FOUP and FOSB are terms used in semiconductor manufacturing to refer to containers used for transporting and storing silicon wafers, particularly 300 mm wafers, which are the standard size used in modern semiconductor fabrication processes.
FOUP (Front Opening Unified Pod):
A FOUP is a specialized container designed to safely transport, store, and protect silicon wafers during various stages of the semiconductor manufacturing process. It has a front-opening mechanism that allows wafers to be loaded and unloaded robotically without exposing the wafers to the surrounding environment. FOUPs are used to maintain the cleanliness and integrity of wafers, protecting them from contamination, particles, and other factors that could negatively affect the quality of the manufactured chips.
FOUPs often have sophisticated features, such as interlocks, sensors, and RFID (Radio-Frequency Identification) tags, that help ensure the proper handling and tracking of wafers within the cleanroom environment. These containers are an integral part of automated material handling systems within semiconductor fabrication facilities.
FOSB (Front Opening Shipping Box):
Similar to FOUPs, FOSBs are also containers designed to transport and store silicon wafers. However, FOSBs are typically used for shipping wafers between different facilities or locations, such as from a wafer manufacturer to a semiconductor fabrication plant. They are designed to provide extra protection during transportation to prevent damage to wafers.
FOSBs often have additional packaging materials inside, such as foam or other cushioning materials, to absorb shock and vibrations during transit. They may also include mechanisms to secure the wafers within the container to prevent movement that could lead to breakage.
Both FOUPs and FOSBs are critical components of the semiconductor supply chain, ensuring that wafers are handled, transported, and stored in a controlled and protected environment to maintain their quality and usability.
The global market for 300 mm Wafer FOUP and FOSB was estimated to be worth US$ 709.5 million in 2023 and is forecast to a readjusted size of US$ 1136.5 million by 2030 with a CAGR of 7.2% during the forecast period 2024-2030
Taiwan (China) is the largest consumption region of Semiconductor FOUP and FOSB, with a consumption market share of 19.74% in 2022. The second place is United States; following Taiwan (China) with the consumption market share 19.30% in 2022. New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. At present, the market is occupied by American companies, Japan, Korea and Taiwan. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product鈥檚 types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
Report Scope
This report aims to provide a comprehensive presentation of the global market for 300 mm Wafer FOUP and FOSB, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of 300 mm Wafer FOUP and FOSB by region & country, by Type, and by Application.
The 300 mm Wafer FOUP and FOSB market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 300 mm Wafer FOUP and FOSB.
Market Segmentation
By Company
Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Gudeng Precision
3S Korea
Dainichi Shoji
Segment by Type:
FOUP
FOSB
Segment by Application
Wafer Foundry
IDM
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of 300 mm Wafer FOUP and FOSB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of 300 mm Wafer FOUP and FOSB in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of 300 mm Wafer FOUP and FOSB in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 300 mm Wafer FOUP and FOSB Product Introduction
1.2 Global 300 mm Wafer FOUP and FOSB Market Size Forecast
1.2.1 Global 300 mm Wafer FOUP and FOSB Sales Value (2019-2030)
1.2.2 Global 300 mm Wafer FOUP and FOSB Sales Volume (2019-2030)
1.2.3 Global 300 mm Wafer FOUP and FOSB Sales Price (2019-2030)
1.3 300 mm Wafer FOUP and FOSB Market Trends & Drivers
1.3.1 300 mm Wafer FOUP and FOSB Industry Trends
1.3.2 300 mm Wafer FOUP and FOSB Market Drivers & Opportunity
1.3.3 300 mm Wafer FOUP and FOSB Market Challenges
1.3.4 300 mm Wafer FOUP and FOSB Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global 300 mm Wafer FOUP and FOSB Players Revenue Ranking (2023)
2.2 Global 300 mm Wafer FOUP and FOSB Revenue by Company (2019-2024)
2.3 Global 300 mm Wafer FOUP and FOSB Players Sales Volume Ranking (2023)
2.4 Global 300 mm Wafer FOUP and FOSB Sales Volume by Company Players (2019-2024)
2.5 Global 300 mm Wafer FOUP and FOSB Average Price by Company (2019-2024)
2.6 Key Manufacturers 300 mm Wafer FOUP and FOSB Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers 300 mm Wafer FOUP and FOSB Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of 300 mm Wafer FOUP and FOSB
2.9 300 mm Wafer FOUP and FOSB Market Competitive Analysis
2.9.1 300 mm Wafer FOUP and FOSB Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by 300 mm Wafer FOUP and FOSB Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 300 mm Wafer FOUP and FOSB as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 FOUP
3.1.2 FOSB
3.2 Global 300 mm Wafer FOUP and FOSB Sales Value by Type
3.2.1 Global 300 mm Wafer FOUP and FOSB Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global 300 mm Wafer FOUP and FOSB Sales Value, by Type (2019-2030)
3.2.3 Global 300 mm Wafer FOUP and FOSB Sales Value, by Type (%) (2019-2030)
3.3 Global 300 mm Wafer FOUP and FOSB Sales Volume by Type
3.3.1 Global 300 mm Wafer FOUP and FOSB Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global 300 mm Wafer FOUP and FOSB Sales Volume, by Type (2019-2030)
3.3.3 Global 300 mm Wafer FOUP and FOSB Sales Volume, by Type (%) (2019-2030)
3.4 Global 300 mm Wafer FOUP and FOSB Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Wafer Foundry
4.1.2 IDM
4.2 Global 300 mm Wafer FOUP and FOSB Sales Value by Application
4.2.1 Global 300 mm Wafer FOUP and FOSB Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global 300 mm Wafer FOUP and FOSB Sales Value, by Application (2019-2030)
4.2.3 Global 300 mm Wafer FOUP and FOSB Sales Value, by Application (%) (2019-2030)
4.3 Global 300 mm Wafer FOUP and FOSB Sales Volume by Application
4.3.1 Global 300 mm Wafer FOUP and FOSB Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global 300 mm Wafer FOUP and FOSB Sales Volume, by Application (2019-2030)
4.3.3 Global 300 mm Wafer FOUP and FOSB Sales Volume, by Application (%) (2019-2030)
4.4 Global 300 mm Wafer FOUP and FOSB Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global 300 mm Wafer FOUP and FOSB Sales Value by Region
5.1.1 Global 300 mm Wafer FOUP and FOSB Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global 300 mm Wafer FOUP and FOSB Sales Value by Region (2019-2024)
5.1.3 Global 300 mm Wafer FOUP and FOSB Sales Value by Region (2025-2030)
5.1.4 Global 300 mm Wafer FOUP and FOSB Sales Value by Region (%), (2019-2030)
5.2 Global 300 mm Wafer FOUP and FOSB Sales Volume by Region
5.2.1 Global 300 mm Wafer FOUP and FOSB Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global 300 mm Wafer FOUP and FOSB Sales Volume by Region (2019-2024)
5.2.3 Global 300 mm Wafer FOUP and FOSB Sales Volume by Region (2025-2030)
5.2.4 Global 300 mm Wafer FOUP and FOSB Sales Volume by Region (%), (2019-2030)
5.3 Global 300 mm Wafer FOUP and FOSB Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
5.4.2 North America 300 mm Wafer FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
5.5.2 Europe 300 mm Wafer FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
5.6.2 Asia Pacific 300 mm Wafer FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
5.7.2 South America 300 mm Wafer FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
5.8.2 Middle East & Africa 300 mm Wafer FOUP and FOSB Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions 300 mm Wafer FOUP and FOSB Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions 300 mm Wafer FOUP and FOSB Sales Value
6.2.1 Key Countries/Regions 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.2.2 Key Countries/Regions 300 mm Wafer FOUP and FOSB Sales Volume, 2019-2030
6.3 United States
6.3.1 United States 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.3.2 United States 300 mm Wafer FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.3.3 United States 300 mm Wafer FOUP and FOSB Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.4.2 Europe 300 mm Wafer FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe 300 mm Wafer FOUP and FOSB Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.5.2 China 300 mm Wafer FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.5.3 China 300 mm Wafer FOUP and FOSB Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.6.2 Japan 300 mm Wafer FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan 300 mm Wafer FOUP and FOSB Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.7.2 South Korea 300 mm Wafer FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea 300 mm Wafer FOUP and FOSB Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.8.2 Southeast Asia 300 mm Wafer FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia 300 mm Wafer FOUP and FOSB Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India 300 mm Wafer FOUP and FOSB Sales Value, 2019-2030
6.9.2 India 300 mm Wafer FOUP and FOSB Sales Value by Type (%), 2023 VS 2030
6.9.3 India 300 mm Wafer FOUP and FOSB Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Entegris
7.1.1 Entegris Company Information
7.1.2 Entegris Introduction and Business Overview
7.1.3 Entegris 300 mm Wafer FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Entegris 300 mm Wafer FOUP and FOSB Product Offerings
7.1.5 Entegris Recent Development
7.2 Shin-Etsu Polymer
7.2.1 Shin-Etsu Polymer Company Information
7.2.2 Shin-Etsu Polymer Introduction and Business Overview
7.2.3 Shin-Etsu Polymer 300 mm Wafer FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Shin-Etsu Polymer 300 mm Wafer FOUP and FOSB Product Offerings
7.2.5 Shin-Etsu Polymer Recent Development
7.3 Miraial
7.3.1 Miraial Company Information
7.3.2 Miraial Introduction and Business Overview
7.3.3 Miraial 300 mm Wafer FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Miraial 300 mm Wafer FOUP and FOSB Product Offerings
7.3.5 Miraial Recent Development
7.4 Chuang King Enterprise
7.4.1 Chuang King Enterprise Company Information
7.4.2 Chuang King Enterprise Introduction and Business Overview
7.4.3 Chuang King Enterprise 300 mm Wafer FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Chuang King Enterprise 300 mm Wafer FOUP and FOSB Product Offerings
7.4.5 Chuang King Enterprise Recent Development
7.5 Gudeng Precision
7.5.1 Gudeng Precision Company Information
7.5.2 Gudeng Precision Introduction and Business Overview
7.5.3 Gudeng Precision 300 mm Wafer FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Gudeng Precision 300 mm Wafer FOUP and FOSB Product Offerings
7.5.5 Gudeng Precision Recent Development
7.6 3S Korea
7.6.1 3S Korea Company Information
7.6.2 3S Korea Introduction and Business Overview
7.6.3 3S Korea 300 mm Wafer FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.6.4 3S Korea 300 mm Wafer FOUP and FOSB Product Offerings
7.6.5 3S Korea Recent Development
7.7 Dainichi Shoji
7.7.1 Dainichi Shoji Company Information
7.7.2 Dainichi Shoji Introduction and Business Overview
7.7.3 Dainichi Shoji 300 mm Wafer FOUP and FOSB Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Dainichi Shoji 300 mm Wafer FOUP and FOSB Product Offerings
7.7.5 Dainichi Shoji Recent Development
8 Industry Chain Analysis
8.1 300 mm Wafer FOUP and FOSB Industrial Chain
8.2 300 mm Wafer FOUP and FOSB Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 300 mm Wafer FOUP and FOSB Sales Model
8.5.2 Sales Channel
8.5.3 300 mm Wafer FOUP and FOSB Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Gudeng Precision
3S Korea
Dainichi Shoji
听
听
*If Applicable.
