Underfill adhesive for IC packaging is a high-fluidity, high-filling capacity adhesive material specially used in the semiconductor chip packaging process. Its main function is to form a filling layer between the chip and the substrate to enhance the mechanical strength, thermal stability and electrical performance of the chip package.
The global Underfill for IC Packaging market size is projected to grow from US$ 390 million in 2024 to US$ 567 million in 2030; it is expected to grow at a CAGR of 6.4% from 2024 to 2030.
The 鈥淯nderfill for IC Packaging Industry Forecast鈥� looks at past sales and reviews total world Underfill for IC Packaging sales in 2023, providing a comprehensive analysis by region and market sector of projected Underfill for IC Packaging sales for 2024 through 2030. With Underfill for IC Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfill for IC Packaging industry.
This Insight Report provides a comprehensive analysis of the global Underfill for IC Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfill for IC Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Underfill for IC Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfill for IC Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfill for IC Packaging.
United States market for Underfill for IC Packaging is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Underfill for IC Packaging is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Underfill for IC Packaging is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Underfill for IC Packaging players cover Henkel, Won Chemical, NAMICS, Resonac, Panasonic, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Underfill for IC Packaging market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
FC Underfill
BGA Underfill
WLCSP Underfill
Segmentation by Application:
Smart Phone
Tablets & Laptops
Automotive Electronics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
Won Chemical
NAMICS
Resonac
Panasonic
MacDermid Alpha
Shin-Etsu
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Hanstars
Nagase ChemteX
LORD Corporation
Asec Co., Ltd.
Everwide Chemical
Bondline
Panacol-Elosol
United Adhesives
U-Bond
Shenzhen Cooteck Electronic Material Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Underfill for IC Packaging market?
What factors are driving Underfill for IC Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Underfill for IC Packaging market opportunities vary by end market size?
How does Underfill for IC Packaging break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Underfill for IC Packaging Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Underfill for IC Packaging by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Underfill for IC Packaging by Country/Region, 2019, 2023 & 2030
2.2 Underfill for IC Packaging Segment by Type
2.2.1 FC Underfill
2.2.2 BGA Underfill
2.2.3 WLCSP Underfill
2.3 Underfill for IC Packaging Sales by Type
2.3.1 Global Underfill for IC Packaging Sales Market Share by Type (2019-2024)
2.3.2 Global Underfill for IC Packaging Revenue and Market Share by Type (2019-2024)
2.3.3 Global Underfill for IC Packaging Sale Price by Type (2019-2024)
2.4 Underfill for IC Packaging Segment by Application
2.4.1 Smart Phone
2.4.2 Tablets & Laptops
2.4.3 Automotive Electronics
2.4.4 Others
2.5 Underfill for IC Packaging Sales by Application
2.5.1 Global Underfill for IC Packaging Sale Market Share by Application (2019-2024)
2.5.2 Global Underfill for IC Packaging Revenue and Market Share by Application (2019-2024)
2.5.3 Global Underfill for IC Packaging Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Underfill for IC Packaging Breakdown Data by Company
3.1.1 Global Underfill for IC Packaging Annual Sales by Company (2019-2024)
3.1.2 Global Underfill for IC Packaging Sales Market Share by Company (2019-2024)
3.2 Global Underfill for IC Packaging Annual Revenue by Company (2019-2024)
3.2.1 Global Underfill for IC Packaging Revenue by Company (2019-2024)
3.2.2 Global Underfill for IC Packaging Revenue Market Share by Company (2019-2024)
3.3 Global Underfill for IC Packaging Sale Price by Company
3.4 Key Manufacturers Underfill for IC Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Underfill for IC Packaging Product Location Distribution
3.4.2 Players Underfill for IC Packaging Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Underfill for IC Packaging by Geographic Region
4.1 World Historic Underfill for IC Packaging Market Size by Geographic Region (2019-2024)
4.1.1 Global Underfill for IC Packaging Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Underfill for IC Packaging Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Underfill for IC Packaging Market Size by Country/Region (2019-2024)
4.2.1 Global Underfill for IC Packaging Annual Sales by Country/Region (2019-2024)
4.2.2 Global Underfill for IC Packaging Annual Revenue by Country/Region (2019-2024)
4.3 Americas Underfill for IC Packaging Sales Growth
4.4 APAC Underfill for IC Packaging Sales Growth
4.5 Europe Underfill for IC Packaging Sales Growth
4.6 Middle East & Africa Underfill for IC Packaging Sales Growth
5 Americas
5.1 Americas Underfill for IC Packaging Sales by Country
5.1.1 Americas Underfill for IC Packaging Sales by Country (2019-2024)
5.1.2 Americas Underfill for IC Packaging Revenue by Country (2019-2024)
5.2 Americas Underfill for IC Packaging Sales by Type (2019-2024)
5.3 Americas Underfill for IC Packaging Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Underfill for IC Packaging Sales by Region
6.1.1 APAC Underfill for IC Packaging Sales by Region (2019-2024)
6.1.2 APAC Underfill for IC Packaging Revenue by Region (2019-2024)
6.2 APAC Underfill for IC Packaging Sales by Type (2019-2024)
6.3 APAC Underfill for IC Packaging Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Underfill for IC Packaging by Country
7.1.1 Europe Underfill for IC Packaging Sales by Country (2019-2024)
7.1.2 Europe Underfill for IC Packaging Revenue by Country (2019-2024)
7.2 Europe Underfill for IC Packaging Sales by Type (2019-2024)
7.3 Europe Underfill for IC Packaging Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Underfill for IC Packaging by Country
8.1.1 Middle East & Africa Underfill for IC Packaging Sales by Country (2019-2024)
8.1.2 Middle East & Africa Underfill for IC Packaging Revenue by Country (2019-2024)
8.2 Middle East & Africa Underfill for IC Packaging Sales by Type (2019-2024)
8.3 Middle East & Africa Underfill for IC Packaging Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Underfill for IC Packaging
10.3 Manufacturing Process Analysis of Underfill for IC Packaging
10.4 Industry Chain Structure of Underfill for IC Packaging
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Underfill for IC Packaging Distributors
11.3 Underfill for IC Packaging Customer
12 World Forecast Review for Underfill for IC Packaging by Geographic Region
12.1 Global Underfill for IC Packaging Market Size Forecast by Region
12.1.1 Global Underfill for IC Packaging Forecast by Region (2025-2030)
12.1.2 Global Underfill for IC Packaging Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Underfill for IC Packaging Forecast by Type (2025-2030)
12.7 Global Underfill for IC Packaging Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Henkel
13.1.1 Henkel Company Information
13.1.2 Henkel Underfill for IC Packaging Product Portfolios and Specifications
13.1.3 Henkel Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Henkel Main Business Overview
13.1.5 Henkel Latest Developments
13.2 Won Chemical
13.2.1 Won Chemical Company Information
13.2.2 Won Chemical Underfill for IC Packaging Product Portfolios and Specifications
13.2.3 Won Chemical Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Won Chemical Main Business Overview
13.2.5 Won Chemical Latest Developments
13.3 NAMICS
13.3.1 NAMICS Company Information
13.3.2 NAMICS Underfill for IC Packaging Product Portfolios and Specifications
13.3.3 NAMICS Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 NAMICS Main Business Overview
13.3.5 NAMICS Latest Developments
13.4 Resonac
13.4.1 Resonac Company Information
13.4.2 Resonac Underfill for IC Packaging Product Portfolios and Specifications
13.4.3 Resonac Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Resonac Main Business Overview
13.4.5 Resonac Latest Developments
13.5 Panasonic
13.5.1 Panasonic Company Information
13.5.2 Panasonic Underfill for IC Packaging Product Portfolios and Specifications
13.5.3 Panasonic Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Panasonic Main Business Overview
13.5.5 Panasonic Latest Developments
13.6 MacDermid Alpha
13.6.1 MacDermid Alpha Company Information
13.6.2 MacDermid Alpha Underfill for IC Packaging Product Portfolios and Specifications
13.6.3 MacDermid Alpha Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 MacDermid Alpha Main Business Overview
13.6.5 MacDermid Alpha Latest Developments
13.7 Shin-Etsu
13.7.1 Shin-Etsu Company Information
13.7.2 Shin-Etsu Underfill for IC Packaging Product Portfolios and Specifications
13.7.3 Shin-Etsu Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Shin-Etsu Main Business Overview
13.7.5 Shin-Etsu Latest Developments
13.8 Sunstar
13.8.1 Sunstar Company Information
13.8.2 Sunstar Underfill for IC Packaging Product Portfolios and Specifications
13.8.3 Sunstar Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Sunstar Main Business Overview
13.8.5 Sunstar Latest Developments
13.9 Fuji Chemical
13.9.1 Fuji Chemical Company Information
13.9.2 Fuji Chemical Underfill for IC Packaging Product Portfolios and Specifications
13.9.3 Fuji Chemical Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Fuji Chemical Main Business Overview
13.9.5 Fuji Chemical Latest Developments
13.10 Zymet
13.10.1 Zymet Company Information
13.10.2 Zymet Underfill for IC Packaging Product Portfolios and Specifications
13.10.3 Zymet Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Zymet Main Business Overview
13.10.5 Zymet Latest Developments
13.11 Shenzhen Dover
13.11.1 Shenzhen Dover Company Information
13.11.2 Shenzhen Dover Underfill for IC Packaging Product Portfolios and Specifications
13.11.3 Shenzhen Dover Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Shenzhen Dover Main Business Overview
13.11.5 Shenzhen Dover Latest Developments
13.12 Threebond
13.12.1 Threebond Company Information
13.12.2 Threebond Underfill for IC Packaging Product Portfolios and Specifications
13.12.3 Threebond Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Threebond Main Business Overview
13.12.5 Threebond Latest Developments
13.13 AIM Solder
13.13.1 AIM Solder Company Information
13.13.2 AIM Solder Underfill for IC Packaging Product Portfolios and Specifications
13.13.3 AIM Solder Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 AIM Solder Main Business Overview
13.13.5 AIM Solder Latest Developments
13.14 Darbond
13.14.1 Darbond Company Information
13.14.2 Darbond Underfill for IC Packaging Product Portfolios and Specifications
13.14.3 Darbond Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 Darbond Main Business Overview
13.14.5 Darbond Latest Developments
13.15 Master Bond
13.15.1 Master Bond Company Information
13.15.2 Master Bond Underfill for IC Packaging Product Portfolios and Specifications
13.15.3 Master Bond Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Master Bond Main Business Overview
13.15.5 Master Bond Latest Developments
13.16 Hanstars
13.16.1 Hanstars Company Information
13.16.2 Hanstars Underfill for IC Packaging Product Portfolios and Specifications
13.16.3 Hanstars Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 Hanstars Main Business Overview
13.16.5 Hanstars Latest Developments
13.17 Nagase ChemteX
13.17.1 Nagase ChemteX Company Information
13.17.2 Nagase ChemteX Underfill for IC Packaging Product Portfolios and Specifications
13.17.3 Nagase ChemteX Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.17.4 Nagase ChemteX Main Business Overview
13.17.5 Nagase ChemteX Latest Developments
13.18 LORD Corporation
13.18.1 LORD Corporation Company Information
13.18.2 LORD Corporation Underfill for IC Packaging Product Portfolios and Specifications
13.18.3 LORD Corporation Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.18.4 LORD Corporation Main Business Overview
13.18.5 LORD Corporation Latest Developments
13.19 Asec Co., Ltd.
13.19.1 Asec Co., Ltd. Company Information
13.19.2 Asec Co., Ltd. Underfill for IC Packaging Product Portfolios and Specifications
13.19.3 Asec Co., Ltd. Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.19.4 Asec Co., Ltd. Main Business Overview
13.19.5 Asec Co., Ltd. Latest Developments
13.20 Everwide Chemical
13.20.1 Everwide Chemical Company Information
13.20.2 Everwide Chemical Underfill for IC Packaging Product Portfolios and Specifications
13.20.3 Everwide Chemical Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.20.4 Everwide Chemical Main Business Overview
13.20.5 Everwide Chemical Latest Developments
13.21 Bondline
13.21.1 Bondline Company Information
13.21.2 Bondline Underfill for IC Packaging Product Portfolios and Specifications
13.21.3 Bondline Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.21.4 Bondline Main Business Overview
13.21.5 Bondline Latest Developments
13.22 Panacol-Elosol
13.22.1 Panacol-Elosol Company Information
13.22.2 Panacol-Elosol Underfill for IC Packaging Product Portfolios and Specifications
13.22.3 Panacol-Elosol Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.22.4 Panacol-Elosol Main Business Overview
13.22.5 Panacol-Elosol Latest Developments
13.23 United Adhesives
13.23.1 United Adhesives Company Information
13.23.2 United Adhesives Underfill for IC Packaging Product Portfolios and Specifications
13.23.3 United Adhesives Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.23.4 United Adhesives Main Business Overview
13.23.5 United Adhesives Latest Developments
13.24 U-Bond
13.24.1 U-Bond Company Information
13.24.2 U-Bond Underfill for IC Packaging Product Portfolios and Specifications
13.24.3 U-Bond Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.24.4 U-Bond Main Business Overview
13.24.5 U-Bond Latest Developments
13.25 Shenzhen Cooteck Electronic Material Technology
13.25.1 Shenzhen Cooteck Electronic Material Technology Company Information
13.25.2 Shenzhen Cooteck Electronic Material Technology Underfill for IC Packaging Product Portfolios and Specifications
13.25.3 Shenzhen Cooteck Electronic Material Technology Underfill for IC Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.25.4 Shenzhen Cooteck Electronic Material Technology Main Business Overview
13.25.5 Shenzhen Cooteck Electronic Material Technology Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
