
Package on package (PoP packaging), also known as stacked packaging, is one of the very popular three-dimensional overlay technologies developed for IC packaging of mobile devices and can be used for system integration. PoP stacking uses fully tested and fully packaged chips. It is made by stacking a complete single chip or stacked chip on top of another complete single chip or stacked chip, between the bottom package and the upper package, and between the bottom package and the motherboard. The interconnection is achieved through a solder ball array.
The global Package on Package (PoP) market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
LPI (publisher)' newest research report, the “Package on Package (PoP) Industry Forecast” looks at past sales and reviews total world Package on Package (PoP) sales in 2022, providing a comprehensive analysis by region and market sector of projected Package on Package (PoP) sales for 2023 through 2029. With Package on Package (PoP) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Package on Package (PoP) industry.
This Insight Report provides a comprehensive analysis of the global Package on Package (PoP) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Package on Package (PoP) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Package on Package (PoP) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Package on Package (PoP) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Package on Package (PoP).
United States market for Package on Package (PoP) is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Package on Package (PoP) is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Package on Package (PoP) is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Package on Package (PoP) players cover Amkor Technology, ASE, JCET Group, PCBCart, Micron, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Package on Package (PoP) market by product type, application, key players and key regions and countries.
Segmentation by Type:
2-Layer
3-Layer
5-Layer
Other
Segmentation by Application:
Smartphone
Digital Camera
Mobile Gaming Device
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Segmentation by Type:
2-Layer
3-Layer
5-Layer
Other
Segmentation by Application:
Smartphone
Digital Camera
Mobile Gaming Device
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Amkor Technology
ASE
JCET Group
PCBCart
Micron
Capcon Limited
Unimicron Technology Corporation
Powertech Technology
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Package on Package (PoP) Market Size 2019-2030
2.1.2 Package on Package (PoP) Market Size CAGR by Region (2019 VS 2023 VS 2030)
2.1.3 World Current & Future Analysis for Package on Package (PoP) by Country/Region, 2019, 2023 & 2030
2.2 Package on Package (PoP) Segment by Type
2.2.1 2-Layer
2.2.2 3-Layer
2.2.3 5-Layer
2.2.4 Other
2.3 Package on Package (PoP) Market Size by Type
2.3.1 Package on Package (PoP) Market Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Package on Package (PoP) Market Size Market Share by Type (2019-2024)
2.4 Package on Package (PoP) Segment by Application
2.4.1 Smartphone
2.4.2 Digital Camera
2.4.3 Mobile Gaming Device
2.4.4 Other
2.5 Package on Package (PoP) Market Size by Application
2.5.1 Package on Package (PoP) Market Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Package on Package (PoP) Market Size Market Share by Application (2019-2024)
3 Package on Package (PoP) Market Size by Player
3.1 Package on Package (PoP) Market Size Market Share by Player
3.1.1 Global Package on Package (PoP) Revenue by Player (2019-2024)
3.1.2 Global Package on Package (PoP) Revenue Market Share by Player (2019-2024)
3.2 Global Package on Package (PoP) Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Package on Package (PoP) by Region
4.1 Package on Package (PoP) Market Size by Region (2019-2024)
4.2 Global Package on Package (PoP) Annual Revenue by Country/Region (2019-2024)
4.3 Americas Package on Package (PoP) Market Size Growth (2019-2024)
4.4 APAC Package on Package (PoP) Market Size Growth (2019-2024)
4.5 Europe Package on Package (PoP) Market Size Growth (2019-2024)
4.6 Middle East & Africa Package on Package (PoP) Market Size Growth (2019-2024)
5 Americas
5.1 Americas Package on Package (PoP) Market Size by Country (2019-2024)
5.2 Americas Package on Package (PoP) Market Size by Type (2019-2024)
5.3 Americas Package on Package (PoP) Market Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Package on Package (PoP) Market Size by Region (2019-2024)
6.2 APAC Package on Package (PoP) Market Size by Type (2019-2024)
6.3 APAC Package on Package (PoP) Market Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Package on Package (PoP) Market Size by Country (2019-2024)
7.2 Europe Package on Package (PoP) Market Size by Type (2019-2024)
7.3 Europe Package on Package (PoP) Market Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Package on Package (PoP) by Region (2019-2024)
8.2 Middle East & Africa Package on Package (PoP) Market Size by Type (2019-2024)
8.3 Middle East & Africa Package on Package (PoP) Market Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global Package on Package (PoP) Market Forecast
10.1 Global Package on Package (PoP) Forecast by Region (2025-2030)
10.1.1 Global Package on Package (PoP) Forecast by Region (2025-2030)
10.1.2 Americas Package on Package (PoP) Forecast
10.1.3 APAC Package on Package (PoP) Forecast
10.1.4 Europe Package on Package (PoP) Forecast
10.1.5 Middle East & Africa Package on Package (PoP) Forecast
10.2 Americas Package on Package (PoP) Forecast by Country (2025-2030)
10.2.1 United States Market Package on Package (PoP) Forecast
10.2.2 Canada Market Package on Package (PoP) Forecast
10.2.3 Mexico Market Package on Package (PoP) Forecast
10.2.4 Brazil Market Package on Package (PoP) Forecast
10.3 APAC Package on Package (PoP) Forecast by Region (2025-2030)
10.3.1 China Package on Package (PoP) Market Forecast
10.3.2 Japan Market Package on Package (PoP) Forecast
10.3.3 Korea Market Package on Package (PoP) Forecast
10.3.4 Southeast Asia Market Package on Package (PoP) Forecast
10.3.5 India Market Package on Package (PoP) Forecast
10.3.6 Australia Market Package on Package (PoP) Forecast
10.4 Europe Package on Package (PoP) Forecast by Country (2025-2030)
10.4.1 Germany Market Package on Package (PoP) Forecast
10.4.2 France Market Package on Package (PoP) Forecast
10.4.3 UK Market Package on Package (PoP) Forecast
10.4.4 Italy Market Package on Package (PoP) Forecast
10.4.5 Russia Market Package on Package (PoP) Forecast
10.5 Middle East & Africa Package on Package (PoP) Forecast by Region (2025-2030)
10.5.1 Egypt Market Package on Package (PoP) Forecast
10.5.2 South Africa Market Package on Package (PoP) Forecast
10.5.3 Israel Market Package on Package (PoP) Forecast
10.5.4 Turkey Market Package on Package (PoP) Forecast
10.6 Global Package on Package (PoP) Forecast by Type (2025-2030)
10.7 Global Package on Package (PoP) Forecast by Application (2025-2030)
10.7.1 GCC Countries Market Package on Package (PoP) Forecast
11 Key Players Analysis
11.1 Amkor Technology
11.1.1 Amkor Technology Company Information
11.1.2 Amkor Technology Package on Package (PoP) Product Offered
11.1.3 Amkor Technology Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.1.4 Amkor Technology Main Business Overview
11.1.5 Amkor Technology Latest Developments
11.2 ASE
11.2.1 ASE Company Information
11.2.2 ASE Package on Package (PoP) Product Offered
11.2.3 ASE Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.2.4 ASE Main Business Overview
11.2.5 ASE Latest Developments
11.3 JCET Group
11.3.1 JCET Group Company Information
11.3.2 JCET Group Package on Package (PoP) Product Offered
11.3.3 JCET Group Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.3.4 JCET Group Main Business Overview
11.3.5 JCET Group Latest Developments
11.4 PCBCart
11.4.1 PCBCart Company Information
11.4.2 PCBCart Package on Package (PoP) Product Offered
11.4.3 PCBCart Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.4.4 PCBCart Main Business Overview
11.4.5 PCBCart Latest Developments
11.5 Micron
11.5.1 Micron Company Information
11.5.2 Micron Package on Package (PoP) Product Offered
11.5.3 Micron Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.5.4 Micron Main Business Overview
11.5.5 Micron Latest Developments
11.6 Capcon Limited
11.6.1 Capcon Limited Company Information
11.6.2 Capcon Limited Package on Package (PoP) Product Offered
11.6.3 Capcon Limited Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.6.4 Capcon Limited Main Business Overview
11.6.5 Capcon Limited Latest Developments
11.7 Unimicron Technology Corporation
11.7.1 Unimicron Technology Corporation Company Information
11.7.2 Unimicron Technology Corporation Package on Package (PoP) Product Offered
11.7.3 Unimicron Technology Corporation Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.7.4 Unimicron Technology Corporation Main Business Overview
11.7.5 Unimicron Technology Corporation Latest Developments
11.8 Powertech Technology
11.8.1 Powertech Technology Company Information
11.8.2 Powertech Technology Package on Package (PoP) Product Offered
11.8.3 Powertech Technology Package on Package (PoP) Revenue, Gross Margin and Market Share (2019-2024)
11.8.4 Powertech Technology Main Business Overview
11.8.5 Powertech Technology Latest Developments
12 Research Findings and Conclusion
*If Applicable.
