The global market for Ball Grid Array (BGA) Packages was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Ball Grid Array (BGA) Packages, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Ball Grid Array (BGA) Packages by region & country, by Type, and by Application.
The Ball Grid Array (BGA) Packages market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ball Grid Array (BGA) Packages.
Market Segmentation
By Company
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd.
ASE Group
Advanced Semiconductor Engineering, Inc.
PARPRO
Intel
Corintech Ltd
Integrated Circuit Engineering Corporation
Segment by Type:
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA
Segment by Application
OEM
Aftermarket
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Ball Grid Array (BGA) Packages manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Ball Grid Array (BGA) Packages in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Ball Grid Array (BGA) Packages in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Ball Grid Array (BGA) Packages Product Introduction
1.2 Global Ball Grid Array (BGA) Packages Market Size Forecast
1.2.1 Global Ball Grid Array (BGA) Packages Sales Value (2019-2030)
1.2.2 Global Ball Grid Array (BGA) Packages Sales Volume (2019-2030)
1.2.3 Global Ball Grid Array (BGA) Packages Sales Price (2019-2030)
1.3 Ball Grid Array (BGA) Packages Market Trends & Drivers
1.3.1 Ball Grid Array (BGA) Packages Industry Trends
1.3.2 Ball Grid Array (BGA) Packages Market Drivers & Opportunity
1.3.3 Ball Grid Array (BGA) Packages Market Challenges
1.3.4 Ball Grid Array (BGA) Packages Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Ball Grid Array (BGA) Packages Players Revenue Ranking (2023)
2.2 Global Ball Grid Array (BGA) Packages Revenue by Company (2019-2024)
2.3 Global Ball Grid Array (BGA) Packages Players Sales Volume Ranking (2023)
2.4 Global Ball Grid Array (BGA) Packages Sales Volume by Company Players (2019-2024)
2.5 Global Ball Grid Array (BGA) Packages Average Price by Company (2019-2024)
2.6 Key Manufacturers Ball Grid Array (BGA) Packages Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Ball Grid Array (BGA) Packages Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Ball Grid Array (BGA) Packages
2.9 Ball Grid Array (BGA) Packages Market Competitive Analysis
2.9.1 Ball Grid Array (BGA) Packages Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Ball Grid Array (BGA) Packages Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Ball Grid Array (BGA) Packages as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Molded Array Process BGA
3.1.2 Thermally Enhanced BGA
3.1.3 Package on Package (PoP) BGA
3.1.4 Micro BGA
3.2 Global Ball Grid Array (BGA) Packages Sales Value by Type
3.2.1 Global Ball Grid Array (BGA) Packages Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Ball Grid Array (BGA) Packages Sales Value, by Type (2019-2030)
3.2.3 Global Ball Grid Array (BGA) Packages Sales Value, by Type (%) (2019-2030)
3.3 Global Ball Grid Array (BGA) Packages Sales Volume by Type
3.3.1 Global Ball Grid Array (BGA) Packages Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Ball Grid Array (BGA) Packages Sales Volume, by Type (2019-2030)
3.3.3 Global Ball Grid Array (BGA) Packages Sales Volume, by Type (%) (2019-2030)
3.4 Global Ball Grid Array (BGA) Packages Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 OEM
4.1.2 Aftermarket
4.2 Global Ball Grid Array (BGA) Packages Sales Value by Application
4.2.1 Global Ball Grid Array (BGA) Packages Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Ball Grid Array (BGA) Packages Sales Value, by Application (2019-2030)
4.2.3 Global Ball Grid Array (BGA) Packages Sales Value, by Application (%) (2019-2030)
4.3 Global Ball Grid Array (BGA) Packages Sales Volume by Application
4.3.1 Global Ball Grid Array (BGA) Packages Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Ball Grid Array (BGA) Packages Sales Volume, by Application (2019-2030)
4.3.3 Global Ball Grid Array (BGA) Packages Sales Volume, by Application (%) (2019-2030)
4.4 Global Ball Grid Array (BGA) Packages Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Ball Grid Array (BGA) Packages Sales Value by Region
5.1.1 Global Ball Grid Array (BGA) Packages Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Ball Grid Array (BGA) Packages Sales Value by Region (2019-2024)
5.1.3 Global Ball Grid Array (BGA) Packages Sales Value by Region (2025-2030)
5.1.4 Global Ball Grid Array (BGA) Packages Sales Value by Region (%), (2019-2030)
5.2 Global Ball Grid Array (BGA) Packages Sales Volume by Region
5.2.1 Global Ball Grid Array (BGA) Packages Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Ball Grid Array (BGA) Packages Sales Volume by Region (2019-2024)
5.2.3 Global Ball Grid Array (BGA) Packages Sales Volume by Region (2025-2030)
5.2.4 Global Ball Grid Array (BGA) Packages Sales Volume by Region (%), (2019-2030)
5.3 Global Ball Grid Array (BGA) Packages Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Ball Grid Array (BGA) Packages Sales Value, 2019-2030
5.4.2 North America Ball Grid Array (BGA) Packages Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Ball Grid Array (BGA) Packages Sales Value, 2019-2030
5.5.2 Europe Ball Grid Array (BGA) Packages Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Ball Grid Array (BGA) Packages Sales Value, 2019-2030
5.6.2 Asia Pacific Ball Grid Array (BGA) Packages Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Ball Grid Array (BGA) Packages Sales Value, 2019-2030
5.7.2 South America Ball Grid Array (BGA) Packages Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Ball Grid Array (BGA) Packages Sales Value, 2019-2030
5.8.2 Middle East & Africa Ball Grid Array (BGA) Packages Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Ball Grid Array (BGA) Packages Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Ball Grid Array (BGA) Packages Sales Value
6.2.1 Key Countries/Regions Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.2.2 Key Countries/Regions Ball Grid Array (BGA) Packages Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.3.2 United States Ball Grid Array (BGA) Packages Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Ball Grid Array (BGA) Packages Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.4.2 Europe Ball Grid Array (BGA) Packages Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Ball Grid Array (BGA) Packages Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.5.2 China Ball Grid Array (BGA) Packages Sales Value by Type (%), 2023 VS 2030
6.5.3 China Ball Grid Array (BGA) Packages Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.6.2 Japan Ball Grid Array (BGA) Packages Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Ball Grid Array (BGA) Packages Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.7.2 South Korea Ball Grid Array (BGA) Packages Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Ball Grid Array (BGA) Packages Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.8.2 Southeast Asia Ball Grid Array (BGA) Packages Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Ball Grid Array (BGA) Packages Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Ball Grid Array (BGA) Packages Sales Value, 2019-2030
6.9.2 India Ball Grid Array (BGA) Packages Sales Value by Type (%), 2023 VS 2030
6.9.3 India Ball Grid Array (BGA) Packages Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Amkor Technology
7.1.1 Amkor Technology Company Information
7.1.2 Amkor Technology Introduction and Business Overview
7.1.3 Amkor Technology Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Amkor Technology Ball Grid Array (BGA) Packages Product Offerings
7.1.5 Amkor Technology Recent Development
7.2 TriQuint Semiconductor Inc.
7.2.1 TriQuint Semiconductor Inc. Company Information
7.2.2 TriQuint Semiconductor Inc. Introduction and Business Overview
7.2.3 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.2.4 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Product Offerings
7.2.5 TriQuint Semiconductor Inc. Recent Development
7.3 Jiangsu Changjiang Electronics Technology Co.
7.3.1 Jiangsu Changjiang Electronics Technology Co. Company Information
7.3.2 Jiangsu Changjiang Electronics Technology Co. Introduction and Business Overview
7.3.3 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages Product Offerings
7.3.5 Jiangsu Changjiang Electronics Technology Co. Recent Development
7.4 STATS ChipPAC Ltd.
7.4.1 STATS ChipPAC Ltd. Company Information
7.4.2 STATS ChipPAC Ltd. Introduction and Business Overview
7.4.3 STATS ChipPAC Ltd. Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.4.4 STATS ChipPAC Ltd. Ball Grid Array (BGA) Packages Product Offerings
7.4.5 STATS ChipPAC Ltd. Recent Development
7.5 ASE Group
7.5.1 ASE Group Company Information
7.5.2 ASE Group Introduction and Business Overview
7.5.3 ASE Group Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.5.4 ASE Group Ball Grid Array (BGA) Packages Product Offerings
7.5.5 ASE Group Recent Development
7.6 Advanced Semiconductor Engineering, Inc.
7.6.1 Advanced Semiconductor Engineering, Inc. Company Information
7.6.2 Advanced Semiconductor Engineering, Inc. Introduction and Business Overview
7.6.3 Advanced Semiconductor Engineering, Inc. Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Advanced Semiconductor Engineering, Inc. Ball Grid Array (BGA) Packages Product Offerings
7.6.5 Advanced Semiconductor Engineering, Inc. Recent Development
7.7 PARPRO
7.7.1 PARPRO Company Information
7.7.2 PARPRO Introduction and Business Overview
7.7.3 PARPRO Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.7.4 PARPRO Ball Grid Array (BGA) Packages Product Offerings
7.7.5 PARPRO Recent Development
7.8 Intel
7.8.1 Intel Company Information
7.8.2 Intel Introduction and Business Overview
7.8.3 Intel Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Intel Ball Grid Array (BGA) Packages Product Offerings
7.8.5 Intel Recent Development
7.9 Corintech Ltd
7.9.1 Corintech Ltd Company Information
7.9.2 Corintech Ltd Introduction and Business Overview
7.9.3 Corintech Ltd Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Corintech Ltd Ball Grid Array (BGA) Packages Product Offerings
7.9.5 Corintech Ltd Recent Development
7.10 Integrated Circuit Engineering Corporation
7.10.1 Integrated Circuit Engineering Corporation Company Information
7.10.2 Integrated Circuit Engineering Corporation Introduction and Business Overview
7.10.3 Integrated Circuit Engineering Corporation Ball Grid Array (BGA) Packages Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Integrated Circuit Engineering Corporation Ball Grid Array (BGA) Packages Product Offerings
7.10.5 Integrated Circuit Engineering Corporation Recent Development
8 Industry Chain Analysis
8.1 Ball Grid Array (BGA) Packages Industrial Chain
8.2 Ball Grid Array (BGA) Packages Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Ball Grid Array (BGA) Packages Sales Model
8.5.2 Sales Channel
8.5.3 Ball Grid Array (BGA) Packages Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd.
ASE Group
Advanced Semiconductor Engineering, Inc.
PARPRO
Intel
Corintech Ltd
Integrated Circuit Engineering Corporation
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*If Applicable.
