Global Power Module Packaging Market Growth 2024-2030

Publication ID:

LPI02243857

Publication Date:

February 16, 2024

Pages:

129

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global Power Module Packaging market size was valued at US$ 2163.9 million in 2023. With growing demand in downstream market, the Power Module Packaging is forecast to a readjusted size of US$ 3730.6 million by 2030 with a CAGR of 8.1% during review period.
The research report highlights the growth potential of the global Power Module Packaging market. Power Module Packaging are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Power Module Packaging. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Power Module Packaging market.
A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.
The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density.听
Key Features:
The report on Power Module Packaging market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the Power Module Packaging market. It may include historical data, market segmentation by Type (e.g., GaN Module, SiC Module), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Power Module Packaging market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Power Module Packaging market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Power Module Packaging industry. This include advancements in Power Module Packaging technology, Power Module Packaging new entrants, Power Module Packaging new investment, and other innovations that are shaping the future of Power Module Packaging.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Power Module Packaging market. It includes factors influencing customer ' purchasing decisions, preferences for Power Module Packaging product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Power Module Packaging market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Power Module Packaging market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Power Module Packaging market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Power Module Packaging industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Power Module Packaging market.
Market Segmentation:
Power Module Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Segmentation by type
GaN Module
SiC Module
FET Module
IGBT Module
Others
Segmentation by application
Electric Vehicles (EV)
Rail Tractions
Wind Turbines
Photovoltaic Equipment
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric
Sanken Electric
Sansha Electric
ON Semiconductor
STMicroelectronics
Hitachi Power Semiconductor Device
ROHM
Danfoss
Key Questions Addressed in this Report
What is the 10-year outlook for the global Power Module Packaging market?
What factors are driving Power Module Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Power Module Packaging market opportunities vary by end market size?
How does Power Module Packaging break out type, application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Power Module Packaging Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Power Module Packaging by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Power Module Packaging by Country/Region, 2019, 2023 & 2030
2.2 Power Module Packaging Segment by Type
2.2.1 GaN Module
2.2.2 SiC Module
2.2.3 FET Module
2.2.4 IGBT Module
2.2.5 Others
2.3 Power Module Packaging Sales by Type
2.3.1 Global Power Module Packaging Sales Market Share by Type (2019-2024)
2.3.2 Global Power Module Packaging Revenue and Market Share by Type (2019-2024)
2.3.3 Global Power Module Packaging Sale Price by Type (2019-2024)
2.4 Power Module Packaging Segment by Application
2.4.1 Electric Vehicles (EV)
2.4.2 Rail Tractions
2.4.3 Wind Turbines
2.4.4 Photovoltaic Equipment
2.4.5 Others
2.5 Power Module Packaging Sales by Application
2.5.1 Global Power Module Packaging Sale Market Share by Application (2019-2024)
2.5.2 Global Power Module Packaging Revenue and Market Share by Application (2019-2024)
2.5.3 Global Power Module Packaging Sale Price by Application (2019-2024)
3 Global Power Module Packaging by Company
3.1 Global Power Module Packaging Breakdown Data by Company
3.1.1 Global Power Module Packaging Annual Sales by Company (2019-2024)
3.1.2 Global Power Module Packaging Sales Market Share by Company (2019-2024)
3.2 Global Power Module Packaging Annual Revenue by Company (2019-2024)
3.2.1 Global Power Module Packaging Revenue by Company (2019-2024)
3.2.2 Global Power Module Packaging Revenue Market Share by Company (2019-2024)
3.3 Global Power Module Packaging Sale Price by Company
3.4 Key Manufacturers Power Module Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Power Module Packaging Product Location Distribution
3.4.2 Players Power Module Packaging Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for Power Module Packaging by Geographic Region
4.1 World Historic Power Module Packaging Market Size by Geographic Region (2019-2024)
4.1.1 Global Power Module Packaging Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Power Module Packaging Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Power Module Packaging Market Size by Country/Region (2019-2024)
4.2.1 Global Power Module Packaging Annual Sales by Country/Region (2019-2024)
4.2.2 Global Power Module Packaging Annual Revenue by Country/Region (2019-2024)
4.3 Americas Power Module Packaging Sales Growth
4.4 APAC Power Module Packaging Sales Growth
4.5 Europe Power Module Packaging Sales Growth
4.6 Middle East & Africa Power Module Packaging Sales Growth
5 Americas
5.1 Americas Power Module Packaging Sales by Country
5.1.1 Americas Power Module Packaging Sales by Country (2019-2024)
5.1.2 Americas Power Module Packaging Revenue by Country (2019-2024)
5.2 Americas Power Module Packaging Sales by Type
5.3 Americas Power Module Packaging Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Power Module Packaging Sales by Region
6.1.1 APAC Power Module Packaging Sales by Region (2019-2024)
6.1.2 APAC Power Module Packaging Revenue by Region (2019-2024)
6.2 APAC Power Module Packaging Sales by Type
6.3 APAC Power Module Packaging Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Power Module Packaging by Country
7.1.1 Europe Power Module Packaging Sales by Country (2019-2024)
7.1.2 Europe Power Module Packaging Revenue by Country (2019-2024)
7.2 Europe Power Module Packaging Sales by Type
7.3 Europe Power Module Packaging Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Power Module Packaging by Country
8.1.1 Middle East & Africa Power Module Packaging Sales by Country (2019-2024)
8.1.2 Middle East & Africa Power Module Packaging Revenue by Country (2019-2024)
8.2 Middle East & Africa Power Module Packaging Sales by Type
8.3 Middle East & Africa Power Module Packaging Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Power Module Packaging
10.3 Manufacturing Process Analysis of Power Module Packaging
10.4 Industry Chain Structure of Power Module Packaging
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Power Module Packaging Distributors
11.3 Power Module Packaging Customer
12 World Forecast Review for Power Module Packaging by Geographic Region
12.1 Global Power Module Packaging Market Size Forecast by Region
12.1.1 Global Power Module Packaging Forecast by Region (2025-2030)
12.1.2 Global Power Module Packaging Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global Power Module Packaging Forecast by Type
12.7 Global Power Module Packaging Forecast by Application
13 Key Players Analysis
13.1 Texas Instruments Incorporated
13.1.1 Texas Instruments Incorporated Company Information
13.1.2 Texas Instruments Incorporated Power Module Packaging Product Portfolios and Specifications
13.1.3 Texas Instruments Incorporated Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Texas Instruments Incorporated Main Business Overview
13.1.5 Texas Instruments Incorporated Latest Developments
13.2 Star Automations
13.2.1 Star Automations Company Information
13.2.2 Star Automations Power Module Packaging Product Portfolios and Specifications
13.2.3 Star Automations Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Star Automations Main Business Overview
13.2.5 Star Automations Latest Developments
13.3 DyDac Controls
13.3.1 DyDac Controls Company Information
13.3.2 DyDac Controls Power Module Packaging Product Portfolios and Specifications
13.3.3 DyDac Controls Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 DyDac Controls Main Business Overview
13.3.5 DyDac Controls Latest Developments
13.4 SEMIKRON
13.4.1 SEMIKRON Company Information
13.4.2 SEMIKRON Power Module Packaging Product Portfolios and Specifications
13.4.3 SEMIKRON Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 SEMIKRON Main Business Overview
13.4.5 SEMIKRON Latest Developments
13.5 IXYS Corporation
13.5.1 IXYS Corporation Company Information
13.5.2 IXYS Corporation Power Module Packaging Product Portfolios and Specifications
13.5.3 IXYS Corporation Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 IXYS Corporation Main Business Overview
13.5.5 IXYS Corporation Latest Developments
13.6 Infineon Technologies AG
13.6.1 Infineon Technologies AG Company Information
13.6.2 Infineon Technologies AG Power Module Packaging Product Portfolios and Specifications
13.6.3 Infineon Technologies AG Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Infineon Technologies AG Main Business Overview
13.6.5 Infineon Technologies AG Latest Developments
13.7 Mitsubishi Electric Corporation
13.7.1 Mitsubishi Electric Corporation Company Information
13.7.2 Mitsubishi Electric Corporation Power Module Packaging Product Portfolios and Specifications
13.7.3 Mitsubishi Electric Corporation Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Mitsubishi Electric Corporation Main Business Overview
13.7.5 Mitsubishi Electric Corporation Latest Developments
13.8 Fuji Electric
13.8.1 Fuji Electric Company Information
13.8.2 Fuji Electric Power Module Packaging Product Portfolios and Specifications
13.8.3 Fuji Electric Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Fuji Electric Main Business Overview
13.8.5 Fuji Electric Latest Developments
13.9 Sanken Electric
13.9.1 Sanken Electric Company Information
13.9.2 Sanken Electric Power Module Packaging Product Portfolios and Specifications
13.9.3 Sanken Electric Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Sanken Electric Main Business Overview
13.9.5 Sanken Electric Latest Developments
13.10 Sansha Electric
13.10.1 Sansha Electric Company Information
13.10.2 Sansha Electric Power Module Packaging Product Portfolios and Specifications
13.10.3 Sansha Electric Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Sansha Electric Main Business Overview
13.10.5 Sansha Electric Latest Developments
13.11 ON Semiconductor
13.11.1 ON Semiconductor Company Information
13.11.2 ON Semiconductor Power Module Packaging Product Portfolios and Specifications
13.11.3 ON Semiconductor Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 ON Semiconductor Main Business Overview
13.11.5 ON Semiconductor Latest Developments
13.12 STMicroelectronics
13.12.1 STMicroelectronics Company Information
13.12.2 STMicroelectronics Power Module Packaging Product Portfolios and Specifications
13.12.3 STMicroelectronics Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 STMicroelectronics Main Business Overview
13.12.5 STMicroelectronics Latest Developments
13.13 Hitachi Power Semiconductor Device
13.13.1 Hitachi Power Semiconductor Device Company Information
13.13.2 Hitachi Power Semiconductor Device Power Module Packaging Product Portfolios and Specifications
13.13.3 Hitachi Power Semiconductor Device Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 Hitachi Power Semiconductor Device Main Business Overview
13.13.5 Hitachi Power Semiconductor Device Latest Developments
13.14 ROHM
13.14.1 ROHM Company Information
13.14.2 ROHM Power Module Packaging Product Portfolios and Specifications
13.14.3 ROHM Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 ROHM Main Business Overview
13.14.5 ROHM Latest Developments
13.15 Danfoss
13.15.1 Danfoss Company Information
13.15.2 Danfoss Power Module Packaging Product Portfolios and Specifications
13.15.3 Danfoss Power Module Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Danfoss Main Business Overview
13.15.5 Danfoss Latest Developments
14 Research Findings and Conclusion

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