.1 Electronics Assembly
2.4.2 Flip Chip Bonding
2.4.3 LCD Panel Assembly
2.4.4 Flexible Electronics
2.4.5 Photonics Packaging
2.4.6 Semiconductor Packaging
2.4.7 Automotive Electronics
2.4.8 Others
2.5 Non Conductive Adhesive for Electronics Sales by Application
2.5.1 Global Non Conductive Adhesive for Electronics Sale Market Share by Application (2019-2024)
2.5.2 Global Non Conductive Adhesive for Electronics Revenue and Market Share by Application (2019-2024)
2.5.3 Global Non Conductive Adhesive for Electronics Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Non Conductive Adhesive for Electronics Breakdown Data by Company
3.1.1 Global Non Conductive Adhesive for Electronics Annual Sales by Company (2019-2024)
3.1.2 Global Non Conductive Adhesive for Electronics Sales Market Share by Company (2019-2024)
3.2 Global Non Conductive Adhesive for Electronics Annual Revenue by Company (2019-2024)
3.2.1 Global Non Conductive Adhesive for Electronics Revenue by Company (2019-2024)
3.2.2 Global Non Conductive Adhesive for Electronics Revenue Market Share by Company (2019-2024)
3.3 Global Non Conductive Adhesive for Electronics Sale Price by Company
3.4 Key Manufacturers Non Conductive Adhesive for Electronics Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Non Conductive Adhesive for Electronics Product Location Distribution
3.4.2 Players Non Conductive Adhesive for Electronics Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Non Conductive Adhesive for Electronics by Geographic Region
4.1 World Historic Non Conductive Adhesive for Electronics Market Size by Geographic Region (2019-2024)
4.1.1 Global Non Conductive Adhesive for Electronics Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Non Conductive Adhesive for Electronics Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Non Conductive Adhesive for Electronics Market Size by Country/Region (2019-2024)
4.2.1 Global Non Conductive Adhesive for Electronics Annual Sales by Country/Region (2019-2024)
4.2.2 Global Non Conductive Adhesive for Electronics Annual Revenue by Country/Region (2019-2024)
4.3 Americas Non Conductive Adhesive for Electronics Sales Growth
4.4 APAC Non Conductive Adhesive for Electronics Sales Growth
4.5 Europe Non Conductive Adhesive for Electronics Sales Growth
4.6 Middle East & Africa Non Conductive Adhesive for Electronics Sales Growth
5 Americas
5.1 Americas Non Conductive Adhesive for Electronics Sales by Country
5.1.1 Americas Non Conductive Adhesive for Electronics Sales by Country (2019-2024)
5.1.2 Americas Non Conductive Adhesive for Electronics Revenue by Country (2019-2024)
5.2 Americas Non Conductive Adhesive for Electronics Sales by Type (2019-2024)
5.3 Americas Non Conductive Adhesive for Electronics Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Non Conductive Adhesive for Electronics Sales by Region
6.1.1 APAC Non Conductive Adhesive for Electronics Sales by Region (2019-2024)
6.1.2 APAC Non Conductive Adhesive for Electronics Revenue by Region (2019-2024)
6.2 APAC Non Conductive Adhesive for Electronics Sales by Type (2019-2024)
6.3 APAC Non Conductive Adhesive for Electronics Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Non Conductive Adhesive for Electronics by Country
7.1.1 Europe Non Conductive Adhesive for Electronics Sales by Country (2019-2024)
7.1.2 Europe Non Conductive Adhesive for Electronics Revenue by Country (2019-2024)
7.2 Europe Non Conductive Adhesive for Electronics Sales by Type (2019-2024)
7.3 Europe Non Conductive Adhesive for Electronics Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Non Conductive Adhesive for Electronics by Country
8.1.1 Middle East & Africa Non Conductive Adhesive for Electronics Sales by Country (2019-2024)
8.1.2 Middle East & Africa Non Conductive Adhesive for Electronics Revenue by Country (2019-2024)
8.2 Middle East & Africa Non Conductive Adhesive for Electronics Sales by Type (2019-2024)
8.3 Middle East & Africa Non Conductive Adhesive for Electronics Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Non Conductive Adhesive for Electronics
10.3 Manufacturing Process Analysis of Non Conductive Adhesive for Electronics
10.4 Industry Chain Structure of Non Conductive Adhesive for Electronics
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Non Conductive Adhesive for Electronics Distributors
11.3 Non Conductive Adhesive for Electronics Customer
12 World Forecast Review for Non Conductive Adhesive for Electronics by Geographic Region
12.1 Global Non Conductive Adhesive for Electronics Market Size Forecast by Region
12.1.1 Global Non Conductive Adhesive for Electronics Forecast by Region (2025-2030)
12.1.2 Global Non Conductive Adhesive for Electronics Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Non Conductive Adhesive for Electronics Forecast by Type (2025-2030)
12.7 Global Non Conductive Adhesive for Electronics Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Caplinq
13.1.1 Caplinq Company Information
13.1.2 Caplinq Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.1.3 Caplinq Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Caplinq Main Business Overview
13.1.5 Caplinq Latest Developments
13.2 Henkel Corporation
13.2.1 Henkel Corporation Company Information
13.2.2 Henkel Corporation Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.2.3 Henkel Corporation Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Henkel Corporation Main Business Overview
13.2.5 Henkel Corporation Latest Developments
13.3 Dow, Inc.
13.3.1 Dow, Inc. Company Information
13.3.2 Dow, Inc. Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.3.3 Dow, Inc. Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Dow, Inc. Main Business Overview
13.3.5 Dow, Inc. Latest Developments
13.4 3M Company
13.4.1 3M Company Company Information
13.4.2 3M Company Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.4.3 3M Company Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 3M Company Main Business Overview
13.4.5 3M Company Latest Developments
13.5 Huntsman Corporation
13.5.1 Huntsman Corporation Company Information
13.5.2 Huntsman Corporation Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.5.3 Huntsman Corporation Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Huntsman Corporation Main Business Overview
13.5.5 Huntsman Corporation Latest Developments
13.6 LORD Corporation
13.6.1 LORD Corporation Company Information
13.6.2 LORD Corporation Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.6.3 LORD Corporation Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 LORD Corporation Main Business Overview
13.6.5 LORD Corporation Latest Developments
13.7 H.B. Fuller Company
13.7.1 H.B. Fuller Company Company Information
13.7.2 H.B. Fuller Company Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.7.3 H.B. Fuller Company Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 H.B. Fuller Company Main Business Overview
13.7.5 H.B. Fuller Company Latest Developments
13.8 Permabond Engineering Adhesives
13.8.1 Permabond Engineering Adhesives Company Information
13.8.2 Permabond Engineering Adhesives Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.8.3 Permabond Engineering Adhesives Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Permabond Engineering Adhesives Main Business Overview
13.8.5 Permabond Engineering Adhesives Latest Developments
13.9 Master Bond Inc.
13.9.1 Master Bond Inc. Company Information
13.9.2 Master Bond Inc. Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.9.3 Master Bond Inc. Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Master Bond Inc. Main Business Overview
13.9.5 Master Bond Inc. Latest Developments
13.10 Loctite (Henkel Corporation)
13.10.1 Loctite (Henkel Corporation) Company Information
13.10.2 Loctite (Henkel Corporation) Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.10.3 Loctite (Henkel Corporation) Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Loctite (Henkel Corporation) Main Business Overview
13.10.5 Loctite (Henkel Corporation) Latest Developments
13.11 Cyberbond LLC
13.11.1 Cyberbond LLC Company Information
13.11.2 Cyberbond LLC Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.11.3 Cyberbond LLC Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Cyberbond LLC Main Business Overview
13.11.5 Cyberbond LLC Latest Developments
13.12 Bostik, Inc.
13.12.1 Bostik, Inc. Company Information
13.12.2 Bostik, Inc. Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.12.3 Bostik, Inc. Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Bostik, Inc. Main Business Overview
13.12.5 Bostik, Inc. Latest Developments
13.13 Chemtronics
13.13.1 Chemtronics Company Information
13.13.2 Chemtronics Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.13.3 Chemtronics Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 Chemtronics Main Business Overview
13.13.5 Chemtronics Latest Developments
13.14 Panacol-Elosol GmbH
13.14.1 Panacol-Elosol GmbH Company Information
13.14.2 Panacol-Elosol GmbH Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.14.3 Panacol-Elosol GmbH Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 Panacol-Elosol GmbH Main Business Overview
13.14.5 Panacol-Elosol GmbH Latest Developments
13.15 Avery Dennison Corporation
13.15.1 Avery Dennison Corporation Company Information
13.15.2 Avery Dennison Corporation Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.15.3 Avery Dennison Corporation Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Avery Dennison Corporation Main Business Overview
13.15.5 Avery Dennison Corporation Latest Developments
13.16 Dymax Corporation
13.16.1 Dymax Corporation Company Information
13.16.2 Dymax Corporation Non Conductive Adhesive for Electronics Product Portfolios and Specifications
13.16.3 Dymax Corporation Non Conductive Adhesive for Electronics Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 Dymax Corporation Main Business Overview
13.16.5 Dymax Corporation Latest Developments
14 Research Findings and Conclusion

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