Global Non-Memory Chip Packaging Substrate Market Growth 2024-2030

Publication ID:

LPI10245386

Publication Date:

November 1, 2024

Pages:

110

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF chips, sensors, etc.). Similar to the memory chip packaging substrate, it plays a key role in chip packaging, providing electrical connection, mechanical support, heat dissipation management and other functions, but its design and application requirements may be different.
The global Non-Memory Chip Packaging Substrate market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The 鈥淣on-Memory Chip Packaging Substrate Industry Forecast鈥� looks at past sales and reviews total world Non-Memory Chip Packaging Substrate sales in 2023, providing a comprehensive analysis by region and market sector of projected Non-Memory Chip Packaging Substrate sales for 2024 through 2030. With Non-Memory Chip Packaging Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Non-Memory Chip Packaging Substrate industry.
This Insight Report provides a comprehensive analysis of the global Non-Memory Chip Packaging Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Non-Memory Chip Packaging Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Non-Memory Chip Packaging Substrate market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Non-Memory Chip Packaging Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Non-Memory Chip Packaging Substrate.
United States market for Non-Memory Chip Packaging Substrate is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Non-Memory Chip Packaging Substrate is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Non-Memory Chip Packaging Substrate is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Non-Memory Chip Packaging Substrate players cover Ibiden, Shinko, kyocera, LGInnotek, Samsung Electro Mechanics, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Non-Memory Chip Packaging Substrate market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Logic Chip Packaging Substrate
Communication Chip Packaging Substrate
Sensor Chip Packaging Substrate
Others
Segmentation by Application:
Consumer Electronics
Industrial Control
Communication Equipment
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Ibiden
Shinko
kyocera
LGInnotek
Samsung Electro Mechanics
AT&S
ASE Group
Unimicron
KINSUS
Hemei Jingyi Technology
NanYa PCB
Simmtech
Key Questions Addressed in this Report
What is the 10-year outlook for the global Non-Memory Chip Packaging Substrate market?
What factors are driving Non-Memory Chip Packaging Substrate market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Non-Memory Chip Packaging Substrate market opportunities vary by end market size?
How does Non-Memory Chip Packaging Substrate break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Non-Memory Chip Packaging Substrate Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Non-Memory Chip Packaging Substrate by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Non-Memory Chip Packaging Substrate by Country/Region, 2019, 2023 & 2030
2.2 Non-Memory Chip Packaging Substrate Segment by Type
2.2.1 Logic Chip Packaging Substrate
2.2.2 Communication Chip Packaging Substrate
2.2.3 Sensor Chip Packaging Substrate
2.2.4 Others
2.3 Non-Memory Chip Packaging Substrate Sales by Type
2.3.1 Global Non-Memory Chip Packaging Substrate Sales Market Share by Type (2019-2024)
2.3.2 Global Non-Memory Chip Packaging Substrate Revenue and Market Share by Type (2019-2024)
2.3.3 Global Non-Memory Chip Packaging Substrate Sale Price by Type (2019-2024)
2.4 Non-Memory Chip Packaging Substrate Segment by Application
2.4.1 Consumer Electronics
2.4.2 Industrial Control
2.4.3 Communication Equipment
2.4.4 Others
2.5 Non-Memory Chip Packaging Substrate Sales by Application
2.5.1 Global Non-Memory Chip Packaging Substrate Sale Market Share by Application (2019-2024)
2.5.2 Global Non-Memory Chip Packaging Substrate Revenue and Market Share by Application (2019-2024)
2.5.3 Global Non-Memory Chip Packaging Substrate Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Non-Memory Chip Packaging Substrate Breakdown Data by Company
3.1.1 Global Non-Memory Chip Packaging Substrate Annual Sales by Company (2019-2024)
3.1.2 Global Non-Memory Chip Packaging Substrate Sales Market Share by Company (2019-2024)
3.2 Global Non-Memory Chip Packaging Substrate Annual Revenue by Company (2019-2024)
3.2.1 Global Non-Memory Chip Packaging Substrate Revenue by Company (2019-2024)
3.2.2 Global Non-Memory Chip Packaging Substrate Revenue Market Share by Company (2019-2024)
3.3 Global Non-Memory Chip Packaging Substrate Sale Price by Company
3.4 Key Manufacturers Non-Memory Chip Packaging Substrate Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Non-Memory Chip Packaging Substrate Product Location Distribution
3.4.2 Players Non-Memory Chip Packaging Substrate Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Non-Memory Chip Packaging Substrate by Geographic Region
4.1 World Historic Non-Memory Chip Packaging Substrate Market Size by Geographic Region (2019-2024)
4.1.1 Global Non-Memory Chip Packaging Substrate Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Non-Memory Chip Packaging Substrate Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Non-Memory Chip Packaging Substrate Market Size by Country/Region (2019-2024)
4.2.1 Global Non-Memory Chip Packaging Substrate Annual Sales by Country/Region (2019-2024)
4.2.2 Global Non-Memory Chip Packaging Substrate Annual Revenue by Country/Region (2019-2024)
4.3 Americas Non-Memory Chip Packaging Substrate Sales Growth
4.4 APAC Non-Memory Chip Packaging Substrate Sales Growth
4.5 Europe Non-Memory Chip Packaging Substrate Sales Growth
4.6 Middle East & Africa Non-Memory Chip Packaging Substrate Sales Growth
5 Americas
5.1 Americas Non-Memory Chip Packaging Substrate Sales by Country
5.1.1 Americas Non-Memory Chip Packaging Substrate Sales by Country (2019-2024)
5.1.2 Americas Non-Memory Chip Packaging Substrate Revenue by Country (2019-2024)
5.2 Americas Non-Memory Chip Packaging Substrate Sales by Type (2019-2024)
5.3 Americas Non-Memory Chip Packaging Substrate Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Non-Memory Chip Packaging Substrate Sales by Region
6.1.1 APAC Non-Memory Chip Packaging Substrate Sales by Region (2019-2024)
6.1.2 APAC Non-Memory Chip Packaging Substrate Revenue by Region (2019-2024)
6.2 APAC Non-Memory Chip Packaging Substrate Sales by Type (2019-2024)
6.3 APAC Non-Memory Chip Packaging Substrate Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Non-Memory Chip Packaging Substrate by Country
7.1.1 Europe Non-Memory Chip Packaging Substrate Sales by Country (2019-2024)
7.1.2 Europe Non-Memory Chip Packaging Substrate Revenue by Country (2019-2024)
7.2 Europe Non-Memory Chip Packaging Substrate Sales by Type (2019-2024)
7.3 Europe Non-Memory Chip Packaging Substrate Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Non-Memory Chip Packaging Substrate by Country
8.1.1 Middle East & Africa Non-Memory Chip Packaging Substrate Sales by Country (2019-2024)
8.1.2 Middle East & Africa Non-Memory Chip Packaging Substrate Revenue by Country (2019-2024)
8.2 Middle East & Africa Non-Memory Chip Packaging Substrate Sales by Type (2019-2024)
8.3 Middle East & Africa Non-Memory Chip Packaging Substrate Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Non-Memory Chip Packaging Substrate
10.3 Manufacturing Process Analysis of Non-Memory Chip Packaging Substrate
10.4 Industry Chain Structure of Non-Memory Chip Packaging Substrate
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Non-Memory Chip Packaging Substrate Distributors
11.3 Non-Memory Chip Packaging Substrate Customer
12 World Forecast Review for Non-Memory Chip Packaging Substrate by Geographic Region
12.1 Global Non-Memory Chip Packaging Substrate Market Size Forecast by Region
12.1.1 Global Non-Memory Chip Packaging Substrate Forecast by Region (2025-2030)
12.1.2 Global Non-Memory Chip Packaging Substrate Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Non-Memory Chip Packaging Substrate Forecast by Type (2025-2030)
12.7 Global Non-Memory Chip Packaging Substrate Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Ibiden
13.1.1 Ibiden Company Information
13.1.2 Ibiden Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.1.3 Ibiden Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Ibiden Main Business Overview
13.1.5 Ibiden Latest Developments
13.2 Shinko
13.2.1 Shinko Company Information
13.2.2 Shinko Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.2.3 Shinko Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Shinko Main Business Overview
13.2.5 Shinko Latest Developments
13.3 kyocera
13.3.1 kyocera Company Information
13.3.2 kyocera Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.3.3 kyocera Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 kyocera Main Business Overview
13.3.5 kyocera Latest Developments
13.4 LGInnotek
13.4.1 LGInnotek Company Information
13.4.2 LGInnotek Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.4.3 LGInnotek Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 LGInnotek Main Business Overview
13.4.5 LGInnotek Latest Developments
13.5 Samsung Electro Mechanics
13.5.1 Samsung Electro Mechanics Company Information
13.5.2 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.5.3 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Samsung Electro Mechanics Main Business Overview
13.5.5 Samsung Electro Mechanics Latest Developments
13.6 AT&S
13.6.1 AT&S Company Information
13.6.2 AT&S Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.6.3 AT&S Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 AT&S Main Business Overview
13.6.5 AT&S Latest Developments
13.7 ASE Group
13.7.1 ASE Group Company Information
13.7.2 ASE Group Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.7.3 ASE Group Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 ASE Group Main Business Overview
13.7.5 ASE Group Latest Developments
13.8 Unimicron
13.8.1 Unimicron Company Information
13.8.2 Unimicron Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.8.3 Unimicron Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Unimicron Main Business Overview
13.8.5 Unimicron Latest Developments
13.9 KINSUS
13.9.1 KINSUS Company Information
13.9.2 KINSUS Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.9.3 KINSUS Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 KINSUS Main Business Overview
13.9.5 KINSUS Latest Developments
13.10 Hemei Jingyi Technology
13.10.1 Hemei Jingyi Technology Company Information
13.10.2 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.10.3 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Hemei Jingyi Technology Main Business Overview
13.10.5 Hemei Jingyi Technology Latest Developments
13.11 NanYa PCB
13.11.1 NanYa PCB Company Information
13.11.2 NanYa PCB Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.11.3 NanYa PCB Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 NanYa PCB Main Business Overview
13.11.5 NanYa PCB Latest Developments
13.12 Simmtech
13.12.1 Simmtech Company Information
13.12.2 Simmtech Non-Memory Chip Packaging Substrate Product Portfolios and Specifications
13.12.3 Simmtech Non-Memory Chip Packaging Substrate Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Simmtech Main Business Overview
13.12.5 Simmtech Latest Developments
14 Research Findings and Conclusion

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