The global Underfills for Semiconductor market size is predicted to grow from US$ 298 million in 2025 to US$ 457 million in 2031; it is expected to grow at a CAGR of 7.4% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Underfills for Semiconductor is a key packaging material for connecting chips to substrates. Its core functions include: filling the gap between the chip and the substrate through capillary action to disperse surface stress, effectively alleviating the internal stress caused by the difference in thermal expansion coefficients between the chip, solder and substrate; at the same time, forming a physical protective layer to enhance the impact resistance of the solder balls, significantly improving the reliability of the chip under drop shock and thermal cycling conditions.
From the perspective of application scenarios, underfill can be divided into two categories: board-level packaging applications (PCB) and wafer/panel-level packaging applications. Among them, BGA Underfill is the leading field in the field of board-level packaging, which is mainly used to achieve the gap filling of the solder ball array between the packaging substrate and the PCB circuit board, and its process accuracy is required to reach the millimeter level; while the chip-level packaging field corresponds to the flip-chip underfill (Flip-Chip Underfill), which is specially used for the precision filling of the micro-bump array between the chip and the packaging substrate, and the process window requires micron-level accuracy.
In the Underfill market, the leading companies are mainly from Japan and Europe, such as NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Zymet, MacDermid Alpha, etc. There are certain differences in the applications faced by different companies. In the semiconductor (chip-level packaging) market, the mainstream company is Japan's NAMICS, and the Chinese local company is Darbond Technology. In the PCB field, the core company is Henkel.
The 鈥淯nderfills for Semiconductor Industry Forecast鈥� looks at past sales and reviews total world Underfills for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Underfills for Semiconductor sales for 2025 through 2031. With Underfills for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfills for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Underfills for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfills for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Underfills for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfills for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfills for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of Underfills for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
PLP Underfill
WLP Underfill
Segmentation by Application:
Consumer Electronics
Automotive
Telecom & Infrastructure
Medical
Industrial
Aerospace & Defense
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
NAMICS
Henkel
RESONAC
Nagase ChemteX Corporation
Shin-Etsu Chemical
Panasonic
MacDermid Alpha
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Jiangsu HHCK Advanced Materials Co.,Ltd
Parker Hannifin
Asec Co., Ltd.
Panacol-Elosol
United Adhesives
Henan Siny Optic-com Co., Ltd
Dongguan Hanstars
GTA Material
H.B.Fuller
Key Questions Addressed in this Report
What is the 10-year outlook for the global Underfills for Semiconductor market?
What factors are driving Underfills for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Underfills for Semiconductor market opportunities vary by end market size?
How does Underfills for Semiconductor break out by Type, by Application?
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1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Underfills for Semiconductor Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Underfills for Semiconductor by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Underfills for Semiconductor by Country/Region, 2020, 2024 & 2031
2.2 Underfills for Semiconductor Segment by Type
2.2.1 PLP Underfill
2.2.2 WLP Underfill
2.3 Underfills for Semiconductor Sales by Type
2.3.1 Global Underfills for Semiconductor Sales Market Share by Type (2020-2025)
2.3.2 Global Underfills for Semiconductor Revenue and Market Share by Type (2020-2025)
2.3.3 Global Underfills for Semiconductor Sale Price by Type (2020-2025)
2.4 Underfills for Semiconductor Segment by Application
2.4.1 Consumer Electronics
2.4.2 Automotive
2.4.3 Telecom & Infrastructure
2.4.4 Medical
2.4.5 Industrial
2.4.6 Aerospace & Defense
2.4.7 Others
2.5 Underfills for Semiconductor Sales by Application
2.5.1 Global Underfills for Semiconductor Sale Market Share by Application (2020-2025)
2.5.2 Global Underfills for Semiconductor Revenue and Market Share by Application (2020-2025)
2.5.3 Global Underfills for Semiconductor Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Underfills for Semiconductor Breakdown Data by Company
3.1.1 Global Underfills for Semiconductor Annual Sales by Company (2020-2025)
3.1.2 Global Underfills for Semiconductor Sales Market Share by Company (2020-2025)
3.2 Global Underfills for Semiconductor Annual Revenue by Company (2020-2025)
3.2.1 Global Underfills for Semiconductor Revenue by Company (2020-2025)
3.2.2 Global Underfills for Semiconductor Revenue Market Share by Company (2020-2025)
3.3 Global Underfills for Semiconductor Sale Price by Company
3.4 Key Manufacturers Underfills for Semiconductor Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Underfills for Semiconductor Product Location Distribution
3.4.2 Players Underfills for Semiconductor Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Underfills for Semiconductor by Geographic Region
4.1 World Historic Underfills for Semiconductor Market Size by Geographic Region (2020-2025)
4.1.1 Global Underfills for Semiconductor Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Underfills for Semiconductor Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Underfills for Semiconductor Market Size by Country/Region (2020-2025)
4.2.1 Global Underfills for Semiconductor Annual Sales by Country/Region (2020-2025)
4.2.2 Global Underfills for Semiconductor Annual Revenue by Country/Region (2020-2025)
4.3 Americas Underfills for Semiconductor Sales Growth
4.4 APAC Underfills for Semiconductor Sales Growth
4.5 Europe Underfills for Semiconductor Sales Growth
4.6 Middle East & Africa Underfills for Semiconductor Sales Growth
5 Americas
5.1 Americas Underfills for Semiconductor Sales by Country
5.1.1 Americas Underfills for Semiconductor Sales by Country (2020-2025)
5.1.2 Americas Underfills for Semiconductor Revenue by Country (2020-2025)
5.2 Americas Underfills for Semiconductor Sales by Type (2020-2025)
5.3 Americas Underfills for Semiconductor Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Underfills for Semiconductor Sales by Region
6.1.1 APAC Underfills for Semiconductor Sales by Region (2020-2025)
6.1.2 APAC Underfills for Semiconductor Revenue by Region (2020-2025)
6.2 APAC Underfills for Semiconductor Sales by Type (2020-2025)
6.3 APAC Underfills for Semiconductor Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Underfills for Semiconductor by Country
7.1.1 Europe Underfills for Semiconductor Sales by Country (2020-2025)
7.1.2 Europe Underfills for Semiconductor Revenue by Country (2020-2025)
7.2 Europe Underfills for Semiconductor Sales by Type (2020-2025)
7.3 Europe Underfills for Semiconductor Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Underfills for Semiconductor by Country
8.1.1 Middle East & Africa Underfills for Semiconductor Sales by Country (2020-2025)
8.1.2 Middle East & Africa Underfills for Semiconductor Revenue by Country (2020-2025)
8.2 Middle East & Africa Underfills for Semiconductor Sales by Type (2020-2025)
8.3 Middle East & Africa Underfills for Semiconductor Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Underfills for Semiconductor
10.3 Manufacturing Process Analysis of Underfills for Semiconductor
10.4 Industry Chain Structure of Underfills for Semiconductor
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Underfills for Semiconductor Distributors
11.3 Underfills for Semiconductor Customer
12 World Forecast Review for Underfills for Semiconductor by Geographic Region
12.1 Global Underfills for Semiconductor Market Size Forecast by Region
12.1.1 Global Underfills for Semiconductor Forecast by Region (2026-2031)
12.1.2 Global Underfills for Semiconductor Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Underfills for Semiconductor Forecast by Type (2026-2031)
12.7 Global Underfills for Semiconductor Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 NAMICS
13.1.1 NAMICS Company Information
13.1.2 NAMICS Underfills for Semiconductor Product Portfolios and Specifications
13.1.3 NAMICS Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 NAMICS Main Business Overview
13.1.5 NAMICS Latest Developments
13.2 Henkel
13.2.1 Henkel Company Information
13.2.2 Henkel Underfills for Semiconductor Product Portfolios and Specifications
13.2.3 Henkel Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Henkel Main Business Overview
13.2.5 Henkel Latest Developments
13.3 RESONAC
13.3.1 RESONAC Company Information
13.3.2 RESONAC Underfills for Semiconductor Product Portfolios and Specifications
13.3.3 RESONAC Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 RESONAC Main Business Overview
13.3.5 RESONAC Latest Developments
13.4 Nagase ChemteX Corporation
13.4.1 Nagase ChemteX Corporation Company Information
13.4.2 Nagase ChemteX Corporation Underfills for Semiconductor Product Portfolios and Specifications
13.4.3 Nagase ChemteX Corporation Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Nagase ChemteX Corporation Main Business Overview
13.4.5 Nagase ChemteX Corporation Latest Developments
13.5 Shin-Etsu Chemical
13.5.1 Shin-Etsu Chemical Company Information
13.5.2 Shin-Etsu Chemical Underfills for Semiconductor Product Portfolios and Specifications
13.5.3 Shin-Etsu Chemical Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Shin-Etsu Chemical Main Business Overview
13.5.5 Shin-Etsu Chemical Latest Developments
13.6 Panasonic
13.6.1 Panasonic Company Information
13.6.2 Panasonic Underfills for Semiconductor Product Portfolios and Specifications
13.6.3 Panasonic Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Panasonic Main Business Overview
13.6.5 Panasonic Latest Developments
13.7 MacDermid Alpha
13.7.1 MacDermid Alpha Company Information
13.7.2 MacDermid Alpha Underfills for Semiconductor Product Portfolios and Specifications
13.7.3 MacDermid Alpha Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 MacDermid Alpha Main Business Overview
13.7.5 MacDermid Alpha Latest Developments
13.8 Sunstar
13.8.1 Sunstar Company Information
13.8.2 Sunstar Underfills for Semiconductor Product Portfolios and Specifications
13.8.3 Sunstar Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Sunstar Main Business Overview
13.8.5 Sunstar Latest Developments
13.9 Fuji Chemical
13.9.1 Fuji Chemical Company Information
13.9.2 Fuji Chemical Underfills for Semiconductor Product Portfolios and Specifications
13.9.3 Fuji Chemical Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Fuji Chemical Main Business Overview
13.9.5 Fuji Chemical Latest Developments
13.10 Zymet
13.10.1 Zymet Company Information
13.10.2 Zymet Underfills for Semiconductor Product Portfolios and Specifications
13.10.3 Zymet Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Zymet Main Business Overview
13.10.5 Zymet Latest Developments
13.11 Shenzhen Dover
13.11.1 Shenzhen Dover Company Information
13.11.2 Shenzhen Dover Underfills for Semiconductor Product Portfolios and Specifications
13.11.3 Shenzhen Dover Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 Shenzhen Dover Main Business Overview
13.11.5 Shenzhen Dover Latest Developments
13.12 Threebond
13.12.1 Threebond Company Information
13.12.2 Threebond Underfills for Semiconductor Product Portfolios and Specifications
13.12.3 Threebond Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 Threebond Main Business Overview
13.12.5 Threebond Latest Developments
13.13 AIM Solder
13.13.1 AIM Solder Company Information
13.13.2 AIM Solder Underfills for Semiconductor Product Portfolios and Specifications
13.13.3 AIM Solder Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.13.4 AIM Solder Main Business Overview
13.13.5 AIM Solder Latest Developments
13.14 Darbond
13.14.1 Darbond Company Information
13.14.2 Darbond Underfills for Semiconductor Product Portfolios and Specifications
13.14.3 Darbond Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.14.4 Darbond Main Business Overview
13.14.5 Darbond Latest Developments
13.15 Master Bond
13.15.1 Master Bond Company Information
13.15.2 Master Bond Underfills for Semiconductor Product Portfolios and Specifications
13.15.3 Master Bond Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.15.4 Master Bond Main Business Overview
13.15.5 Master Bond Latest Developments
13.16 Jiangsu HHCK Advanced Materials Co.,Ltd
13.16.1 Jiangsu HHCK Advanced Materials Co.,Ltd Company Information
13.16.2 Jiangsu HHCK Advanced Materials Co.,Ltd Underfills for Semiconductor Product Portfolios and Specifications
13.16.3 Jiangsu HHCK Advanced Materials Co.,Ltd Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.16.4 Jiangsu HHCK Advanced Materials Co.,Ltd Main Business Overview
13.16.5 Jiangsu HHCK Advanced Materials Co.,Ltd Latest Developments
13.17 Parker Hannifin
13.17.1 Parker Hannifin Company Information
13.17.2 Parker Hannifin Underfills for Semiconductor Product Portfolios and Specifications
13.17.3 Parker Hannifin Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.17.4 Parker Hannifin Main Business Overview
13.17.5 Parker Hannifin Latest Developments
13.18 Asec Co., Ltd.
13.18.1 Asec Co., Ltd. Company Information
13.18.2 Asec Co., Ltd. Underfills for Semiconductor Product Portfolios and Specifications
13.18.3 Asec Co., Ltd. Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.18.4 Asec Co., Ltd. Main Business Overview
13.18.5 Asec Co., Ltd. Latest Developments
13.19 Panacol-Elosol
13.19.1 Panacol-Elosol Company Information
13.19.2 Panacol-Elosol Underfills for Semiconductor Product Portfolios and Specifications
13.19.3 Panacol-Elosol Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.19.4 Panacol-Elosol Main Business Overview
13.19.5 Panacol-Elosol Latest Developments
13.20 United Adhesives
13.20.1 United Adhesives Company Information
13.20.2 United Adhesives Underfills for Semiconductor Product Portfolios and Specifications
13.20.3 United Adhesives Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.20.4 United Adhesives Main Business Overview
13.20.5 United Adhesives Latest Developments
13.21 Henan Siny Optic-com Co., Ltd
13.21.1 Henan Siny Optic-com Co., Ltd Company Information
13.21.2 Henan Siny Optic-com Co., Ltd Underfills for Semiconductor Product Portfolios and Specifications
13.21.3 Henan Siny Optic-com Co., Ltd Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.21.4 Henan Siny Optic-com Co., Ltd Main Business Overview
13.21.5 Henan Siny Optic-com Co., Ltd Latest Developments
13.22 Dongguan Hanstars
13.22.1 Dongguan Hanstars Company Information
13.22.2 Dongguan Hanstars Underfills for Semiconductor Product Portfolios and Specifications
13.22.3 Dongguan Hanstars Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.22.4 Dongguan Hanstars Main Business Overview
13.22.5 Dongguan Hanstars Latest Developments
13.23 GTA Material
13.23.1 GTA Material Company Information
13.23.2 GTA Material Underfills for Semiconductor Product Portfolios and Specifications
13.23.3 GTA Material Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.23.4 GTA Material Main Business Overview
13.23.5 GTA Material Latest Developments
13.24 H.B.Fuller
13.24.1 H.B.Fuller Company Information
13.24.2 H.B.Fuller Underfills for Semiconductor Product Portfolios and Specifications
13.24.3 H.B.Fuller Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.24.4 H.B.Fuller Main Business Overview
13.24.5 H.B.Fuller Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
