Global System On Package (SOP) Market Growth (Status and Outlook) 2024-2030

Publication ID:

LPI06247838

Publication Date:

June 21, 2024

Pages:

103

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global System On Package (SOP) market size was valued at US$ million in 2023. With growing demand in downstream market, the System On Package (SOP) is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during review period.
The research report highlights the growth potential of the global System On Package (SOP) market. System On Package (SOP) are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of System On Package (SOP). Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the System On Package (SOP) market.
System on package (SOP) refers to technology that places an entire system with computing, communications, and consumer functions all in a single chip.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Key Features:
The report on System On Package (SOP) market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the System On Package (SOP) market. It may include historical data, market segmentation by Type (e.g., Fine-Pitch, High Bandwidth Wiring), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the System On Package (SOP) market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the System On Package (SOP) market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the System On Package (SOP) industry. This include advancements in System On Package (SOP) technology, System On Package (SOP) new entrants, System On Package (SOP) new investment, and other innovations that are shaping the future of System On Package (SOP).
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the System On Package (SOP) market. It includes factors influencing customer ' purchasing decisions, preferences for System On Package (SOP) product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the System On Package (SOP) market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting System On Package (SOP) market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the System On Package (SOP) market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the System On Package (SOP) industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the System On Package (SOP) market.
Market Segmentation:
System On Package (SOP) market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
Fine-Pitch
High Bandwidth Wiring
Advanced Microchannel Cooling
Others
Segmentation by application
Consumer Electronics
Wireless Communication
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Samsung Electronics Co., Ltd.
ASE Group
Amkor Technology
Toshiba Corporation
Qualcomm Incorporated
ChipMOS Technologies Inc
Powertech Technologies Inc.
Fujitsu
Renesas Electronics Corporation
Siliconware Precision Industries Co.
NXP
Jiangsu Changjiang Electronics Technology Co. Ltd.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global System On Package (SOP) Market Size 2019-2030
2.1.2 System On Package (SOP) Market Size CAGR by Region 2019 VS 2023 VS 2030
2.2 System On Package (SOP) Segment by Type
2.2.1 Fine-Pitch
2.2.2 High Bandwidth Wiring
2.2.3 Advanced Microchannel Cooling
2.2.4 Others
2.3 System On Package (SOP) Market Size by Type
2.3.1 System On Package (SOP) Market Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global System On Package (SOP) Market Size Market Share by Type (2019-2024)
2.4 System On Package (SOP) Segment by Application
2.4.1 Consumer Electronics
2.4.2 Wireless Communication
2.5 System On Package (SOP) Market Size by Application
2.5.1 System On Package (SOP) Market Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global System On Package (SOP) Market Size Market Share by Application (2019-2024)
3 System On Package (SOP) Market Size by Player
3.1 System On Package (SOP) Market Size Market Share by Players
3.1.1 Global System On Package (SOP) Revenue by Players (2019-2024)
3.1.2 Global System On Package (SOP) Revenue Market Share by Players (2019-2024)
3.2 Global System On Package (SOP) Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 System On Package (SOP) by Regions
4.1 System On Package (SOP) Market Size by Regions (2019-2024)
4.2 Americas System On Package (SOP) Market Size Growth (2019-2024)
4.3 APAC System On Package (SOP) Market Size Growth (2019-2024)
4.4 Europe System On Package (SOP) Market Size Growth (2019-2024)
4.5 Middle East & Africa System On Package (SOP) Market Size Growth (2019-2024)
5 Americas
5.1 Americas System On Package (SOP) Market Size by Country (2019-2024)
5.2 Americas System On Package (SOP) Market Size by Type (2019-2024)
5.3 Americas System On Package (SOP) Market Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC System On Package (SOP) Market Size by Region (2019-2024)
6.2 APAC System On Package (SOP) Market Size by Type (2019-2024)
6.3 APAC System On Package (SOP) Market Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe System On Package (SOP) by Country (2019-2024)
7.2 Europe System On Package (SOP) Market Size by Type (2019-2024)
7.3 Europe System On Package (SOP) Market Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa System On Package (SOP) by Region (2019-2024)
8.2 Middle East & Africa System On Package (SOP) Market Size by Type (2019-2024)
8.3 Middle East & Africa System On Package (SOP) Market Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Global System On Package (SOP) Market Forecast
10.1 Global System On Package (SOP) Forecast by Regions (2025-2030)
10.1.1 Global System On Package (SOP) Forecast by Regions (2025-2030)
10.1.2 Americas System On Package (SOP) Forecast
10.1.3 APAC System On Package (SOP) Forecast
10.1.4 Europe System On Package (SOP) Forecast
10.1.5 Middle East & Africa System On Package (SOP) Forecast
10.2 Americas System On Package (SOP) Forecast by Country (2025-2030)
10.2.1 United States System On Package (SOP) Market Forecast
10.2.2 Canada System On Package (SOP) Market Forecast
10.2.3 Mexico System On Package (SOP) Market Forecast
10.2.4 Brazil System On Package (SOP) Market Forecast
10.3 APAC System On Package (SOP) Forecast by Region (2025-2030)
10.3.1 China System On Package (SOP) Market Forecast
10.3.2 Japan System On Package (SOP) Market Forecast
10.3.3 Korea System On Package (SOP) Market Forecast
10.3.4 Southeast Asia System On Package (SOP) Market Forecast
10.3.5 India System On Package (SOP) Market Forecast
10.3.6 Australia System On Package (SOP) Market Forecast
10.4 Europe System On Package (SOP) Forecast by Country (2025-2030)
10.4.1 Germany System On Package (SOP) Market Forecast
10.4.2 France System On Package (SOP) Market Forecast
10.4.3 UK System On Package (SOP) Market Forecast
10.4.4 Italy System On Package (SOP) Market Forecast
10.4.5 Russia System On Package (SOP) Market Forecast
10.5 Middle East & Africa System On Package (SOP) Forecast by Region (2025-2030)
10.5.1 Egypt System On Package (SOP) Market Forecast
10.5.2 South Africa System On Package (SOP) Market Forecast
10.5.3 Israel System On Package (SOP) Market Forecast
10.5.4 Turkey System On Package (SOP) Market Forecast
10.5.5 GCC Countries System On Package (SOP) Market Forecast
10.6 Global System On Package (SOP) Forecast by Type (2025-2030)
10.7 Global System On Package (SOP) Forecast by Application (2025-2030)

11 Key Players Analysis
11.1 Samsung Electronics Co., Ltd.
11.1.1 Samsung Electronics Co., Ltd. Company Information
11.1.2 Samsung Electronics Co., Ltd. System On Package (SOP) Product Offered
11.1.3 Samsung Electronics Co., Ltd. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.1.4 Samsung Electronics Co., Ltd. Main Business Overview
11.1.5 Samsung Electronics Co., Ltd. Latest Developments
11.2 ASE Group
11.2.1 ASE Group Company Information
11.2.2 ASE Group System On Package (SOP) Product Offered
11.2.3 ASE Group System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.2.4 ASE Group Main Business Overview
11.2.5 ASE Group Latest Developments
11.3 Amkor Technology
11.3.1 Amkor Technology Company Information
11.3.2 Amkor Technology System On Package (SOP) Product Offered
11.3.3 Amkor Technology System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.3.4 Amkor Technology Main Business Overview
11.3.5 Amkor Technology Latest Developments
11.4 Toshiba Corporation
11.4.1 Toshiba Corporation Company Information
11.4.2 Toshiba Corporation System On Package (SOP) Product Offered
11.4.3 Toshiba Corporation System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.4.4 Toshiba Corporation Main Business Overview
11.4.5 Toshiba Corporation Latest Developments
11.5 Qualcomm Incorporated
11.5.1 Qualcomm Incorporated Company Information
11.5.2 Qualcomm Incorporated System On Package (SOP) Product Offered
11.5.3 Qualcomm Incorporated System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.5.4 Qualcomm Incorporated Main Business Overview
11.5.5 Qualcomm Incorporated Latest Developments
11.6 ChipMOS Technologies Inc
11.6.1 ChipMOS Technologies Inc Company Information
11.6.2 ChipMOS Technologies Inc System On Package (SOP) Product Offered
11.6.3 ChipMOS Technologies Inc System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.6.4 ChipMOS Technologies Inc Main Business Overview
11.6.5 ChipMOS Technologies Inc Latest Developments
11.7 Powertech Technologies Inc.
11.7.1 Powertech Technologies Inc. Company Information
11.7.2 Powertech Technologies Inc. System On Package (SOP) Product Offered
11.7.3 Powertech Technologies Inc. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.7.4 Powertech Technologies Inc. Main Business Overview
11.7.5 Powertech Technologies Inc. Latest Developments
11.8 Fujitsu
11.8.1 Fujitsu Company Information
11.8.2 Fujitsu System On Package (SOP) Product Offered
11.8.3 Fujitsu System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.8.4 Fujitsu Main Business Overview
11.8.5 Fujitsu Latest Developments
11.9 Renesas Electronics Corporation
11.9.1 Renesas Electronics Corporation Company Information
11.9.2 Renesas Electronics Corporation System On Package (SOP) Product Offered
11.9.3 Renesas Electronics Corporation System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.9.4 Renesas Electronics Corporation Main Business Overview
11.9.5 Renesas Electronics Corporation Latest Developments
11.10 Siliconware Precision Industries Co.
11.10.1 Siliconware Precision Industries Co. Company Information
11.10.2 Siliconware Precision Industries Co. System On Package (SOP) Product Offered
11.10.3 Siliconware Precision Industries Co. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.10.4 Siliconware Precision Industries Co. Main Business Overview
11.10.5 Siliconware Precision Industries Co. Latest Developments
11.11 NXP
11.11.1 NXP Company Information
11.11.2 NXP System On Package (SOP) Product Offered
11.11.3 NXP System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.11.4 NXP Main Business Overview
11.11.5 NXP Latest Developments
11.12 Jiangsu Changjiang Electronics Technology Co. Ltd.
11.12.1 Jiangsu Changjiang Electronics Technology Co. Ltd. Company Information
11.12.2 Jiangsu Changjiang Electronics Technology Co. Ltd. System On Package (SOP) Product Offered
11.12.3 Jiangsu Changjiang Electronics Technology Co. Ltd. System On Package (SOP) Revenue, Gross Margin and Market Share (2019-2024)
11.12.4 Jiangsu Changjiang Electronics Technology Co. Ltd. Main Business Overview
11.12.5 Jiangsu Changjiang Electronics Technology Co. Ltd. Latest Developments
12 Research Findings and Conclusion

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