Semiconductor Automatic Packaging Equipment is a specialized device used to package semiconductor chips (such as integrated circuits, sensors, etc.) into final products. Packaging is the final important step in the semiconductor manufacturing process, which places the manufactured chips inside the packaging shell and provides electrical connections and mechanical protection so that the chips can be safely and effectively used in various electronic devices. Fully automatic packaging equipment can achieve high automation in this process, thereby improving production efficiency, product quality, and reducing production costs.
The global Semiconductor Automatic Packaging Equipment market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The 鈥淪emiconductor Automatic Packaging Equipment Industry Forecast鈥� looks at past sales and reviews total world Semiconductor Automatic Packaging Equipment sales in 2023, providing a comprehensive analysis by region and market sector of projected Semiconductor Automatic Packaging Equipment sales for 2024 through 2030. With Semiconductor Automatic Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Automatic Packaging Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Automatic Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Automatic Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Semiconductor Automatic Packaging Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Automatic Packaging Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Automatic Packaging Equipment.
United States market for Semiconductor Automatic Packaging Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Semiconductor Automatic Packaging Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Semiconductor Automatic Packaging Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Semiconductor Automatic Packaging Equipment players cover Nepes, FormFactor, Shinko Electric, ASMPT, Towa Japan, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Automatic Packaging Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Wafer Dicing Saws
Die Bonder
Wire Bonder
Molding Equipment
Plating Equipment
Others
Segmentation by Application:
Consumer Electronics
Automotive
Industrial
Medical
Communication
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nepes
FormFactor
Shinko Electric
ASMPT
Towa Japan
Yamaha Robotics
Applied Materials
Kulicke and Soffa Industries
Unisem
Veeco Instruments
Besi
Greatek Electronic
Disco
Tokyo Seimitsu
Synova
Palomar Technologies
Toray Engineering
Panasonic
Takatori Corporation
GTI Technology
Powatec
Mtex Matsumura
Asahi Engineering
ChipMOS Technologies
Nextool Technology
Wenyi Technologies
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Automatic Packaging Equipment market?
What factors are driving Semiconductor Automatic Packaging Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Automatic Packaging Equipment market opportunities vary by end market size?
How does Semiconductor Automatic Packaging Equipment break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Semiconductor Automatic Packaging Equipment Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Semiconductor Automatic Packaging Equipment by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Semiconductor Automatic Packaging Equipment by Country/Region, 2019, 2023 & 2030
2.2 Semiconductor Automatic Packaging Equipment Segment by Type
2.2.1 Wafer Dicing Saws
2.2.2 Die Bonder
2.2.3 Wire Bonder
2.2.4 Molding Equipment
2.2.5 Plating Equipment
2.2.6 Others
2.3 Semiconductor Automatic Packaging Equipment Sales by Type
2.3.1 Global Semiconductor Automatic Packaging Equipment Sales Market Share by Type (2019-2024)
2.3.2 Global Semiconductor Automatic Packaging Equipment Revenue and Market Share by Type (2019-2024)
2.3.3 Global Semiconductor Automatic Packaging Equipment Sale Price by Type (2019-2024)
2.4 Semiconductor Automatic Packaging Equipment Segment by Application
2.4.1 Consumer Electronics
2.4.2 Automotive
2.4.3 Industrial
2.4.4 Medical
2.4.5 Communication
2.4.6 Others
2.5 Semiconductor Automatic Packaging Equipment Sales by Application
2.5.1 Global Semiconductor Automatic Packaging Equipment Sale Market Share by Application (2019-2024)
2.5.2 Global Semiconductor Automatic Packaging Equipment Revenue and Market Share by Application (2019-2024)
2.5.3 Global Semiconductor Automatic Packaging Equipment Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Semiconductor Automatic Packaging Equipment Breakdown Data by Company
3.1.1 Global Semiconductor Automatic Packaging Equipment Annual Sales by Company (2019-2024)
3.1.2 Global Semiconductor Automatic Packaging Equipment Sales Market Share by Company (2019-2024)
3.2 Global Semiconductor Automatic Packaging Equipment Annual Revenue by Company (2019-2024)
3.2.1 Global Semiconductor Automatic Packaging Equipment Revenue by Company (2019-2024)
3.2.2 Global Semiconductor Automatic Packaging Equipment Revenue Market Share by Company (2019-2024)
3.3 Global Semiconductor Automatic Packaging Equipment Sale Price by Company
3.4 Key Manufacturers Semiconductor Automatic Packaging Equipment Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Semiconductor Automatic Packaging Equipment Product Location Distribution
3.4.2 Players Semiconductor Automatic Packaging Equipment Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Semiconductor Automatic Packaging Equipment by Geographic Region
4.1 World Historic Semiconductor Automatic Packaging Equipment Market Size by Geographic Region (2019-2024)
4.1.1 Global Semiconductor Automatic Packaging Equipment Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Semiconductor Automatic Packaging Equipment Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Semiconductor Automatic Packaging Equipment Market Size by Country/Region (2019-2024)
4.2.1 Global Semiconductor Automatic Packaging Equipment Annual Sales by Country/Region (2019-2024)
4.2.2 Global Semiconductor Automatic Packaging Equipment Annual Revenue by Country/Region (2019-2024)
4.3 Americas Semiconductor Automatic Packaging Equipment Sales Growth
4.4 APAC Semiconductor Automatic Packaging Equipment Sales Growth
4.5 Europe Semiconductor Automatic Packaging Equipment Sales Growth
4.6 Middle East & Africa Semiconductor Automatic Packaging Equipment Sales Growth
5 Americas
5.1 Americas Semiconductor Automatic Packaging Equipment Sales by Country
5.1.1 Americas Semiconductor Automatic Packaging Equipment Sales by Country (2019-2024)
5.1.2 Americas Semiconductor Automatic Packaging Equipment Revenue by Country (2019-2024)
5.2 Americas Semiconductor Automatic Packaging Equipment Sales by Type (2019-2024)
5.3 Americas Semiconductor Automatic Packaging Equipment Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Semiconductor Automatic Packaging Equipment Sales by Region
6.1.1 APAC Semiconductor Automatic Packaging Equipment Sales by Region (2019-2024)
6.1.2 APAC Semiconductor Automatic Packaging Equipment Revenue by Region (2019-2024)
6.2 APAC Semiconductor Automatic Packaging Equipment Sales by Type (2019-2024)
6.3 APAC Semiconductor Automatic Packaging Equipment Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Semiconductor Automatic Packaging Equipment by Country
7.1.1 Europe Semiconductor Automatic Packaging Equipment Sales by Country (2019-2024)
7.1.2 Europe Semiconductor Automatic Packaging Equipment Revenue by Country (2019-2024)
7.2 Europe Semiconductor Automatic Packaging Equipment Sales by Type (2019-2024)
7.3 Europe Semiconductor Automatic Packaging Equipment Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Semiconductor Automatic Packaging Equipment by Country
8.1.1 Middle East & Africa Semiconductor Automatic Packaging Equipment Sales by Country (2019-2024)
8.1.2 Middle East & Africa Semiconductor Automatic Packaging Equipment Revenue by Country (2019-2024)
8.2 Middle East & Africa Semiconductor Automatic Packaging Equipment Sales by Type (2019-2024)
8.3 Middle East & Africa Semiconductor Automatic Packaging Equipment Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Semiconductor Automatic Packaging Equipment
10.3 Manufacturing Process Analysis of Semiconductor Automatic Packaging Equipment
10.4 Industry Chain Structure of Semiconductor Automatic Packaging Equipment
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Semiconductor Automatic Packaging Equipment Distributors
11.3 Semiconductor Automatic Packaging Equipment Customer
12 World Forecast Review for Semiconductor Automatic Packaging Equipment by Geographic Region
12.1 Global Semiconductor Automatic Packaging Equipment Market Size Forecast by Region
12.1.1 Global Semiconductor Automatic Packaging Equipment Forecast by Region (2025-2030)
12.1.2 Global Semiconductor Automatic Packaging Equipment Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Semiconductor Automatic Packaging Equipment Forecast by Type (2025-2030)
12.7 Global Semiconductor Automatic Packaging Equipment Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Nepes
13.1.1 Nepes Company Information
13.1.2 Nepes Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.1.3 Nepes Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Nepes Main Business Overview
13.1.5 Nepes Latest Developments
13.2 FormFactor
13.2.1 FormFactor Company Information
13.2.2 FormFactor Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.2.3 FormFactor Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 FormFactor Main Business Overview
13.2.5 FormFactor Latest Developments
13.3 Shinko Electric
13.3.1 Shinko Electric Company Information
13.3.2 Shinko Electric Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.3.3 Shinko Electric Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Shinko Electric Main Business Overview
13.3.5 Shinko Electric Latest Developments
13.4 ASMPT
13.4.1 ASMPT Company Information
13.4.2 ASMPT Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.4.3 ASMPT Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 ASMPT Main Business Overview
13.4.5 ASMPT Latest Developments
13.5 Towa Japan
13.5.1 Towa Japan Company Information
13.5.2 Towa Japan Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.5.3 Towa Japan Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Towa Japan Main Business Overview
13.5.5 Towa Japan Latest Developments
13.6 Yamaha Robotics
13.6.1 Yamaha Robotics Company Information
13.6.2 Yamaha Robotics Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.6.3 Yamaha Robotics Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Yamaha Robotics Main Business Overview
13.6.5 Yamaha Robotics Latest Developments
13.7 Applied Materials
13.7.1 Applied Materials Company Information
13.7.2 Applied Materials Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.7.3 Applied Materials Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Applied Materials Main Business Overview
13.7.5 Applied Materials Latest Developments
13.8 Kulicke and Soffa Industries
13.8.1 Kulicke and Soffa Industries Company Information
13.8.2 Kulicke and Soffa Industries Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.8.3 Kulicke and Soffa Industries Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Kulicke and Soffa Industries Main Business Overview
13.8.5 Kulicke and Soffa Industries Latest Developments
13.9 Unisem
13.9.1 Unisem Company Information
13.9.2 Unisem Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.9.3 Unisem Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Unisem Main Business Overview
13.9.5 Unisem Latest Developments
13.10 Veeco Instruments
13.10.1 Veeco Instruments Company Information
13.10.2 Veeco Instruments Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.10.3 Veeco Instruments Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Veeco Instruments Main Business Overview
13.10.5 Veeco Instruments Latest Developments
13.11 Besi
13.11.1 Besi Company Information
13.11.2 Besi Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.11.3 Besi Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Besi Main Business Overview
13.11.5 Besi Latest Developments
13.12 Greatek Electronic
13.12.1 Greatek Electronic Company Information
13.12.2 Greatek Electronic Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.12.3 Greatek Electronic Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Greatek Electronic Main Business Overview
13.12.5 Greatek Electronic Latest Developments
13.13 Disco
13.13.1 Disco Company Information
13.13.2 Disco Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.13.3 Disco Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 Disco Main Business Overview
13.13.5 Disco Latest Developments
13.14 Tokyo Seimitsu
13.14.1 Tokyo Seimitsu Company Information
13.14.2 Tokyo Seimitsu Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.14.3 Tokyo Seimitsu Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 Tokyo Seimitsu Main Business Overview
13.14.5 Tokyo Seimitsu Latest Developments
13.15 Synova
13.15.1 Synova Company Information
13.15.2 Synova Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.15.3 Synova Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Synova Main Business Overview
13.15.5 Synova Latest Developments
13.16 Palomar Technologies
13.16.1 Palomar Technologies Company Information
13.16.2 Palomar Technologies Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.16.3 Palomar Technologies Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 Palomar Technologies Main Business Overview
13.16.5 Palomar Technologies Latest Developments
13.17 Toray Engineering
13.17.1 Toray Engineering Company Information
13.17.2 Toray Engineering Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.17.3 Toray Engineering Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.17.4 Toray Engineering Main Business Overview
13.17.5 Toray Engineering Latest Developments
13.18 Panasonic
13.18.1 Panasonic Company Information
13.18.2 Panasonic Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.18.3 Panasonic Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.18.4 Panasonic Main Business Overview
13.18.5 Panasonic Latest Developments
13.19 Takatori Corporation
13.19.1 Takatori Corporation Company Information
13.19.2 Takatori Corporation Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.19.3 Takatori Corporation Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.19.4 Takatori Corporation Main Business Overview
13.19.5 Takatori Corporation Latest Developments
13.20 GTI Technology
13.20.1 GTI Technology Company Information
13.20.2 GTI Technology Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.20.3 GTI Technology Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.20.4 GTI Technology Main Business Overview
13.20.5 GTI Technology Latest Developments
13.21 Powatec
13.21.1 Powatec Company Information
13.21.2 Powatec Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.21.3 Powatec Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.21.4 Powatec Main Business Overview
13.21.5 Powatec Latest Developments
13.22 Mtex Matsumura
13.22.1 Mtex Matsumura Company Information
13.22.2 Mtex Matsumura Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.22.3 Mtex Matsumura Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.22.4 Mtex Matsumura Main Business Overview
13.22.5 Mtex Matsumura Latest Developments
13.23 Asahi Engineering
13.23.1 Asahi Engineering Company Information
13.23.2 Asahi Engineering Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.23.3 Asahi Engineering Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.23.4 Asahi Engineering Main Business Overview
13.23.5 Asahi Engineering Latest Developments
13.24 ChipMOS Technologies
13.24.1 ChipMOS Technologies Company Information
13.24.2 ChipMOS Technologies Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.24.3 ChipMOS Technologies Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.24.4 ChipMOS Technologies Main Business Overview
13.24.5 ChipMOS Technologies Latest Developments
13.25 Nextool Technology
13.25.1 Nextool Technology Company Information
13.25.2 Nextool Technology Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.25.3 Nextool Technology Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.25.4 Nextool Technology Main Business Overview
13.25.5 Nextool Technology Latest Developments
13.26 Wenyi Technologies
13.26.1 Wenyi Technologies Company Information
13.26.2 Wenyi Technologies Semiconductor Automatic Packaging Equipment Product Portfolios and Specifications
13.26.3 Wenyi Technologies Semiconductor Automatic Packaging Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.26.4 Wenyi Technologies Main Business Overview
13.26.5 Wenyi Technologies Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
