The global Solder Ball market size is predicted to grow from US$ 296 million in 2025 to US$ 438 million in 2031; it is expected to grow at a CAGR of 6.7% from 2025 to 2031.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The Solder Ball industry can be broken down into several segments, Lead Solder Ball and Lead Free Solder Ball.
Across the world, the major players cover Senju Metal, DS HiMetal, etc.
Asia Pacific held the leading share of the market in terms of revenue. We estimate that the global market share of Solder Ball is 27% in Taiwan, 20% in Korea, 17% in Japan, 15% in China and 10% in South East Asia.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market. Senju Metal dominated with 40% revenue share, followed by DS HiMetal with 19% revenue share and MKE with 7% revenue share.
The 鈥淪older Ball Industry Forecast鈥� looks at past sales and reviews total world Solder Ball sales in 2024, providing a comprehensive analysis by region and market sector of projected Solder Ball sales for 2025 through 2031. With Solder Ball sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Solder Ball industry.
This Insight Report provides a comprehensive analysis of the global Solder Ball landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Solder Ball portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Solder Ball market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Solder Ball and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Solder Ball.
This report presents a comprehensive overview, market shares, and growth opportunities of Solder Ball market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Lead Solder Ball
Lead Free Solder Ball
Segmentation by Application:
BGA
CSP & WLCSP
Flip-Chip & Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Solder Ball market?
What factors are driving Solder Ball market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Solder Ball market opportunities vary by end market size?
How does Solder Ball break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Solder Ball Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Solder Ball by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Solder Ball by Country/Region, 2020, 2024 & 2031
2.2 Solder Ball Segment by Type
2.2.1 Lead Solder Ball
2.2.2 Lead Free Solder Ball
2.3 Solder Ball Sales by Type
2.3.1 Global Solder Ball Sales Market Share by Type (2020-2025)
2.3.2 Global Solder Ball Revenue and Market Share by Type (2020-2025)
2.3.3 Global Solder Ball Sale Price by Type (2020-2025)
2.4 Solder Ball Segment by Application
2.4.1 BGA
2.4.2 CSP & WLCSP
2.4.3 Flip-Chip & Others
2.5 Solder Ball Sales by Application
2.5.1 Global Solder Ball Sale Market Share by Application (2020-2025)
2.5.2 Global Solder Ball Revenue and Market Share by Application (2020-2025)
2.5.3 Global Solder Ball Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Solder Ball Breakdown Data by Company
3.1.1 Global Solder Ball Annual Sales by Company (2020-2025)
3.1.2 Global Solder Ball Sales Market Share by Company (2020-2025)
3.2 Global Solder Ball Annual Revenue by Company (2020-2025)
3.2.1 Global Solder Ball Revenue by Company (2020-2025)
3.2.2 Global Solder Ball Revenue Market Share by Company (2020-2025)
3.3 Global Solder Ball Sale Price by Company
3.4 Key Manufacturers Solder Ball Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Solder Ball Product Location Distribution
3.4.2 Players Solder Ball Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Solder Ball by Geographic Region
4.1 World Historic Solder Ball Market Size by Geographic Region (2020-2025)
4.1.1 Global Solder Ball Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Solder Ball Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Solder Ball Market Size by Country/Region (2020-2025)
4.2.1 Global Solder Ball Annual Sales by Country/Region (2020-2025)
4.2.2 Global Solder Ball Annual Revenue by Country/Region (2020-2025)
4.3 Americas Solder Ball Sales Growth
4.4 APAC Solder Ball Sales Growth
4.5 Europe Solder Ball Sales Growth
4.6 Middle East & Africa Solder Ball Sales Growth
5 Americas
5.1 Americas Solder Ball Sales by Country
5.1.1 Americas Solder Ball Sales by Country (2020-2025)
5.1.2 Americas Solder Ball Revenue by Country (2020-2025)
5.2 Americas Solder Ball Sales by Type (2020-2025)
5.3 Americas Solder Ball Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Solder Ball Sales by Region
6.1.1 APAC Solder Ball Sales by Region (2020-2025)
6.1.2 APAC Solder Ball Revenue by Region (2020-2025)
6.2 APAC Solder Ball Sales by Type (2020-2025)
6.3 APAC Solder Ball Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Solder Ball by Country
7.1.1 Europe Solder Ball Sales by Country (2020-2025)
7.1.2 Europe Solder Ball Revenue by Country (2020-2025)
7.2 Europe Solder Ball Sales by Type (2020-2025)
7.3 Europe Solder Ball Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Solder Ball by Country
8.1.1 Middle East & Africa Solder Ball Sales by Country (2020-2025)
8.1.2 Middle East & Africa Solder Ball Revenue by Country (2020-2025)
8.2 Middle East & Africa Solder Ball Sales by Type (2020-2025)
8.3 Middle East & Africa Solder Ball Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Solder Ball
10.3 Manufacturing Process Analysis of Solder Ball
10.4 Industry Chain Structure of Solder Ball
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Solder Ball Distributors
11.3 Solder Ball Customer
12 World Forecast Review for Solder Ball by Geographic Region
12.1 Global Solder Ball Market Size Forecast by Region
12.1.1 Global Solder Ball Forecast by Region (2026-2031)
12.1.2 Global Solder Ball Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Solder Ball Forecast by Type (2026-2031)
12.7 Global Solder Ball Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Senju Metal
13.1.1 Senju Metal Company Information
13.1.2 Senju Metal Solder Ball Product Portfolios and Specifications
13.1.3 Senju Metal Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Senju Metal Main Business Overview
13.1.5 Senju Metal Latest Developments
13.2 Accurus
13.2.1 Accurus Company Information
13.2.2 Accurus Solder Ball Product Portfolios and Specifications
13.2.3 Accurus Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Accurus Main Business Overview
13.2.5 Accurus Latest Developments
13.3 DS HiMetal
13.3.1 DS HiMetal Company Information
13.3.2 DS HiMetal Solder Ball Product Portfolios and Specifications
13.3.3 DS HiMetal Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 DS HiMetal Main Business Overview
13.3.5 DS HiMetal Latest Developments
13.4 NMC
13.4.1 NMC Company Information
13.4.2 NMC Solder Ball Product Portfolios and Specifications
13.4.3 NMC Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 NMC Main Business Overview
13.4.5 NMC Latest Developments
13.5 MKE
13.5.1 MKE Company Information
13.5.2 MKE Solder Ball Product Portfolios and Specifications
13.5.3 MKE Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 MKE Main Business Overview
13.5.5 MKE Latest Developments
13.6 PMTC
13.6.1 PMTC Company Information
13.6.2 PMTC Solder Ball Product Portfolios and Specifications
13.6.3 PMTC Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 PMTC Main Business Overview
13.6.5 PMTC Latest Developments
13.7 Indium Corporation
13.7.1 Indium Corporation Company Information
13.7.2 Indium Corporation Solder Ball Product Portfolios and Specifications
13.7.3 Indium Corporation Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 Indium Corporation Main Business Overview
13.7.5 Indium Corporation Latest Developments
13.8 YCTC
13.8.1 YCTC Company Information
13.8.2 YCTC Solder Ball Product Portfolios and Specifications
13.8.3 YCTC Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 YCTC Main Business Overview
13.8.5 YCTC Latest Developments
13.9 Shenmao Technology
13.9.1 Shenmao Technology Company Information
13.9.2 Shenmao Technology Solder Ball Product Portfolios and Specifications
13.9.3 Shenmao Technology Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Shenmao Technology Main Business Overview
13.9.5 Shenmao Technology Latest Developments
13.10 Shanghai hiking solder material
13.10.1 Shanghai hiking solder material Company Information
13.10.2 Shanghai hiking solder material Solder Ball Product Portfolios and Specifications
13.10.3 Shanghai hiking solder material Solder Ball Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Shanghai hiking solder material Main Business Overview
13.10.5 Shanghai hiking solder material Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
