Advanced Packaging for Semiconductor - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB510240580

Publication Date:

October 31, 2024

Pages:

130

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.
The global market for Advanced Packaging for Semiconductor was estimated to be worth US$ 15670 million in 2023 and is forecast to a readjusted size of US$ 20380 million by 2030 with a CAGR of 3.7% during the forecast period 2024-2030
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Advanced Packaging for Semiconductor, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Advanced Packaging for Semiconductor by region & country, by Type, and by Application.
The Advanced Packaging for Semiconductor market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Advanced Packaging for Semiconductor.
Market Segmentation
By Company
Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos
Segment by Type:
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other End Users
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Advanced Packaging for Semiconductor manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Advanced Packaging for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Advanced Packaging for Semiconductor in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 Market Overview
1.1 Advanced Packaging for Semiconductor Product Introduction
1.2 Global Advanced Packaging for Semiconductor Market Size Forecast
1.3 Advanced Packaging for Semiconductor Market Trends & Drivers
1.3.1 Advanced Packaging for Semiconductor Industry Trends
1.3.2 Advanced Packaging for Semiconductor Market Drivers & Opportunity
1.3.3 Advanced Packaging for Semiconductor Market Challenges
1.3.4 Advanced Packaging for Semiconductor Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Advanced Packaging for Semiconductor Players Revenue Ranking (2023)
2.2 Global Advanced Packaging for Semiconductor Revenue by Company (2019-2024)
2.3 Key Companies Advanced Packaging for Semiconductor Manufacturing Base Distribution and Headquarters
2.4 Key Companies Advanced Packaging for Semiconductor Product Offered
2.5 Key Companies Time to Begin Mass Production of Advanced Packaging for Semiconductor
2.6 Advanced Packaging for Semiconductor Market Competitive Analysis
2.6.1 Advanced Packaging for Semiconductor Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Advanced Packaging for Semiconductor Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Advanced Packaging for Semiconductor as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Fan-Out Wafer-Level Packaging (FO WLP)
3.1.2 Fan-In Wafer-Level Packaging (FI WLP)
3.1.3 Flip Chip (FC)
3.1.4 2.5D/3D
3.2 Global Advanced Packaging for Semiconductor Sales Value by Type
3.2.1 Global Advanced Packaging for Semiconductor Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Advanced Packaging for Semiconductor Sales Value, by Type (2019-2030)
3.2.3 Global Advanced Packaging for Semiconductor Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Telecommunications
4.1.2 Automotive
4.1.3 Aerospace and Defense
4.1.4 Medical Devices
4.1.5 Consumer Electronics
4.1.6 Other End Users
4.2 Global Advanced Packaging for Semiconductor Sales Value by Application
4.2.1 Global Advanced Packaging for Semiconductor Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Advanced Packaging for Semiconductor Sales Value, by Application (2019-2030)
4.2.3 Global Advanced Packaging for Semiconductor Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Advanced Packaging for Semiconductor Sales Value by Region
5.1.1 Global Advanced Packaging for Semiconductor Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Advanced Packaging for Semiconductor Sales Value by Region (2019-2024)
5.1.3 Global Advanced Packaging for Semiconductor Sales Value by Region (2025-2030)
5.1.4 Global Advanced Packaging for Semiconductor Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Advanced Packaging for Semiconductor Sales Value, 2019-2030
5.2.2 North America Advanced Packaging for Semiconductor Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Advanced Packaging for Semiconductor Sales Value, 2019-2030
5.3.2 Europe Advanced Packaging for Semiconductor Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Advanced Packaging for Semiconductor Sales Value, 2019-2030
5.4.2 Asia Pacific Advanced Packaging for Semiconductor Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Advanced Packaging for Semiconductor Sales Value, 2019-2030
5.5.2 South America Advanced Packaging for Semiconductor Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Advanced Packaging for Semiconductor Sales Value, 2019-2030
5.6.2 Middle East & Africa Advanced Packaging for Semiconductor Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Advanced Packaging for Semiconductor Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Advanced Packaging for Semiconductor Sales Value
6.3 United States
6.3.1 United States Advanced Packaging for Semiconductor Sales Value, 2019-2030
6.3.2 United States Advanced Packaging for Semiconductor Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Advanced Packaging for Semiconductor Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Advanced Packaging for Semiconductor Sales Value, 2019-2030
6.4.2 Europe Advanced Packaging for Semiconductor Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Advanced Packaging for Semiconductor Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Advanced Packaging for Semiconductor Sales Value, 2019-2030
6.5.2 China Advanced Packaging for Semiconductor Sales Value by Type (%), 2023 VS 2030
6.5.3 China Advanced Packaging for Semiconductor Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Advanced Packaging for Semiconductor Sales Value, 2019-2030
6.6.2 Japan Advanced Packaging for Semiconductor Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Advanced Packaging for Semiconductor Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Advanced Packaging for Semiconductor Sales Value, 2019-2030
6.7.2 South Korea Advanced Packaging for Semiconductor Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Advanced Packaging for Semiconductor Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Advanced Packaging for Semiconductor Sales Value, 2019-2030
6.8.2 Southeast Asia Advanced Packaging for Semiconductor Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Advanced Packaging for Semiconductor Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Advanced Packaging for Semiconductor Sales Value, 2019-2030
6.9.2 India Advanced Packaging for Semiconductor Sales Value by Type (%), 2023 VS 2030
6.9.3 India Advanced Packaging for Semiconductor Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Amkor
7.1.1 Amkor Profile
7.1.2 Amkor Main Business
7.1.3 Amkor Advanced Packaging for Semiconductor Products, Services and Solutions
7.1.4 Amkor Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.1.5 Amkor Recent Developments
7.2 SPIL
7.2.1 SPIL Profile
7.2.2 SPIL Main Business
7.2.3 SPIL Advanced Packaging for Semiconductor Products, Services and Solutions
7.2.4 SPIL Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.2.5 SPIL Recent Developments
7.3 Intel Corp
7.3.1 Intel Corp Profile
7.3.2 Intel Corp Main Business
7.3.3 Intel Corp Advanced Packaging for Semiconductor Products, Services and Solutions
7.3.4 Intel Corp Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.3.5 JCET Recent Developments
7.4 JCET
7.4.1 JCET Profile
7.4.2 JCET Main Business
7.4.3 JCET Advanced Packaging for Semiconductor Products, Services and Solutions
7.4.4 JCET Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.4.5 JCET Recent Developments
7.5 ASE
7.5.1 ASE Profile
7.5.2 ASE Main Business
7.5.3 ASE Advanced Packaging for Semiconductor Products, Services and Solutions
7.5.4 ASE Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.5.5 ASE Recent Developments
7.6 TFME
7.6.1 TFME Profile
7.6.2 TFME Main Business
7.6.3 TFME Advanced Packaging for Semiconductor Products, Services and Solutions
7.6.4 TFME Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.6.5 TFME Recent Developments
7.7 TSMC
7.7.1 TSMC Profile
7.7.2 TSMC Main Business
7.7.3 TSMC Advanced Packaging for Semiconductor Products, Services and Solutions
7.7.4 TSMC Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.7.5 TSMC Recent Developments
7.8 Huatian
7.8.1 Huatian Profile
7.8.2 Huatian Main Business
7.8.3 Huatian Advanced Packaging for Semiconductor Products, Services and Solutions
7.8.4 Huatian Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.8.5 Huatian Recent Developments
7.9 Powertech Technology Inc
7.9.1 Powertech Technology Inc Profile
7.9.2 Powertech Technology Inc Main Business
7.9.3 Powertech Technology Inc Advanced Packaging for Semiconductor Products, Services and Solutions
7.9.4 Powertech Technology Inc Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.9.5 Powertech Technology Inc Recent Developments
7.10 UTAC
7.10.1 UTAC Profile
7.10.2 UTAC Main Business
7.10.3 UTAC Advanced Packaging for Semiconductor Products, Services and Solutions
7.10.4 UTAC Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.10.5 UTAC Recent Developments
7.11 Nepes
7.11.1 Nepes Profile
7.11.2 Nepes Main Business
7.11.3 Nepes Advanced Packaging for Semiconductor Products, Services and Solutions
7.11.4 Nepes Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.11.5 Nepes Recent Developments
7.12 Walton Advanced Engineering
7.12.1 Walton Advanced Engineering Profile
7.12.2 Walton Advanced Engineering Main Business
7.12.3 Walton Advanced Engineering Advanced Packaging for Semiconductor Products, Services and Solutions
7.12.4 Walton Advanced Engineering Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.12.5 Walton Advanced Engineering Recent Developments
7.13 Kyocera
7.13.1 Kyocera Profile
7.13.2 Kyocera Main Business
7.13.3 Kyocera Advanced Packaging for Semiconductor Products, Services and Solutions
7.13.4 Kyocera Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.13.5 Kyocera Recent Developments
7.14 Chipbond
7.14.1 Chipbond Profile
7.14.2 Chipbond Main Business
7.14.3 Chipbond Advanced Packaging for Semiconductor Products, Services and Solutions
7.14.4 Chipbond Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.14.5 Chipbond Recent Developments
7.15 Chipmos
7.15.1 Chipmos Profile
7.15.2 Chipmos Main Business
7.15.3 Chipmos Advanced Packaging for Semiconductor Products, Services and Solutions
7.15.4 Chipmos Advanced Packaging for Semiconductor Revenue (US$ Million) & (2019-2024)
7.15.5 Chipmos Recent Developments
8 Industry Chain Analysis
8.1 Advanced Packaging for Semiconductor Industrial Chain
8.2 Advanced Packaging for Semiconductor Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Advanced Packaging for Semiconductor Sales Model
8.5.2 Sales Channel
8.5.3 Advanced Packaging for Semiconductor Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos

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