Wafer backgrinding, also known as Wafer thinning, is a听semiconductor device fabrication听step during which wafer thickness is reduced to allow for stacking and high density packaging of听integrated circuits听(IC).
The global Wafer Grinding and Dicing Service market size is projected to grow from US$ 574 million in 2024 to US$ 995 million in 2030; it is expected to grow at a CAGR of 9.6% from 2024 to 2030.
The 鈥淲afer Grinding and Dicing Service Industry Forecast鈥� looks at past sales and reviews total world Wafer Grinding and Dicing Service sales in 2023, providing a comprehensive analysis by region and market sector of projected Wafer Grinding and Dicing Service sales for 2024 through 2030. With Wafer Grinding and Dicing Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Grinding and Dicing Service industry.
This Insight Report provides a comprehensive analysis of the global Wafer Grinding and Dicing Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Grinding and Dicing Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Wafer Grinding and Dicing Service market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Grinding and Dicing Service and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Grinding and Dicing Service.
Global key players of Wafer Grinding and Dicing Service include Micross Components, QP Technologies, Integra Technologies, Suzhou Baikejing Electronic Technology, YoungTek Electronics Corp., etc. The top five players hold a share about 26%. Asia-Pacific is the largest market, and has a share about 73%, followed by North America and Europe with share 17% and 8%, separately. In terms of product type, 300mm Wafer is the largest segment, occupied for a share of 78%. In terms of application, Logic Chip is the largest field with a share about 36 percent.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Grinding and Dicing Service market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
300mm Wafer
200mm Wafer
Others
Segmentation by Application:
Memory Chip
Logic Chip
Optical Sensor
MEMS
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Suzhou Baikejing Electronic Technology
Yima Semiconductor
Universen Hitec ltd
YoungTek Electronics Corp.
Integrated Service Technology Inc (iST)
Chnchip Integrated Circuit Co.,Ltd
Guangdong Leadyo IC Testing
King Long Technology
Shanghai Fine Chip Semiconductor
Jiangsu Nepes Semiconductor
Innotronix
Qipu Electronic Technology (Nantong) Co., Ltd
Micross Components
QP Technologies
Integra Technologies
MPE, Inc. (Micro Precision Engineering)
SVM (Silicon Valley Microelectronics)
GDSI (Grinding & Dicing Services Inc.)
Syagrus Systems
APD (American Precision Dicing, Inc)
Optim Wafer Services
NICHIWA KOGYO CO.,LTD.
High Components Aomori, Inc
FuRex
Intech Technologies International
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Grinding and Dicing Service market?
What factors are driving Wafer Grinding and Dicing Service market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Grinding and Dicing Service market opportunities vary by end market size?
How does Wafer Grinding and Dicing Service break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Wafer Grinding and Dicing Service Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Wafer Grinding and Dicing Service by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Wafer Grinding and Dicing Service by Country/Region, 2019, 2023 & 2030
2.2 Wafer Grinding and Dicing Service Segment by Type
2.2.1 300mm Wafer
2.2.2 200mm Wafer
2.2.3 Others
2.3 Wafer Grinding and Dicing Service Sales by Type
2.3.1 Global Wafer Grinding and Dicing Service Sales Market Share by Type (2019-2024)
2.3.2 Global Wafer Grinding and Dicing Service Revenue and Market Share by Type (2019-2024)
2.3.3 Global Wafer Grinding and Dicing Service Sale Price by Type (2019-2024)
2.4 Wafer Grinding and Dicing Service Segment by Application
2.4.1 Memory Chip
2.4.2 Logic Chip
2.4.3 Optical Sensor
2.4.4 MEMS
2.4.5 Others
2.5 Wafer Grinding and Dicing Service Sales by Application
2.5.1 Global Wafer Grinding and Dicing Service Sale Market Share by Application (2019-2024)
2.5.2 Global Wafer Grinding and Dicing Service Revenue and Market Share by Application (2019-2024)
2.5.3 Global Wafer Grinding and Dicing Service Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Wafer Grinding and Dicing Service Breakdown Data by Company
3.1.1 Global Wafer Grinding and Dicing Service Annual Sales by Company (2019-2024)
3.1.2 Global Wafer Grinding and Dicing Service Sales Market Share by Company (2019-2024)
3.2 Global Wafer Grinding and Dicing Service Annual Revenue by Company (2019-2024)
3.2.1 Global Wafer Grinding and Dicing Service Revenue by Company (2019-2024)
3.2.2 Global Wafer Grinding and Dicing Service Revenue Market Share by Company (2019-2024)
3.3 Global Wafer Grinding and Dicing Service Sale Price by Company
3.4 Key Manufacturers Wafer Grinding and Dicing Service Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Wafer Grinding and Dicing Service Product Location Distribution
3.4.2 Players Wafer Grinding and Dicing Service Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Wafer Grinding and Dicing Service by Geographic Region
4.1 World Historic Wafer Grinding and Dicing Service Market Size by Geographic Region (2019-2024)
4.1.1 Global Wafer Grinding and Dicing Service Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Wafer Grinding and Dicing Service Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Wafer Grinding and Dicing Service Market Size by Country/Region (2019-2024)
4.2.1 Global Wafer Grinding and Dicing Service Annual Sales by Country/Region (2019-2024)
4.2.2 Global Wafer Grinding and Dicing Service Annual Revenue by Country/Region (2019-2024)
4.3 Americas Wafer Grinding and Dicing Service Sales Growth
4.4 APAC Wafer Grinding and Dicing Service Sales Growth
4.5 Europe Wafer Grinding and Dicing Service Sales Growth
4.6 Middle East & Africa Wafer Grinding and Dicing Service Sales Growth
5 Americas
5.1 Americas Wafer Grinding and Dicing Service Sales by Country
5.1.1 Americas Wafer Grinding and Dicing Service Sales by Country (2019-2024)
5.1.2 Americas Wafer Grinding and Dicing Service Revenue by Country (2019-2024)
5.2 Americas Wafer Grinding and Dicing Service Sales by Type (2019-2024)
5.3 Americas Wafer Grinding and Dicing Service Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Wafer Grinding and Dicing Service Sales by Region
6.1.1 APAC Wafer Grinding and Dicing Service Sales by Region (2019-2024)
6.1.2 APAC Wafer Grinding and Dicing Service Revenue by Region (2019-2024)
6.2 APAC Wafer Grinding and Dicing Service Sales by Type (2019-2024)
6.3 APAC Wafer Grinding and Dicing Service Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Wafer Grinding and Dicing Service by Country
7.1.1 Europe Wafer Grinding and Dicing Service Sales by Country (2019-2024)
7.1.2 Europe Wafer Grinding and Dicing Service Revenue by Country (2019-2024)
7.2 Europe Wafer Grinding and Dicing Service Sales by Type (2019-2024)
7.3 Europe Wafer Grinding and Dicing Service Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Wafer Grinding and Dicing Service by Country
8.1.1 Middle East & Africa Wafer Grinding and Dicing Service Sales by Country (2019-2024)
8.1.2 Middle East & Africa Wafer Grinding and Dicing Service Revenue by Country (2019-2024)
8.2 Middle East & Africa Wafer Grinding and Dicing Service Sales by Type (2019-2024)
8.3 Middle East & Africa Wafer Grinding and Dicing Service Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Wafer Grinding and Dicing Service
10.3 Manufacturing Process Analysis of Wafer Grinding and Dicing Service
10.4 Industry Chain Structure of Wafer Grinding and Dicing Service
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Wafer Grinding and Dicing Service Distributors
11.3 Wafer Grinding and Dicing Service Customer
12 World Forecast Review for Wafer Grinding and Dicing Service by Geographic Region
12.1 Global Wafer Grinding and Dicing Service Market Size Forecast by Region
12.1.1 Global Wafer Grinding and Dicing Service Forecast by Region (2025-2030)
12.1.2 Global Wafer Grinding and Dicing Service Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Wafer Grinding and Dicing Service Forecast by Type (2025-2030)
12.7 Global Wafer Grinding and Dicing Service Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Suzhou Baikejing Electronic Technology
13.1.1 Suzhou Baikejing Electronic Technology Company Information
13.1.2 Suzhou Baikejing Electronic Technology Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.1.3 Suzhou Baikejing Electronic Technology Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Suzhou Baikejing Electronic Technology Main Business Overview
13.1.5 Suzhou Baikejing Electronic Technology Latest Developments
13.2 Yima Semiconductor
13.2.1 Yima Semiconductor Company Information
13.2.2 Yima Semiconductor Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.2.3 Yima Semiconductor Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Yima Semiconductor Main Business Overview
13.2.5 Yima Semiconductor Latest Developments
13.3 Universen Hitec ltd
13.3.1 Universen Hitec ltd Company Information
13.3.2 Universen Hitec ltd Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.3.3 Universen Hitec ltd Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Universen Hitec ltd Main Business Overview
13.3.5 Universen Hitec ltd Latest Developments
13.4 YoungTek Electronics Corp.
13.4.1 YoungTek Electronics Corp. Company Information
13.4.2 YoungTek Electronics Corp. Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.4.3 YoungTek Electronics Corp. Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 YoungTek Electronics Corp. Main Business Overview
13.4.5 YoungTek Electronics Corp. Latest Developments
13.5 Integrated Service Technology Inc (iST)
13.5.1 Integrated Service Technology Inc (iST) Company Information
13.5.2 Integrated Service Technology Inc (iST) Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.5.3 Integrated Service Technology Inc (iST) Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Integrated Service Technology Inc (iST) Main Business Overview
13.5.5 Integrated Service Technology Inc (iST) Latest Developments
13.6 Chnchip Integrated Circuit Co.,Ltd
13.6.1 Chnchip Integrated Circuit Co.,Ltd Company Information
13.6.2 Chnchip Integrated Circuit Co.,Ltd Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.6.3 Chnchip Integrated Circuit Co.,Ltd Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Chnchip Integrated Circuit Co.,Ltd Main Business Overview
13.6.5 Chnchip Integrated Circuit Co.,Ltd Latest Developments
13.7 Guangdong Leadyo IC Testing
13.7.1 Guangdong Leadyo IC Testing Company Information
13.7.2 Guangdong Leadyo IC Testing Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.7.3 Guangdong Leadyo IC Testing Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Guangdong Leadyo IC Testing Main Business Overview
13.7.5 Guangdong Leadyo IC Testing Latest Developments
13.8 King Long Technology
13.8.1 King Long Technology Company Information
13.8.2 King Long Technology Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.8.3 King Long Technology Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 King Long Technology Main Business Overview
13.8.5 King Long Technology Latest Developments
13.9 Shanghai Fine Chip Semiconductor
13.9.1 Shanghai Fine Chip Semiconductor Company Information
13.9.2 Shanghai Fine Chip Semiconductor Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.9.3 Shanghai Fine Chip Semiconductor Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Shanghai Fine Chip Semiconductor Main Business Overview
13.9.5 Shanghai Fine Chip Semiconductor Latest Developments
13.10 Jiangsu Nepes Semiconductor
13.10.1 Jiangsu Nepes Semiconductor Company Information
13.10.2 Jiangsu Nepes Semiconductor Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.10.3 Jiangsu Nepes Semiconductor Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Jiangsu Nepes Semiconductor Main Business Overview
13.10.5 Jiangsu Nepes Semiconductor Latest Developments
13.11 Innotronix
13.11.1 Innotronix Company Information
13.11.2 Innotronix Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.11.3 Innotronix Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Innotronix Main Business Overview
13.11.5 Innotronix Latest Developments
13.12 Qipu Electronic Technology (Nantong) Co., Ltd
13.12.1 Qipu Electronic Technology (Nantong) Co., Ltd Company Information
13.12.2 Qipu Electronic Technology (Nantong) Co., Ltd Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.12.3 Qipu Electronic Technology (Nantong) Co., Ltd Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Qipu Electronic Technology (Nantong) Co., Ltd Main Business Overview
13.12.5 Qipu Electronic Technology (Nantong) Co., Ltd Latest Developments
13.13 Micross Components
13.13.1 Micross Components Company Information
13.13.2 Micross Components Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.13.3 Micross Components Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 Micross Components Main Business Overview
13.13.5 Micross Components Latest Developments
13.14 QP Technologies
13.14.1 QP Technologies Company Information
13.14.2 QP Technologies Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.14.3 QP Technologies Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 QP Technologies Main Business Overview
13.14.5 QP Technologies Latest Developments
13.15 Integra Technologies
13.15.1 Integra Technologies Company Information
13.15.2 Integra Technologies Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.15.3 Integra Technologies Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Integra Technologies Main Business Overview
13.15.5 Integra Technologies Latest Developments
13.16 MPE, Inc. (Micro Precision Engineering)
13.16.1 MPE, Inc. (Micro Precision Engineering) Company Information
13.16.2 MPE, Inc. (Micro Precision Engineering) Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.16.3 MPE, Inc. (Micro Precision Engineering) Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 MPE, Inc. (Micro Precision Engineering) Main Business Overview
13.16.5 MPE, Inc. (Micro Precision Engineering) Latest Developments
13.17 SVM (Silicon Valley Microelectronics)
13.17.1 SVM (Silicon Valley Microelectronics) Company Information
13.17.2 SVM (Silicon Valley Microelectronics) Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.17.3 SVM (Silicon Valley Microelectronics) Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.17.4 SVM (Silicon Valley Microelectronics) Main Business Overview
13.17.5 SVM (Silicon Valley Microelectronics) Latest Developments
13.18 GDSI (Grinding & Dicing Services Inc.)
13.18.1 GDSI (Grinding & Dicing Services Inc.) Company Information
13.18.2 GDSI (Grinding & Dicing Services Inc.) Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.18.3 GDSI (Grinding & Dicing Services Inc.) Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.18.4 GDSI (Grinding & Dicing Services Inc.) Main Business Overview
13.18.5 GDSI (Grinding & Dicing Services Inc.) Latest Developments
13.19 Syagrus Systems
13.19.1 Syagrus Systems Company Information
13.19.2 Syagrus Systems Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.19.3 Syagrus Systems Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.19.4 Syagrus Systems Main Business Overview
13.19.5 Syagrus Systems Latest Developments
13.20 APD (American Precision Dicing, Inc)
13.20.1 APD (American Precision Dicing, Inc) Company Information
13.20.2 APD (American Precision Dicing, Inc) Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.20.3 APD (American Precision Dicing, Inc) Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.20.4 APD (American Precision Dicing, Inc) Main Business Overview
13.20.5 APD (American Precision Dicing, Inc) Latest Developments
13.21 Optim Wafer Services
13.21.1 Optim Wafer Services Company Information
13.21.2 Optim Wafer Services Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.21.3 Optim Wafer Services Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.21.4 Optim Wafer Services Main Business Overview
13.21.5 Optim Wafer Services Latest Developments
13.22 NICHIWA KOGYO CO.,LTD.
13.22.1 NICHIWA KOGYO CO.,LTD. Company Information
13.22.2 NICHIWA KOGYO CO.,LTD. Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.22.3 NICHIWA KOGYO CO.,LTD. Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.22.4 NICHIWA KOGYO CO.,LTD. Main Business Overview
13.22.5 NICHIWA KOGYO CO.,LTD. Latest Developments
13.23 High Components Aomori, Inc
13.23.1 High Components Aomori, Inc Company Information
13.23.2 High Components Aomori, Inc Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.23.3 High Components Aomori, Inc Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.23.4 High Components Aomori, Inc Main Business Overview
13.23.5 High Components Aomori, Inc Latest Developments
13.24 FuRex
13.24.1 FuRex Company Information
13.24.2 FuRex Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.24.3 FuRex Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.24.4 FuRex Main Business Overview
13.24.5 FuRex Latest Developments
13.25 Intech Technologies International
13.25.1 Intech Technologies International Company Information
13.25.2 Intech Technologies International Wafer Grinding and Dicing Service Product Portfolios and Specifications
13.25.3 Intech Technologies International Wafer Grinding and Dicing Service Sales, Revenue, Price and Gross Margin (2019-2024)
13.25.4 Intech Technologies International Main Business Overview
13.25.5 Intech Technologies International Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
