The global Thinning Machine market size is predicted to grow from US$ 1101 million in 2025 to US$ 1687 million in 2031; it is expected to grow at a CAGR of 7.4% from 2025 to 2031.
Thinning Machine uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
The Thinning Machines market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Thinning Machines are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Thinning Machines, the fully automatic Thinning Machines dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Thinning Machine and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Thinning Machines. Fully automatic Thinning Machines, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Thinning Machines are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Thinning Machine market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Thinning Machines, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Thinning Machine market, as manufacturers need specialized equipment to handle the larger wafers efficiently.
Shift Towards Fully Automated Solutions: Fully automated Thinning Machines are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Market Restraints:
Despite the strong growth, several factors may restrain the expansion of the Thinning Machine market:
High Initial Investment: Fully automatic Thinning Machines come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.
Technological Complexity: Fully automatic Thinning Machines are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.
Conclusion:
The Thinning Machine market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Thinning Machines, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Thinning Machines, accounting for 78% of the global market. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for Thinning Machine.
In conclusion, the Thinning Machine market offers abundant opportunities for companies that can provide high-quality, efficient, and cost-effective wafer grinding solutions, particularly those that address the increasing demand for 300mm wafers and advanced semiconductor manufacturing processes.
The “Thinning Machine Industry Forecast” looks at past sales and reviews total world Thinning Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Thinning Machine sales for 2025 through 2031. With Thinning Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Thinning Machine industry.
This Insight Report provides a comprehensive analysis of the global Thinning Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Thinning Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Thinning Machine market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Thinning Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Thinning Machine.
This report presents a comprehensive overview, market shares, and growth opportunities of Thinning Machine market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Fully Automatic
Semi-Automatic
Segmentation by Application:
200mm Wafer
300mm Wafer
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
Key Questions Addressed in this Report
What is the 10-year outlook for the global Thinning Machine market?
What factors are driving Thinning Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Thinning Machine market opportunities vary by end market size?
How does Thinning Machine break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Thinning Machine Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Thinning Machine by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Thinning Machine by Country/Region, 2020, 2024 & 2031
2.2 Thinning Machine Segment by Type
2.2.1 Fully Automatic
2.2.2 Semi-Automatic
2.3 Thinning Machine Sales by Type
2.3.1 Global Thinning Machine Sales Market Share by Type (2020-2025)
2.3.2 Global Thinning Machine Revenue and Market Share by Type (2020-2025)
2.3.3 Global Thinning Machine Sale Price by Type (2020-2025)
2.4 Thinning Machine Segment by Application
2.4.1 200mm Wafer
2.4.2 300mm Wafer
2.4.3 Others
2.5 Thinning Machine Sales by Application
2.5.1 Global Thinning Machine Sale Market Share by Application (2020-2025)
2.5.2 Global Thinning Machine Revenue and Market Share by Application (2020-2025)
2.5.3 Global Thinning Machine Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Thinning Machine Breakdown Data by Company
3.1.1 Global Thinning Machine Annual Sales by Company (2020-2025)
3.1.2 Global Thinning Machine Sales Market Share by Company (2020-2025)
3.2 Global Thinning Machine Annual Revenue by Company (2020-2025)
3.2.1 Global Thinning Machine Revenue by Company (2020-2025)
3.2.2 Global Thinning Machine Revenue Market Share by Company (2020-2025)
3.3 Global Thinning Machine Sale Price by Company
3.4 Key Manufacturers Thinning Machine Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Thinning Machine Product Location Distribution
3.4.2 Players Thinning Machine Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Thinning Machine by Geographic Region
4.1 World Historic Thinning Machine Market Size by Geographic Region (2020-2025)
4.1.1 Global Thinning Machine Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Thinning Machine Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Thinning Machine Market Size by Country/Region (2020-2025)
4.2.1 Global Thinning Machine Annual Sales by Country/Region (2020-2025)
4.2.2 Global Thinning Machine Annual Revenue by Country/Region (2020-2025)
4.3 Americas Thinning Machine Sales Growth
4.4 APAC Thinning Machine Sales Growth
4.5 Europe Thinning Machine Sales Growth
4.6 Middle East & Africa Thinning Machine Sales Growth
5 Americas
5.1 Americas Thinning Machine Sales by Country
5.1.1 Americas Thinning Machine Sales by Country (2020-2025)
5.1.2 Americas Thinning Machine Revenue by Country (2020-2025)
5.2 Americas Thinning Machine Sales by Type (2020-2025)
5.3 Americas Thinning Machine Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Thinning Machine Sales by Region
6.1.1 APAC Thinning Machine Sales by Region (2020-2025)
6.1.2 APAC Thinning Machine Revenue by Region (2020-2025)
6.2 APAC Thinning Machine Sales by Type (2020-2025)
6.3 APAC Thinning Machine Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Thinning Machine by Country
7.1.1 Europe Thinning Machine Sales by Country (2020-2025)
7.1.2 Europe Thinning Machine Revenue by Country (2020-2025)
7.2 Europe Thinning Machine Sales by Type (2020-2025)
7.3 Europe Thinning Machine Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Thinning Machine by Country
8.1.1 Middle East & Africa Thinning Machine Sales by Country (2020-2025)
8.1.2 Middle East & Africa Thinning Machine Revenue by Country (2020-2025)
8.2 Middle East & Africa Thinning Machine Sales by Type (2020-2025)
8.3 Middle East & Africa Thinning Machine Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Thinning Machine
10.3 Manufacturing Process Analysis of Thinning Machine
10.4 Industry Chain Structure of Thinning Machine
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Thinning Machine Distributors
11.3 Thinning Machine Customer
12 World Forecast Review for Thinning Machine by Geographic Region
12.1 Global Thinning Machine Market Size Forecast by Region
12.1.1 Global Thinning Machine Forecast by Region (2026-2031)
12.1.2 Global Thinning Machine Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Thinning Machine Forecast by Type (2026-2031)
12.7 Global Thinning Machine Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Disco
13.1.1 Disco Company Information
13.1.2 Disco Thinning Machine Product Portfolios and Specifications
13.1.3 Disco Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Disco Main Business Overview
13.1.5 Disco Latest Developments
13.2 TOKYO SEIMITSU
13.2.1 TOKYO SEIMITSU Company Information
13.2.2 TOKYO SEIMITSU Thinning Machine Product Portfolios and Specifications
13.2.3 TOKYO SEIMITSU Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 TOKYO SEIMITSU Main Business Overview
13.2.5 TOKYO SEIMITSU Latest Developments
13.3 G&N
13.3.1 G&N Company Information
13.3.2 G&N Thinning Machine Product Portfolios and Specifications
13.3.3 G&N Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 G&N Main Business Overview
13.3.5 G&N Latest Developments
13.4 Okamoto Semiconductor Equipment Division
13.4.1 Okamoto Semiconductor Equipment Division Company Information
13.4.2 Okamoto Semiconductor Equipment Division Thinning Machine Product Portfolios and Specifications
13.4.3 Okamoto Semiconductor Equipment Division Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Okamoto Semiconductor Equipment Division Main Business Overview
13.4.5 Okamoto Semiconductor Equipment Division Latest Developments
13.5 CETC
13.5.1 CETC Company Information
13.5.2 CETC Thinning Machine Product Portfolios and Specifications
13.5.3 CETC Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 CETC Main Business Overview
13.5.5 CETC Latest Developments
13.6 Koyo Machinery
13.6.1 Koyo Machinery Company Information
13.6.2 Koyo Machinery Thinning Machine Product Portfolios and Specifications
13.6.3 Koyo Machinery Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Koyo Machinery Main Business Overview
13.6.5 Koyo Machinery Latest Developments
13.7 Revasum
13.7.1 Revasum Company Information
13.7.2 Revasum Thinning Machine Product Portfolios and Specifications
13.7.3 Revasum Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 Revasum Main Business Overview
13.7.5 Revasum Latest Developments
13.8 WAIDA MFG
13.8.1 WAIDA MFG Company Information
13.8.2 WAIDA MFG Thinning Machine Product Portfolios and Specifications
13.8.3 WAIDA MFG Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 WAIDA MFG Main Business Overview
13.8.5 WAIDA MFG Latest Developments
13.9 Hunan Yujing Machine Industrial
13.9.1 Hunan Yujing Machine Industrial Company Information
13.9.2 Hunan Yujing Machine Industrial Thinning Machine Product Portfolios and Specifications
13.9.3 Hunan Yujing Machine Industrial Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Hunan Yujing Machine Industrial Main Business Overview
13.9.5 Hunan Yujing Machine Industrial Latest Developments
13.10 SpeedFam
13.10.1 SpeedFam Company Information
13.10.2 SpeedFam Thinning Machine Product Portfolios and Specifications
13.10.3 SpeedFam Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 SpeedFam Main Business Overview
13.10.5 SpeedFam Latest Developments
13.11 TSD
13.11.1 TSD Company Information
13.11.2 TSD Thinning Machine Product Portfolios and Specifications
13.11.3 TSD Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 TSD Main Business Overview
13.11.5 TSD Latest Developments
13.12 Engis Corporation
13.12.1 Engis Corporation Company Information
13.12.2 Engis Corporation Thinning Machine Product Portfolios and Specifications
13.12.3 Engis Corporation Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 Engis Corporation Main Business Overview
13.12.5 Engis Corporation Latest Developments
13.13 NTS
13.13.1 NTS Company Information
13.13.2 NTS Thinning Machine Product Portfolios and Specifications
13.13.3 NTS Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
13.13.4 NTS Main Business Overview
13.13.5 NTS Latest Developments
14 Research Findings and Conclusion
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*If Applicable.