Wafer fabs continually face challenges in manufacturing semiconductor devices because the devices continue to get tinier and more complicated. Integrated circuits continue to increase in circuit density. Trends in chip design and materials, such as using die attach films and wafers as thin as 50 渭m, add to the complexity of manufacturing. In fabrication processes, wafer dicing plays an early and critical role in the quality of the final product.
For silicon wafers less than 100 渭m thick, laser ablation offers an alternative to the blade technique, which is too powerful for the delicate thin wafers. However, laser ablation has its own problems. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. The debris deposited on the surface of the wafer is difficult to clean up, and the cracks result in chips with lower strength.
In contrast, stealth dicing does not generate the problems brought on by either the blade or laser ablation techniques. With stealth dicing, there is no chipping or debris, which eliminates the need for a cleanup process. It also reduces the amount of wasted wafer because of its very narrow dicing path, offering space on the wafer for more chips and higher production yield. Also, the technique does not cause heat damage because the laser cuts below the surface of the wafer; this contributes to rendering the chips more resistant to breakage.
The global Silicon Wafer Laser Dicing Machine market size is projected to grow from US$ 274 million in 2024 to US$ 360 million in 2030; it is expected to grow at a CAGR of 4.7% from 2024 to 2030.
LP Information, Inc. (LPI) ' newest research report, the 鈥淪ilicon Wafer Laser Dicing Machine Industry Forecast鈥� looks at past sales and reviews total world Silicon Wafer Laser Dicing Machine sales in 2023, providing a comprehensive analysis by region and market sector of projected Silicon Wafer Laser Dicing Machine sales for 2024 through 2030. With Silicon Wafer Laser Dicing Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Silicon Wafer Laser Dicing Machine industry.
This Insight Report provides a comprehensive analysis of the global Silicon Wafer Laser Dicing Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Silicon Wafer Laser Dicing Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Silicon Wafer Laser Dicing Machine market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Silicon Wafer Laser Dicing Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Silicon Wafer Laser Dicing Machine.
United States market for Silicon Wafer Laser Dicing Machine is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Silicon Wafer Laser Dicing Machine is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Silicon Wafer Laser Dicing Machine is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Silicon Wafer Laser Dicing Machine players cover DISCO Corporation, Han's Laser Technology, Wuhan Huagong Laser Engineering, Suzhou Delphi Laser, Tokyo Seimitsu, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Silicon Wafer Laser Dicing Machine market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Traditional Dicing
Stealth Dicing
Segmentation by Application:
IDMs
OSATs
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO Corporation
Han's Laser Technology
Wuhan Huagong Laser Engineering
Suzhou Delphi Laser
Tokyo Seimitsu
Suzhou Maxwell Technologies
Suzhou Quick Laser Technology
EO Technics
Synova S.A.
Shenzhen Guangyuan Intelligent Equipment
China Electronics Technology Group
3D-Micromac AG
Genesem
ASMPT
GIE
Suzhou Lumi Laser Technology
Corning
Key Questions Addressed in this Report
What is the 10-year outlook for the global Silicon Wafer Laser Dicing Machine market?
What factors are driving Silicon Wafer Laser Dicing Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Silicon Wafer Laser Dicing Machine market opportunities vary by end market size?
How does Silicon Wafer Laser Dicing Machine break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Silicon Wafer Laser Dicing Machine Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Silicon Wafer Laser Dicing Machine by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Silicon Wafer Laser Dicing Machine by Country/Region, 2019, 2023 & 2030
2.2 Silicon Wafer Laser Dicing Machine Segment by Type
2.2.1 Traditional Dicing
2.2.2 Stealth Dicing
2.3 Silicon Wafer Laser Dicing Machine Sales by Type
2.3.1 Global Silicon Wafer Laser Dicing Machine Sales Market Share by Type (2019-2024)
2.3.2 Global Silicon Wafer Laser Dicing Machine Revenue and Market Share by Type (2019-2024)
2.3.3 Global Silicon Wafer Laser Dicing Machine Sale Price by Type (2019-2024)
2.4 Silicon Wafer Laser Dicing Machine Segment by Application
2.4.1 IDMs
2.4.2 OSATs
2.5 Silicon Wafer Laser Dicing Machine Sales by Application
2.5.1 Global Silicon Wafer Laser Dicing Machine Sale Market Share by Application (2019-2024)
2.5.2 Global Silicon Wafer Laser Dicing Machine Revenue and Market Share by Application (2019-2024)
2.5.3 Global Silicon Wafer Laser Dicing Machine Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Silicon Wafer Laser Dicing Machine Breakdown Data by Company
3.1.1 Global Silicon Wafer Laser Dicing Machine Annual Sales by Company (2019-2024)
3.1.2 Global Silicon Wafer Laser Dicing Machine Sales Market Share by Company (2019-2024)
3.2 Global Silicon Wafer Laser Dicing Machine Annual Revenue by Company (2019-2024)
3.2.1 Global Silicon Wafer Laser Dicing Machine Revenue by Company (2019-2024)
3.2.2 Global Silicon Wafer Laser Dicing Machine Revenue Market Share by Company (2019-2024)
3.3 Global Silicon Wafer Laser Dicing Machine Sale Price by Company
3.4 Key Manufacturers Silicon Wafer Laser Dicing Machine Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Silicon Wafer Laser Dicing Machine Product Location Distribution
3.4.2 Players Silicon Wafer Laser Dicing Machine Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Silicon Wafer Laser Dicing Machine by Geographic Region
4.1 World Historic Silicon Wafer Laser Dicing Machine Market Size by Geographic Region (2019-2024)
4.1.1 Global Silicon Wafer Laser Dicing Machine Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Silicon Wafer Laser Dicing Machine Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Silicon Wafer Laser Dicing Machine Market Size by Country/Region (2019-2024)
4.2.1 Global Silicon Wafer Laser Dicing Machine Annual Sales by Country/Region (2019-2024)
4.2.2 Global Silicon Wafer Laser Dicing Machine Annual Revenue by Country/Region (2019-2024)
4.3 Americas Silicon Wafer Laser Dicing Machine Sales Growth
4.4 APAC Silicon Wafer Laser Dicing Machine Sales Growth
4.5 Europe Silicon Wafer Laser Dicing Machine Sales Growth
4.6 Middle East & Africa Silicon Wafer Laser Dicing Machine Sales Growth
5 Americas
5.1 Americas Silicon Wafer Laser Dicing Machine Sales by Country
5.1.1 Americas Silicon Wafer Laser Dicing Machine Sales by Country (2019-2024)
5.1.2 Americas Silicon Wafer Laser Dicing Machine Revenue by Country (2019-2024)
5.2 Americas Silicon Wafer Laser Dicing Machine Sales by Type (2019-2024)
5.3 Americas Silicon Wafer Laser Dicing Machine Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Silicon Wafer Laser Dicing Machine Sales by Region
6.1.1 APAC Silicon Wafer Laser Dicing Machine Sales by Region (2019-2024)
6.1.2 APAC Silicon Wafer Laser Dicing Machine Revenue by Region (2019-2024)
6.2 APAC Silicon Wafer Laser Dicing Machine Sales by Type (2019-2024)
6.3 APAC Silicon Wafer Laser Dicing Machine Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Silicon Wafer Laser Dicing Machine by Country
7.1.1 Europe Silicon Wafer Laser Dicing Machine Sales by Country (2019-2024)
7.1.2 Europe Silicon Wafer Laser Dicing Machine Revenue by Country (2019-2024)
7.2 Europe Silicon Wafer Laser Dicing Machine Sales by Type (2019-2024)
7.3 Europe Silicon Wafer Laser Dicing Machine Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Silicon Wafer Laser Dicing Machine by Country
8.1.1 Middle East & Africa Silicon Wafer Laser Dicing Machine Sales by Country (2019-2024)
8.1.2 Middle East & Africa Silicon Wafer Laser Dicing Machine Revenue by Country (2019-2024)
8.2 Middle East & Africa Silicon Wafer Laser Dicing Machine Sales by Type (2019-2024)
8.3 Middle East & Africa Silicon Wafer Laser Dicing Machine Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Silicon Wafer Laser Dicing Machine
10.3 Manufacturing Process Analysis of Silicon Wafer Laser Dicing Machine
10.4 Industry Chain Structure of Silicon Wafer Laser Dicing Machine
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Silicon Wafer Laser Dicing Machine Distributors
11.3 Silicon Wafer Laser Dicing Machine Customer
12 World Forecast Review for Silicon Wafer Laser Dicing Machine by Geographic Region
12.1 Global Silicon Wafer Laser Dicing Machine Market Size Forecast by Region
12.1.1 Global Silicon Wafer Laser Dicing Machine Forecast by Region (2025-2030)
12.1.2 Global Silicon Wafer Laser Dicing Machine Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Silicon Wafer Laser Dicing Machine Forecast by Type (2025-2030)
12.7 Global Silicon Wafer Laser Dicing Machine Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 DISCO Corporation
13.1.1 DISCO Corporation Company Information
13.1.2 DISCO Corporation Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.1.3 DISCO Corporation Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 DISCO Corporation Main Business Overview
13.1.5 DISCO Corporation Latest Developments
13.2 Han's Laser Technology
13.2.1 Han's Laser Technology Company Information
13.2.2 Han's Laser Technology Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.2.3 Han's Laser Technology Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Han's Laser Technology Main Business Overview
13.2.5 Han's Laser Technology Latest Developments
13.3 Wuhan Huagong Laser Engineering
13.3.1 Wuhan Huagong Laser Engineering Company Information
13.3.2 Wuhan Huagong Laser Engineering Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.3.3 Wuhan Huagong Laser Engineering Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Wuhan Huagong Laser Engineering Main Business Overview
13.3.5 Wuhan Huagong Laser Engineering Latest Developments
13.4 Suzhou Delphi Laser
13.4.1 Suzhou Delphi Laser Company Information
13.4.2 Suzhou Delphi Laser Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.4.3 Suzhou Delphi Laser Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Suzhou Delphi Laser Main Business Overview
13.4.5 Suzhou Delphi Laser Latest Developments
13.5 Tokyo Seimitsu
13.5.1 Tokyo Seimitsu Company Information
13.5.2 Tokyo Seimitsu Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.5.3 Tokyo Seimitsu Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Tokyo Seimitsu Main Business Overview
13.5.5 Tokyo Seimitsu Latest Developments
13.6 Suzhou Maxwell Technologies
13.6.1 Suzhou Maxwell Technologies Company Information
13.6.2 Suzhou Maxwell Technologies Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.6.3 Suzhou Maxwell Technologies Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Suzhou Maxwell Technologies Main Business Overview
13.6.5 Suzhou Maxwell Technologies Latest Developments
13.7 Suzhou Quick Laser Technology
13.7.1 Suzhou Quick Laser Technology Company Information
13.7.2 Suzhou Quick Laser Technology Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.7.3 Suzhou Quick Laser Technology Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Suzhou Quick Laser Technology Main Business Overview
13.7.5 Suzhou Quick Laser Technology Latest Developments
13.8 EO Technics
13.8.1 EO Technics Company Information
13.8.2 EO Technics Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.8.3 EO Technics Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 EO Technics Main Business Overview
13.8.5 EO Technics Latest Developments
13.9 Synova S.A.
13.9.1 Synova S.A. Company Information
13.9.2 Synova S.A. Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.9.3 Synova S.A. Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Synova S.A. Main Business Overview
13.9.5 Synova S.A. Latest Developments
13.10 Shenzhen Guangyuan Intelligent Equipment
13.10.1 Shenzhen Guangyuan Intelligent Equipment Company Information
13.10.2 Shenzhen Guangyuan Intelligent Equipment Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.10.3 Shenzhen Guangyuan Intelligent Equipment Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Shenzhen Guangyuan Intelligent Equipment Main Business Overview
13.10.5 Shenzhen Guangyuan Intelligent Equipment Latest Developments
13.11 China Electronics Technology Group
13.11.1 China Electronics Technology Group Company Information
13.11.2 China Electronics Technology Group Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.11.3 China Electronics Technology Group Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 China Electronics Technology Group Main Business Overview
13.11.5 China Electronics Technology Group Latest Developments
13.12 3D-Micromac AG
13.12.1 3D-Micromac AG Company Information
13.12.2 3D-Micromac AG Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.12.3 3D-Micromac AG Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 3D-Micromac AG Main Business Overview
13.12.5 3D-Micromac AG Latest Developments
13.13 Genesem
13.13.1 Genesem Company Information
13.13.2 Genesem Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.13.3 Genesem Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 Genesem Main Business Overview
13.13.5 Genesem Latest Developments
13.14 ASMPT
13.14.1 ASMPT Company Information
13.14.2 ASMPT Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.14.3 ASMPT Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 ASMPT Main Business Overview
13.14.5 ASMPT Latest Developments
13.15 GIE
13.15.1 GIE Company Information
13.15.2 GIE Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.15.3 GIE Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 GIE Main Business Overview
13.15.5 GIE Latest Developments
13.16 Suzhou Lumi Laser Technology
13.16.1 Suzhou Lumi Laser Technology Company Information
13.16.2 Suzhou Lumi Laser Technology Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.16.3 Suzhou Lumi Laser Technology Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 Suzhou Lumi Laser Technology Main Business Overview
13.16.5 Suzhou Lumi Laser Technology Latest Developments
13.17 Corning
13.17.1 Corning Company Information
13.17.2 Corning Silicon Wafer Laser Dicing Machine Product Portfolios and Specifications
13.17.3 Corning Silicon Wafer Laser Dicing Machine Sales, Revenue, Price and Gross Margin (2019-2024)
13.17.4 Corning Main Business Overview
13.17.5 Corning Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
