Global Semiconductor Molding Systems Market Growth 2025-2031

Publication ID:

LPI04259940

Publication Date:

April 17, 2025

Pages:

118

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global Semiconductor Molding Systems market size is predicted to grow from US$ 461 million in 2025 to US$ 665 million in 2031; it is expected to grow at a CAGR of 6.3% from 2025 to 2031.
The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Packaging refers to cutting, wire bonding, molding, trim & forming the wafer after production and processing, so that the integrated circuit can achieve electrical and signal connections with external devices while providing physical and chemical protection for the integrated circuit. Molding refers to a plastic molding process in which packaging materials such as epoxy resin mixture are injected into the mold cavity at a certain temperature and pressure, and the devices that need to be protected, such as chips, are wrapped in the plastic, and then solidified into a whole body. The roles of Molding products in semiconductor packaging are as follows: 1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging. 2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged. 3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it. 4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.
Gobal key players of Semiconductor Molding System market include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc. The top five players hold a share about 88%. Asia-Pacific is the largest market, has a share about 82%, followed by North America, and Europe, with share 12% and 5%, separately. In terms of product type, Fully Automatic is the largest segment, occupied for a share of 64%. In terms of application, Advanced Packaging has a share about 51%.
The 鈥淪emiconductor Molding Systems Industry Forecast鈥� looks at past sales and reviews total world Semiconductor Molding Systems sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Molding Systems sales for 2025 through 2031. With Semiconductor Molding Systems sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Molding Systems industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Molding Systems landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Molding Systems portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Semiconductor Molding Systems market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Molding Systems and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Molding Systems.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Molding Systems market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Fully Automatic Molding System
Semi-automatic Molding System
Manual Molding System
Segmentation by Application:
Advanced Packaging
Traditional Packaging
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Towa
Besi
ASMPT
I-PEX Inc
Tongling Trinity Technology
Shanghai Xinsheng
Mtex Matsumura
Asahi Engineering
Nextool Technology Co., Ltd.
APIC YAMADA
Suzhou Bopai Semiconductor (Boschman)
Anhui Zhonghe
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Molding Systems market?
What factors are driving Semiconductor Molding Systems market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Molding Systems market opportunities vary by end market size?
How does Semiconductor Molding Systems break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Semiconductor Molding Systems Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Semiconductor Molding Systems by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Semiconductor Molding Systems by Country/Region, 2020, 2024 & 2031
2.2 Semiconductor Molding Systems Segment by Type
2.2.1 Fully Automatic Molding System
2.2.2 Semi-automatic Molding System
2.2.3 Manual Molding System
2.3 Semiconductor Molding Systems Sales by Type
2.3.1 Global Semiconductor Molding Systems Sales Market Share by Type (2020-2025)
2.3.2 Global Semiconductor Molding Systems Revenue and Market Share by Type (2020-2025)
2.3.3 Global Semiconductor Molding Systems Sale Price by Type (2020-2025)
2.4 Semiconductor Molding Systems Segment by Application
2.4.1 Advanced Packaging
2.4.2 Traditional Packaging
2.5 Semiconductor Molding Systems Sales by Application
2.5.1 Global Semiconductor Molding Systems Sale Market Share by Application (2020-2025)
2.5.2 Global Semiconductor Molding Systems Revenue and Market Share by Application (2020-2025)
2.5.3 Global Semiconductor Molding Systems Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Semiconductor Molding Systems Breakdown Data by Company
3.1.1 Global Semiconductor Molding Systems Annual Sales by Company (2020-2025)
3.1.2 Global Semiconductor Molding Systems Sales Market Share by Company (2020-2025)
3.2 Global Semiconductor Molding Systems Annual Revenue by Company (2020-2025)
3.2.1 Global Semiconductor Molding Systems Revenue by Company (2020-2025)
3.2.2 Global Semiconductor Molding Systems Revenue Market Share by Company (2020-2025)
3.3 Global Semiconductor Molding Systems Sale Price by Company
3.4 Key Manufacturers Semiconductor Molding Systems Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Semiconductor Molding Systems Product Location Distribution
3.4.2 Players Semiconductor Molding Systems Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Semiconductor Molding Systems by Geographic Region
4.1 World Historic Semiconductor Molding Systems Market Size by Geographic Region (2020-2025)
4.1.1 Global Semiconductor Molding Systems Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Semiconductor Molding Systems Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Semiconductor Molding Systems Market Size by Country/Region (2020-2025)
4.2.1 Global Semiconductor Molding Systems Annual Sales by Country/Region (2020-2025)
4.2.2 Global Semiconductor Molding Systems Annual Revenue by Country/Region (2020-2025)
4.3 Americas Semiconductor Molding Systems Sales Growth
4.4 APAC Semiconductor Molding Systems Sales Growth
4.5 Europe Semiconductor Molding Systems Sales Growth
4.6 Middle East & Africa Semiconductor Molding Systems Sales Growth
5 Americas
5.1 Americas Semiconductor Molding Systems Sales by Country
5.1.1 Americas Semiconductor Molding Systems Sales by Country (2020-2025)
5.1.2 Americas Semiconductor Molding Systems Revenue by Country (2020-2025)
5.2 Americas Semiconductor Molding Systems Sales by Type (2020-2025)
5.3 Americas Semiconductor Molding Systems Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Semiconductor Molding Systems Sales by Region
6.1.1 APAC Semiconductor Molding Systems Sales by Region (2020-2025)
6.1.2 APAC Semiconductor Molding Systems Revenue by Region (2020-2025)
6.2 APAC Semiconductor Molding Systems Sales by Type (2020-2025)
6.3 APAC Semiconductor Molding Systems Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Semiconductor Molding Systems by Country
7.1.1 Europe Semiconductor Molding Systems Sales by Country (2020-2025)
7.1.2 Europe Semiconductor Molding Systems Revenue by Country (2020-2025)
7.2 Europe Semiconductor Molding Systems Sales by Type (2020-2025)
7.3 Europe Semiconductor Molding Systems Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Semiconductor Molding Systems by Country
8.1.1 Middle East & Africa Semiconductor Molding Systems Sales by Country (2020-2025)
8.1.2 Middle East & Africa Semiconductor Molding Systems Revenue by Country (2020-2025)
8.2 Middle East & Africa Semiconductor Molding Systems Sales by Type (2020-2025)
8.3 Middle East & Africa Semiconductor Molding Systems Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Semiconductor Molding Systems
10.3 Manufacturing Process Analysis of Semiconductor Molding Systems
10.4 Industry Chain Structure of Semiconductor Molding Systems
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Semiconductor Molding Systems Distributors
11.3 Semiconductor Molding Systems Customer
12 World Forecast Review for Semiconductor Molding Systems by Geographic Region
12.1 Global Semiconductor Molding Systems Market Size Forecast by Region
12.1.1 Global Semiconductor Molding Systems Forecast by Region (2026-2031)
12.1.2 Global Semiconductor Molding Systems Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Semiconductor Molding Systems Forecast by Type (2026-2031)
12.7 Global Semiconductor Molding Systems Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Towa
13.1.1 Towa Company Information
13.1.2 Towa Semiconductor Molding Systems Product Portfolios and Specifications
13.1.3 Towa Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Towa Main Business Overview
13.1.5 Towa Latest Developments
13.2 Besi
13.2.1 Besi Company Information
13.2.2 Besi Semiconductor Molding Systems Product Portfolios and Specifications
13.2.3 Besi Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Besi Main Business Overview
13.2.5 Besi Latest Developments
13.3 ASMPT
13.3.1 ASMPT Company Information
13.3.2 ASMPT Semiconductor Molding Systems Product Portfolios and Specifications
13.3.3 ASMPT Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 ASMPT Main Business Overview
13.3.5 ASMPT Latest Developments
13.4 I-PEX Inc
13.4.1 I-PEX Inc Company Information
13.4.2 I-PEX Inc Semiconductor Molding Systems Product Portfolios and Specifications
13.4.3 I-PEX Inc Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 I-PEX Inc Main Business Overview
13.4.5 I-PEX Inc Latest Developments
13.5 Tongling Trinity Technology
13.5.1 Tongling Trinity Technology Company Information
13.5.2 Tongling Trinity Technology Semiconductor Molding Systems Product Portfolios and Specifications
13.5.3 Tongling Trinity Technology Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Tongling Trinity Technology Main Business Overview
13.5.5 Tongling Trinity Technology Latest Developments
13.6 Shanghai Xinsheng
13.6.1 Shanghai Xinsheng Company Information
13.6.2 Shanghai Xinsheng Semiconductor Molding Systems Product Portfolios and Specifications
13.6.3 Shanghai Xinsheng Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Shanghai Xinsheng Main Business Overview
13.6.5 Shanghai Xinsheng Latest Developments
13.7 Mtex Matsumura
13.7.1 Mtex Matsumura Company Information
13.7.2 Mtex Matsumura Semiconductor Molding Systems Product Portfolios and Specifications
13.7.3 Mtex Matsumura Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 Mtex Matsumura Main Business Overview
13.7.5 Mtex Matsumura Latest Developments
13.8 Asahi Engineering
13.8.1 Asahi Engineering Company Information
13.8.2 Asahi Engineering Semiconductor Molding Systems Product Portfolios and Specifications
13.8.3 Asahi Engineering Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Asahi Engineering Main Business Overview
13.8.5 Asahi Engineering Latest Developments
13.9 Nextool Technology Co., Ltd.
13.9.1 Nextool Technology Co., Ltd. Company Information
13.9.2 Nextool Technology Co., Ltd. Semiconductor Molding Systems Product Portfolios and Specifications
13.9.3 Nextool Technology Co., Ltd. Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Nextool Technology Co., Ltd. Main Business Overview
13.9.5 Nextool Technology Co., Ltd. Latest Developments
13.10 APIC YAMADA
13.10.1 APIC YAMADA Company Information
13.10.2 APIC YAMADA Semiconductor Molding Systems Product Portfolios and Specifications
13.10.3 APIC YAMADA Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 APIC YAMADA Main Business Overview
13.10.5 APIC YAMADA Latest Developments
13.11 Suzhou Bopai Semiconductor (Boschman)
13.11.1 Suzhou Bopai Semiconductor (Boschman) Company Information
13.11.2 Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Product Portfolios and Specifications
13.11.3 Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 Suzhou Bopai Semiconductor (Boschman) Main Business Overview
13.11.5 Suzhou Bopai Semiconductor (Boschman) Latest Developments
13.12 Anhui Zhonghe
13.12.1 Anhui Zhonghe Company Information
13.12.2 Anhui Zhonghe Semiconductor Molding Systems Product Portfolios and Specifications
13.12.3 Anhui Zhonghe Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 Anhui Zhonghe Main Business Overview
13.12.5 Anhui Zhonghe Latest Developments
14 Research Findings and Conclusion

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