In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.
The global market for 2.5D and 3D IC Packaging was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
North American market for 2.5D and 3D IC Packaging was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for 2.5D and 3D IC Packaging was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Europe market for 2.5D and 3D IC Packaging was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global key companies of 2.5D and 3D IC Packaging include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC and SK Hynix, etc. In 2023, the global five largest players hold a share approximately % in terms of revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for 2.5D and 3D IC Packaging, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of 2.5D and 3D IC Packaging by region & country, by Type, and by Application.
The 2.5D and 3D IC Packaging market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D and 3D IC Packaging.
Market Segmentation
By Company
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology
Segment by Type:
2.5D
3D TSV
3D Wafer-level Chip-scale Packaging
Segment by Application
Consumer Electronics
Medical Devices
Communications and Telecom
Automotive
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of 2.5D and 3D IC Packaging manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of 2.5D and 3D IC Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of 2.5D and 3D IC Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 2.5D and 3D IC Packaging Product Introduction
1.2 Global 2.5D and 3D IC Packaging Market Size Forecast
1.3 2.5D and 3D IC Packaging Market Trends & Drivers
1.3.1 2.5D and 3D IC Packaging Industry Trends
1.3.2 2.5D and 3D IC Packaging Market Drivers & Opportunity
1.3.3 2.5D and 3D IC Packaging Market Challenges
1.3.4 2.5D and 3D IC Packaging Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global 2.5D and 3D IC Packaging Players Revenue Ranking (2023)
2.2 Global 2.5D and 3D IC Packaging Revenue by Company (2019-2024)
2.3 Key Companies 2.5D and 3D IC Packaging Manufacturing Base Distribution and Headquarters
2.4 Key Companies 2.5D and 3D IC Packaging Product Offered
2.5 Key Companies Time to Begin Mass Production of 2.5D and 3D IC Packaging
2.6 2.5D and 3D IC Packaging Market Competitive Analysis
2.6.1 2.5D and 3D IC Packaging Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by 2.5D and 3D IC Packaging Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 2.5D and 3D IC Packaging as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 2.5D
3.1.2 3D TSV
3.1.3 3D Wafer-level Chip-scale Packaging
3.2 Global 2.5D and 3D IC Packaging Sales Value by Type
3.2.1 Global 2.5D and 3D IC Packaging Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global 2.5D and 3D IC Packaging Sales Value, by Type (2019-2030)
3.2.3 Global 2.5D and 3D IC Packaging Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 Medical Devices
4.1.3 Communications and Telecom
4.1.4 Automotive
4.1.5 Other
4.2 Global 2.5D and 3D IC Packaging Sales Value by Application
4.2.1 Global 2.5D and 3D IC Packaging Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global 2.5D and 3D IC Packaging Sales Value, by Application (2019-2030)
4.2.3 Global 2.5D and 3D IC Packaging Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global 2.5D and 3D IC Packaging Sales Value by Region
5.1.1 Global 2.5D and 3D IC Packaging Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global 2.5D and 3D IC Packaging Sales Value by Region (2019-2024)
5.1.3 Global 2.5D and 3D IC Packaging Sales Value by Region (2025-2030)
5.1.4 Global 2.5D and 3D IC Packaging Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America 2.5D and 3D IC Packaging Sales Value, 2019-2030
5.2.2 North America 2.5D and 3D IC Packaging Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe 2.5D and 3D IC Packaging Sales Value, 2019-2030
5.3.2 Europe 2.5D and 3D IC Packaging Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific 2.5D and 3D IC Packaging Sales Value, 2019-2030
5.4.2 Asia Pacific 2.5D and 3D IC Packaging Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America 2.5D and 3D IC Packaging Sales Value, 2019-2030
5.5.2 South America 2.5D and 3D IC Packaging Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa 2.5D and 3D IC Packaging Sales Value, 2019-2030
5.6.2 Middle East & Africa 2.5D and 3D IC Packaging Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions 2.5D and 3D IC Packaging Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions 2.5D and 3D IC Packaging Sales Value
6.3 United States
6.3.1 United States 2.5D and 3D IC Packaging Sales Value, 2019-2030
6.3.2 United States 2.5D and 3D IC Packaging Sales Value by Type (%), 2023 VS 2030
6.3.3 United States 2.5D and 3D IC Packaging Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe 2.5D and 3D IC Packaging Sales Value, 2019-2030
6.4.2 Europe 2.5D and 3D IC Packaging Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe 2.5D and 3D IC Packaging Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China 2.5D and 3D IC Packaging Sales Value, 2019-2030
6.5.2 China 2.5D and 3D IC Packaging Sales Value by Type (%), 2023 VS 2030
6.5.3 China 2.5D and 3D IC Packaging Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan 2.5D and 3D IC Packaging Sales Value, 2019-2030
6.6.2 Japan 2.5D and 3D IC Packaging Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan 2.5D and 3D IC Packaging Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea 2.5D and 3D IC Packaging Sales Value, 2019-2030
6.7.2 South Korea 2.5D and 3D IC Packaging Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea 2.5D and 3D IC Packaging Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia 2.5D and 3D IC Packaging Sales Value, 2019-2030
6.8.2 Southeast Asia 2.5D and 3D IC Packaging Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia 2.5D and 3D IC Packaging Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India 2.5D and 3D IC Packaging Sales Value, 2019-2030
6.9.2 India 2.5D and 3D IC Packaging Sales Value by Type (%), 2023 VS 2030
6.9.3 India 2.5D and 3D IC Packaging Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE Technology
7.1.1 ASE Technology Profile
7.1.2 ASE Technology Main Business
7.1.3 ASE Technology 2.5D and 3D IC Packaging Products, Services and Solutions
7.1.4 ASE Technology 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.1.5 ASE Technology Recent Developments
7.2 Samsung Electronics
7.2.1 Samsung Electronics Profile
7.2.2 Samsung Electronics Main Business
7.2.3 Samsung Electronics 2.5D and 3D IC Packaging Products, Services and Solutions
7.2.4 Samsung Electronics 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.2.5 Samsung Electronics Recent Developments
7.3 Toshiba
7.3.1 Toshiba Profile
7.3.2 Toshiba Main Business
7.3.3 Toshiba 2.5D and 3D IC Packaging Products, Services and Solutions
7.3.4 Toshiba 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.3.5 STMicroelectronics Recent Developments
7.4 STMicroelectronics
7.4.1 STMicroelectronics Profile
7.4.2 STMicroelectronics Main Business
7.4.3 STMicroelectronics 2.5D and 3D IC Packaging Products, Services and Solutions
7.4.4 STMicroelectronics 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.4.5 STMicroelectronics Recent Developments
7.5 Xilinx
7.5.1 Xilinx Profile
7.5.2 Xilinx Main Business
7.5.3 Xilinx 2.5D and 3D IC Packaging Products, Services and Solutions
7.5.4 Xilinx 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.5.5 Xilinx Recent Developments
7.6 Intel
7.6.1 Intel Profile
7.6.2 Intel Main Business
7.6.3 Intel 2.5D and 3D IC Packaging Products, Services and Solutions
7.6.4 Intel 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.6.5 Intel Recent Developments
7.7 Micron Technology
7.7.1 Micron Technology Profile
7.7.2 Micron Technology Main Business
7.7.3 Micron Technology 2.5D and 3D IC Packaging Products, Services and Solutions
7.7.4 Micron Technology 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.7.5 Micron Technology Recent Developments
7.8 TSMC
7.8.1 TSMC Profile
7.8.2 TSMC Main Business
7.8.3 TSMC 2.5D and 3D IC Packaging Products, Services and Solutions
7.8.4 TSMC 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.8.5 TSMC Recent Developments
7.9 SK Hynix
7.9.1 SK Hynix Profile
7.9.2 SK Hynix Main Business
7.9.3 SK Hynix 2.5D and 3D IC Packaging Products, Services and Solutions
7.9.4 SK Hynix 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.9.5 SK Hynix Recent Developments
7.10 Amkor Technology
7.10.1 Amkor Technology Profile
7.10.2 Amkor Technology Main Business
7.10.3 Amkor Technology 2.5D and 3D IC Packaging Products, Services and Solutions
7.10.4 Amkor Technology 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.10.5 Amkor Technology Recent Developments
7.11 GlobalFoundries
7.11.1 GlobalFoundries Profile
7.11.2 GlobalFoundries Main Business
7.11.3 GlobalFoundries 2.5D and 3D IC Packaging Products, Services and Solutions
7.11.4 GlobalFoundries 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.11.5 GlobalFoundries Recent Developments
7.12 SanDisk (Western Digital)
7.12.1 SanDisk (Western Digital) Profile
7.12.2 SanDisk (Western Digital) Main Business
7.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Products, Services and Solutions
7.12.4 SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.12.5 SanDisk (Western Digital) Recent Developments
7.13 Synopsys
7.13.1 Synopsys Profile
7.13.2 Synopsys Main Business
7.13.3 Synopsys 2.5D and 3D IC Packaging Products, Services and Solutions
7.13.4 Synopsys 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.13.5 Synopsys Recent Developments
7.14 Invensas
7.14.1 Invensas Profile
7.14.2 Invensas Main Business
7.14.3 Invensas 2.5D and 3D IC Packaging Products, Services and Solutions
7.14.4 Invensas 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.14.5 Invensas Recent Developments
7.15 Siliconware Precision Industries
7.15.1 Siliconware Precision Industries Profile
7.15.2 Siliconware Precision Industries Main Business
7.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Products, Services and Solutions
7.15.4 Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.15.5 Siliconware Precision Industries Recent Developments
7.16 Jiangsu Changjiang Electronics
7.16.1 Jiangsu Changjiang Electronics Profile
7.16.2 Jiangsu Changjiang Electronics Main Business
7.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Products, Services and Solutions
7.16.4 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.16.5 Jiangsu Changjiang Electronics Recent Developments
7.17 Powertech Technology
7.17.1 Powertech Technology Profile
7.17.2 Powertech Technology Main Business
7.17.3 Powertech Technology 2.5D and 3D IC Packaging Products, Services and Solutions
7.17.4 Powertech Technology 2.5D and 3D IC Packaging Revenue (US$ Million) & (2019-2024)
7.17.5 Powertech Technology Recent Developments
8 Industry Chain Analysis
8.1 2.5D and 3D IC Packaging Industrial Chain
8.2 2.5D and 3D IC Packaging Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 2.5D and 3D IC Packaging Sales Model
8.5.2 Sales Channel
8.5.3 2.5D and 3D IC Packaging Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology
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*If Applicable.
