Forecast of Global Wafer-level Packaging Equipment Market Growth 2024

Publication ID:

PB24190251

Publication Date:

April 9, 2019

Pages:

130

Publisher:

MRRPB2

Countries:

Global [1]

USD 3,660.00

Packaging Machinery [2]

Packaging [3]

Industry & Manufacturing [4]

Description:

Global Wafer-level Packaging Equipment market will register a 8.9% CAGR in terms of revenue, the market size will reach USD 3.09 Billion by 2024, from USD 2.01 Billion in 2019.

Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world's largest wafer-level packaging equipment producer.
Wafer-level packaging equipment is very expensive, usually it does not go through the distributor and provided by the manufacturer directly to the customer.

According to this study, over the next five years the Wafer-level Packaging Equipment market will register a 8.9% CAGR in terms of revenue, the global market size will reach US$ 3090 million by 2024, from US$ 2010 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Wafer-level Packaging Equipment business, shared in Chapter 3.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer-level Packaging Equipment market by product type, application, key manufacturers and key regions and countries.

This study considers the Wafer-level Packaging Equipment value and volume generated from the sales of the following segments:

Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Fan In
Fan Out
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Ultratech
Rudolph Technologies

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives
To study and analyze the global Wafer-level Packaging Equipment consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Wafer-level Packaging Equipment market by identifying its various subsegments.
Focuses on the key global Wafer-level Packaging Equipment manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Wafer-level Packaging Equipment with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Wafer-level Packaging Equipment submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hrs) post payment.

Table Of Contents:

Table of Contents

2019-2024 Global Wafer-level Packaging Equipment Consumption Market Report

1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered

2 Executive Summary
2.1 World Market Overview
2.1.1 Global Wafer-level Packaging Equipment Consumption 2014-2024
2.1.2 Wafer-level Packaging Equipment Consumption CAGR by Region
2.2 Wafer-level Packaging Equipment Segment by Type
2.2.1 Fan In
2.2.2 Fan Out
2.3 Wafer-level Packaging Equipment Consumption by Type
2.3.1 Global Wafer-level Packaging Equipment Consumption Market Share by Type (2014-2019)
2.3.2 Global Wafer-level Packaging Equipment Revenue and Market Share by Type (2014-2019)
2.3.3 Global Wafer-level Packaging Equipment Sale Price by Type (2014-2019)
2.4 Wafer-level Packaging Equipment Segment by Application
2.4.1 Integrated Circuit Fabrication Process
2.4.2 Semiconductor Industry
2.4.3 Microelectromechanical Systems (MEMS)
2.4.4 Other
2.5 Wafer-level Packaging Equipment Consumption by Application
2.5.1 Global Wafer-level Packaging Equipment Consumption Market Share by Application (2014-2019)
2.5.2 Global Wafer-level Packaging Equipment Value and Market Share by Application (2014-2019)
2.5.3 Global Wafer-level Packaging Equipment Sale Price by Application (2014-2019)

3 Global Wafer-level Packaging Equipment by Players
3.1 Global Wafer-level Packaging Equipment Sales Market Share by Players
3.1.1 Global Wafer-level Packaging Equipment Sales by Players (2017-2019)
3.1.2 Global Wafer-level Packaging Equipment Sales Market Share by Players (2017-2019)
3.2 Global Wafer-level Packaging Equipment Revenue Market Share by Players
3.2.1 Global Wafer-level Packaging Equipment Revenue by Players (2017-2019)
3.2.2 Global Wafer-level Packaging Equipment Revenue Market Share by Players (2017-2019)
3.3 Global Wafer-level Packaging Equipment Sale Price by Players
3.4 Global Wafer-level Packaging Equipment Manufacturing Base Distribution, Sales Area, Product Types by Players
3.4.1 Global Wafer-level Packaging Equipment Manufacturing Base Distribution and Sales Area by Players
3.4.2 Players Wafer-level Packaging Equipment Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2017-2019)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion

4 Wafer-level Packaging Equipment by Regions
4.1 Wafer-level Packaging Equipment by Regions
4.1.1 Global Wafer-level Packaging Equipment Consumption by Regions
4.1.2 Global Wafer-level Packaging Equipment Value by Regions
4.2 Americas Wafer-level Packaging Equipment Consumption Growth
4.3 APAC Wafer-level Packaging Equipment Consumption Growth
4.4 Europe Wafer-level Packaging Equipment Consumption Growth
4.5 Middle East & Africa Wafer-level Packaging Equipment Consumption Growth

5 Americas
5.1 Americas Wafer-level Packaging Equipment Consumption by Countries
5.1.1 Americas Wafer-level Packaging Equipment Consumption by Countries (2014-2019)
5.1.2 Americas Wafer-level Packaging Equipment Value by Countries (2014-2019)
5.2 Americas Wafer-level Packaging Equipment Consumption by Type
5.3 Americas Wafer-level Packaging Equipment Consumption by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Key Economic Indicators of Few Americas Countries

6 APAC
6.1 APAC Wafer-level Packaging Equipment Consumption by Countries
6.1.1 APAC Wafer-level Packaging Equipment Consumption by Countries (2014-2019)
6.1.2 APAC Wafer-level Packaging Equipment Value by Countries (2014-2019)
6.2 APAC Wafer-level Packaging Equipment Consumption by Type
6.3 APAC Wafer-level Packaging Equipment Consumption by Application
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 Key Economic Indicators of Few APAC Countries

7 Europe
7.1 Europe Wafer-level Packaging Equipment by Countries
7.1.1 Europe Wafer-level Packaging Equipment Consumption by Countries (2014-2019)
7.1.2 Europe Wafer-level Packaging Equipment Value by Countries (2014-2019)
7.2 Europe Wafer-level Packaging Equipment Consumption by Type
7.3 Europe Wafer-level Packaging Equipment Consumption by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
7.9 Spain
7.10 Key Economic Indicators of Few Europe Countries

8 Middle East & Africa
8.1 Middle East & Africa Wafer-level Packaging Equipment by Countries
8.1.1 Middle East & Africa Wafer-level Packaging Equipment Consumption by Countries (2014-2019)
8.1.2 Middle East & Africa Wafer-level Packaging Equipment Value by Countries (2014-2019)
8.2 Middle East & Africa Wafer-level Packaging Equipment Consumption by Type
8.3 Middle East & Africa Wafer-level Packaging Equipment Consumption by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries

9 Market Drivers, Challenges and Trends
9.1 Market Drivers and Impact
9.1.1 Growing Demand from Key Regions
9.1.2 Growing Demand from Key Applications and Potential Industries
9.2 Market Challenges and Impact
9.3 Market Trends

10 Marketing, Distributors and Customer
10.1 Sales Channel
10.1.1 Direct Channels
10.1.2 Indirect Channels
10.2 Wafer-level Packaging Equipment Distributors
10.3 Wafer-level Packaging Equipment Customer

11 Global Wafer-level Packaging Equipment Market Forecast
11.1 Global Wafer-level Packaging Equipment Consumption Forecast (2019-2024)
11.2 Global Wafer-level Packaging Equipment Forecast by Regions
11.2.1 Global Wafer-level Packaging Equipment Forecast by Regions (2019-2024)
11.2.2 Global Wafer-level Packaging Equipment Value Forecast by Regions (2019-2024)
11.2.3 Americas Consumption Forecast
11.2.4 APAC Consumption Forecast
11.2.5 Europe Consumption Forecast
11.2.6 Middle East & Africa Consumption Forecast
11.3 Americas Forecast by Countries
11.3.1 United States Market Forecast
11.3.2 Canada Market Forecast
11.3.3 Mexico Market Forecast
11.3.4 Brazil Market Forecast
11.4 APAC Forecast by Countries
11.4.1 China Market Forecast
11.4.2 Japan Market Forecast
11.4.3 Korea Market Forecast
11.4.4 Southeast Asia Market Forecast
11.4.5 India Market Forecast
11.4.6 Australia Market Forecast
11.5 Europe Forecast by Countries
11.5.1 Germany Market Forecast
11.5.2 France Market Forecast
11.5.3 UK Market Forecast
11.5.4 Italy Market Forecast
11.5.5 Russia Market Forecast
11.5.6 Spain Market Forecast
11.6 Middle East & Africa Forecast by Countries
11.6.1 Egypt Market Forecast
11.6.2 South Africa Market Forecast
11.6.3 Israel Market Forecast
11.6.4 Turkey Market Forecast
11.6.5 GCC Countries Market Forecast
11.7 Global Wafer-level Packaging Equipment Forecast by Type
11.8 Global Wafer-level Packaging Equipment Forecast by Application

12 Key Players Analysis
12.1 Applied Materials
12.1.1 Company Details
12.1.2 Wafer-level Packaging Equipment Product Offered
12.1.3 Applied Materials Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.1.4 Main Business Overview
12.1.5 Applied Materials News
12.2 Tokyo Electron
12.2.1 Company Details
12.2.2 Wafer-level Packaging Equipment Product Offered
12.2.3 Tokyo Electron Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.2.4 Main Business Overview
12.2.5 Tokyo Electron News
12.3 KLA-Tencor Corporation
12.3.1 Company Details
12.3.2 Wafer-level Packaging Equipment Product Offered
12.3.3 KLA-Tencor Corporation Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.3.4 Main Business Overview
12.3.5 KLA-Tencor Corporation News
12.4 EV Group
12.4.1 Company Details
12.4.2 Wafer-level Packaging Equipment Product Offered
12.4.3 EV Group Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.4.4 Main Business Overview
12.4.5 EV Group News
12.5 Tokyo Seimitsu
12.5.1 Company Details
12.5.2 Wafer-level Packaging Equipment Product Offered
12.5.3 Tokyo Seimitsu Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.5.4 Main Business Overview
12.5.5 Tokyo Seimitsu News
12.6 Disco
12.6.1 Company Details
12.6.2 Wafer-level Packaging Equipment Product Offered
12.6.3 Disco Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.6.4 Main Business Overview
12.6.5 Disco News
12.7 SEMES
12.7.1 Company Details
12.7.2 Wafer-level Packaging Equipment Product Offered
12.7.3 SEMES Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.7.4 Main Business Overview
12.7.5 SEMES News
12.8 Suss Microtec
12.8.1 Company Details
12.8.2 Wafer-level Packaging Equipment Product Offered
12.8.3 Suss Microtec Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.8.4 Main Business Overview
12.8.5 Suss Microtec News
12.9 Ultratech
12.9.1 Company Details
12.9.2 Wafer-level Packaging Equipment Product Offered
12.9.3 Ultratech Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.9.4 Main Business Overview
12.9.5 Ultratech News
12.10 Rudolph Technologies
12.10.1 Company Details
12.10.2 Wafer-level Packaging Equipment Product Offered
12.10.3 Rudolph Technologies Wafer-level Packaging Equipment Sales, Revenue, Price and Gross Margin (2017-2019)
12.10.4 Main Business Overview
12.10.5 Rudolph Technologies News

13 Research Findings and Conclusion

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