The global Semiconductor Advanced Packaging market size was valued at US$ 15330 million in 2023. With growing demand in downstream market, the Semiconductor Advanced Packaging is forecast to a readjusted size of US$ 25900 million by 2030 with a CAGR of 7.8% during review period.
The research report highlights the growth potential of the global Semiconductor Advanced Packaging market. Semiconductor Advanced Packaging are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Semiconductor Advanced Packaging. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Semiconductor Advanced Packaging market.
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Key Features:
The report on Semiconductor Advanced Packaging market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the Semiconductor Advanced Packaging market. It may include historical data, market segmentation by Type (e.g., Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP)), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Semiconductor Advanced Packaging market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Semiconductor Advanced Packaging market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Semiconductor Advanced Packaging industry. This include advancements in Semiconductor Advanced Packaging technology, Semiconductor Advanced Packaging new entrants, Semiconductor Advanced Packaging new investment, and other innovations that are shaping the future of Semiconductor Advanced Packaging.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Semiconductor Advanced Packaging market. It includes factors influencing customer ' purchasing decisions, preferences for Semiconductor Advanced Packaging product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Semiconductor Advanced Packaging market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Semiconductor Advanced Packaging market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Semiconductor Advanced Packaging market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Semiconductor Advanced Packaging industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Semiconductor Advanced Packaging market.
Market Segmentation:
Semiconductor Advanced Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segmentation by application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Samsung
TSMC (Taiwan Semiconductor Manufacturing Company)
China Wafer Level CSP
ChipMOS Technologies
FlipChip International
HANA Micron
Interconnect Systems (Molex)
Jiangsu Changjiang Electronics Technology (JCET)
King Yuan Electronics
Tongfu Microelectronics
Nepes
Powertech Technology (PTI)
Signetics
Tianshui Huatian
Veeco/CNT
UTAC Group
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Semiconductor Advanced Packaging Market Size 2019-2030
2.1.2 Semiconductor Advanced Packaging Market Size CAGR by Region 2019 VS 2023 VS 2030
2.2 Semiconductor Advanced Packaging Segment by Type
2.2.1 Fan-Out Wafer-Level Packaging (FO WLP)
2.2.2 Fan-In Wafer-Level Packaging (FI WLP)
2.2.3 Flip Chip (FC)
2.2.4 2.5D/3D
2.3 Semiconductor Advanced Packaging Market Size by Type
2.3.1 Semiconductor Advanced Packaging Market Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Semiconductor Advanced Packaging Market Size Market Share by Type (2019-2024)
2.4 Semiconductor Advanced Packaging Segment by Application
2.4.1 Telecommunications
2.4.2 Automotive
2.4.3 Aerospace and Defense
2.4.4 Medical Devices
2.4.5 Consumer Electronics
2.4.6 Other
2.5 Semiconductor Advanced Packaging Market Size by Application
2.5.1 Semiconductor Advanced Packaging Market Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Semiconductor Advanced Packaging Market Size Market Share by Application (2019-2024)
3 Semiconductor Advanced Packaging Market Size by Player
3.1 Semiconductor Advanced Packaging Market Size Market Share by Players
3.1.1 Global Semiconductor Advanced Packaging Revenue by Players (2019-2024)
3.1.2 Global Semiconductor Advanced Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor Advanced Packaging Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Semiconductor Advanced Packaging by Regions
4.1 Semiconductor Advanced Packaging Market Size by Regions (2019-2024)
4.2 Americas Semiconductor Advanced Packaging Market Size Growth (2019-2024)
4.3 APAC Semiconductor Advanced Packaging Market Size Growth (2019-2024)
4.4 Europe Semiconductor Advanced Packaging Market Size Growth (2019-2024)
4.5 Middle East & Africa Semiconductor Advanced Packaging Market Size Growth (2019-2024)
5 Americas
5.1 Americas Semiconductor Advanced Packaging Market Size by Country (2019-2024)
5.2 Americas Semiconductor Advanced Packaging Market Size by Type (2019-2024)
5.3 Americas Semiconductor Advanced Packaging Market Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Semiconductor Advanced Packaging Market Size by Region (2019-2024)
6.2 APAC Semiconductor Advanced Packaging Market Size by Type (2019-2024)
6.3 APAC Semiconductor Advanced Packaging Market Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Semiconductor Advanced Packaging by Country (2019-2024)
7.2 Europe Semiconductor Advanced Packaging Market Size by Type (2019-2024)
7.3 Europe Semiconductor Advanced Packaging Market Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Semiconductor Advanced Packaging by Region (2019-2024)
8.2 Middle East & Africa Semiconductor Advanced Packaging Market Size by Type (2019-2024)
8.3 Middle East & Africa Semiconductor Advanced Packaging Market Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global Semiconductor Advanced Packaging Market Forecast
10.1 Global Semiconductor Advanced Packaging Forecast by Regions (2025-2030)
10.1.1 Global Semiconductor Advanced Packaging Forecast by Regions (2025-2030)
10.1.2 Americas Semiconductor Advanced Packaging Forecast
10.1.3 APAC Semiconductor Advanced Packaging Forecast
10.1.4 Europe Semiconductor Advanced Packaging Forecast
10.1.5 Middle East & Africa Semiconductor Advanced Packaging Forecast
10.2 Americas Semiconductor Advanced Packaging Forecast by Country (2025-2030)
10.2.1 United States Semiconductor Advanced Packaging Market Forecast
10.2.2 Canada Semiconductor Advanced Packaging Market Forecast
10.2.3 Mexico Semiconductor Advanced Packaging Market Forecast
10.2.4 Brazil Semiconductor Advanced Packaging Market Forecast
10.3 APAC Semiconductor Advanced Packaging Forecast by Region (2025-2030)
10.3.1 China Semiconductor Advanced Packaging Market Forecast
10.3.2 Japan Semiconductor Advanced Packaging Market Forecast
10.3.3 Korea Semiconductor Advanced Packaging Market Forecast
10.3.4 Southeast Asia Semiconductor Advanced Packaging Market Forecast
10.3.5 India Semiconductor Advanced Packaging Market Forecast
10.3.6 Australia Semiconductor Advanced Packaging Market Forecast
10.4 Europe Semiconductor Advanced Packaging Forecast by Country (2025-2030)
10.4.1 Germany Semiconductor Advanced Packaging Market Forecast
10.4.2 France Semiconductor Advanced Packaging Market Forecast
10.4.3 UK Semiconductor Advanced Packaging Market Forecast
10.4.4 Italy Semiconductor Advanced Packaging Market Forecast
10.4.5 Russia Semiconductor Advanced Packaging Market Forecast
10.5 Middle East & Africa Semiconductor Advanced Packaging Forecast by Region (2025-2030)
10.5.1 Egypt Semiconductor Advanced Packaging Market Forecast
10.5.2 South Africa Semiconductor Advanced Packaging Market Forecast
10.5.3 Israel Semiconductor Advanced Packaging Market Forecast
10.5.4 Turkey Semiconductor Advanced Packaging Market Forecast
10.5.5 GCC Countries Semiconductor Advanced Packaging Market Forecast
10.6 Global Semiconductor Advanced Packaging Forecast by Type (2025-2030)
10.7 Global Semiconductor Advanced Packaging Forecast by Application (2025-2030)
11 Key Players Analysis
11.1 Advanced Semiconductor Engineering (ASE)
11.1.1 Advanced Semiconductor Engineering (ASE) Company Information
11.1.2 Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Product Offered
11.1.3 Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.1.4 Advanced Semiconductor Engineering (ASE) Main Business Overview
11.1.5 Advanced Semiconductor Engineering (ASE) Latest Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Information
11.2.2 Amkor Technology Semiconductor Advanced Packaging Product Offered
11.2.3 Amkor Technology Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.2.4 Amkor Technology Main Business Overview
11.2.5 Amkor Technology Latest Developments
11.3 Samsung
11.3.1 Samsung Company Information
11.3.2 Samsung Semiconductor Advanced Packaging Product Offered
11.3.3 Samsung Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.3.4 Samsung Main Business Overview
11.3.5 Samsung Latest Developments
11.4 TSMC (Taiwan Semiconductor Manufacturing Company)
11.4.1 TSMC (Taiwan Semiconductor Manufacturing Company) Company Information
11.4.2 TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Product Offered
11.4.3 TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.4.4 TSMC (Taiwan Semiconductor Manufacturing Company) Main Business Overview
11.4.5 TSMC (Taiwan Semiconductor Manufacturing Company) Latest Developments
11.5 China Wafer Level CSP
11.5.1 China Wafer Level CSP Company Information
11.5.2 China Wafer Level CSP Semiconductor Advanced Packaging Product Offered
11.5.3 China Wafer Level CSP Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.5.4 China Wafer Level CSP Main Business Overview
11.5.5 China Wafer Level CSP Latest Developments
11.6 ChipMOS Technologies
11.6.1 ChipMOS Technologies Company Information
11.6.2 ChipMOS Technologies Semiconductor Advanced Packaging Product Offered
11.6.3 ChipMOS Technologies Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.6.4 ChipMOS Technologies Main Business Overview
11.6.5 ChipMOS Technologies Latest Developments
11.7 FlipChip International
11.7.1 FlipChip International Company Information
11.7.2 FlipChip International Semiconductor Advanced Packaging Product Offered
11.7.3 FlipChip International Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.7.4 FlipChip International Main Business Overview
11.7.5 FlipChip International Latest Developments
11.8 HANA Micron
11.8.1 HANA Micron Company Information
11.8.2 HANA Micron Semiconductor Advanced Packaging Product Offered
11.8.3 HANA Micron Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.8.4 HANA Micron Main Business Overview
11.8.5 HANA Micron Latest Developments
11.9 Interconnect Systems (Molex)
11.9.1 Interconnect Systems (Molex) Company Information
11.9.2 Interconnect Systems (Molex) Semiconductor Advanced Packaging Product Offered
11.9.3 Interconnect Systems (Molex) Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.9.4 Interconnect Systems (Molex) Main Business Overview
11.9.5 Interconnect Systems (Molex) Latest Developments
11.10 Jiangsu Changjiang Electronics Technology (JCET)
11.10.1 Jiangsu Changjiang Electronics Technology (JCET) Company Information
11.10.2 Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Product Offered
11.10.3 Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.10.4 Jiangsu Changjiang Electronics Technology (JCET) Main Business Overview
11.10.5 Jiangsu Changjiang Electronics Technology (JCET) Latest Developments
11.11 King Yuan Electronics
11.11.1 King Yuan Electronics Company Information
11.11.2 King Yuan Electronics Semiconductor Advanced Packaging Product Offered
11.11.3 King Yuan Electronics Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.11.4 King Yuan Electronics Main Business Overview
11.11.5 King Yuan Electronics Latest Developments
11.12 Tongfu Microelectronics
11.12.1 Tongfu Microelectronics Company Information
11.12.2 Tongfu Microelectronics Semiconductor Advanced Packaging Product Offered
11.12.3 Tongfu Microelectronics Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.12.4 Tongfu Microelectronics Main Business Overview
11.12.5 Tongfu Microelectronics Latest Developments
11.13 Nepes
11.13.1 Nepes Company Information
11.13.2 Nepes Semiconductor Advanced Packaging Product Offered
11.13.3 Nepes Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.13.4 Nepes Main Business Overview
11.13.5 Nepes Latest Developments
11.14 Powertech Technology (PTI)
11.14.1 Powertech Technology (PTI) Company Information
11.14.2 Powertech Technology (PTI) Semiconductor Advanced Packaging Product Offered
11.14.3 Powertech Technology (PTI) Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.14.4 Powertech Technology (PTI) Main Business Overview
11.14.5 Powertech Technology (PTI) Latest Developments
11.15 Signetics
11.15.1 Signetics Company Information
11.15.2 Signetics Semiconductor Advanced Packaging Product Offered
11.15.3 Signetics Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.15.4 Signetics Main Business Overview
11.15.5 Signetics Latest Developments
11.16 Tianshui Huatian
11.16.1 Tianshui Huatian Company Information
11.16.2 Tianshui Huatian Semiconductor Advanced Packaging Product Offered
11.16.3 Tianshui Huatian Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.16.4 Tianshui Huatian Main Business Overview
11.16.5 Tianshui Huatian Latest Developments
11.17 Veeco/CNT
11.17.1 Veeco/CNT Company Information
11.17.2 Veeco/CNT Semiconductor Advanced Packaging Product Offered
11.17.3 Veeco/CNT Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.17.4 Veeco/CNT Main Business Overview
11.17.5 Veeco/CNT Latest Developments
11.18 UTAC Group
11.18.1 UTAC Group Company Information
11.18.2 UTAC Group Semiconductor Advanced Packaging Product Offered
11.18.3 UTAC Group Semiconductor Advanced Packaging Revenue, Gross Margin and Market Share (2019-2024)
11.18.4 UTAC Group Main Business Overview
11.18.5 UTAC Group Latest Developments
12 Research Findings and Conclusion
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*If Applicable.
