On-board Ethernet can not only support higher rate transmission, but also have large bandwidth, low delay and low electromagnetic interference
Disturbance and other advantages, as well as the normalization of the link connection form, reduce the vehicle link type and cost, and can be widely used in entertainment, ADAS, Internet of Vehicles and other systems. Therefore, on-board Ethernet is expected to gradually replace the traditional bus technology and become the next generation of on-board network architecture.
Ethernet circuit interface is mainly composed of data link layer (MAC) and physical layer (PHY). At present, most of the automotive processors have included MAC control, while Ethernet physical layer chip (PHY) is used as an independent chip to provide Ethernet access channel, which plays the role of connecting the processor and communication media.
The global market for On-board Ethernet Physical Layer Chip was estimated to be worth US$ 671.4 million in 2023 and is forecast to a readjusted size of US$ 1321.9 million by 2030 with a CAGR of 10.0% during the forecast period 2024-2030
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for On-board Ethernet Physical Layer Chip, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of On-board Ethernet Physical Layer Chip by region & country, by Type, and by Application.
The On-board Ethernet Physical Layer Chip market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding On-board Ethernet Physical Layer Chip.
Market Segmentation
By Company
Marvell
Broadcom Inc
Realtek Semiconductor Corp
Texas Instruments
NXP Semiconductors
Motorcomm Electronic
JLSemi
Segment by Type:
<2.5 GE
2.5-5 GE
>5 GE
Segment by Application
Passenger Cars
Commercial Vehicles
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of On-board Ethernet Physical Layer Chip manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of On-board Ethernet Physical Layer Chip in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of On-board Ethernet Physical Layer Chip in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 On-board Ethernet Physical Layer Chip Product Introduction
1.2 Global On-board Ethernet Physical Layer Chip Market Size Forecast
1.2.1 Global On-board Ethernet Physical Layer Chip Sales Value (2019-2030)
1.2.2 Global On-board Ethernet Physical Layer Chip Sales Volume (2019-2030)
1.2.3 Global On-board Ethernet Physical Layer Chip Sales Price (2019-2030)
1.3 On-board Ethernet Physical Layer Chip Market Trends & Drivers
1.3.1 On-board Ethernet Physical Layer Chip Industry Trends
1.3.2 On-board Ethernet Physical Layer Chip Market Drivers & Opportunity
1.3.3 On-board Ethernet Physical Layer Chip Market Challenges
1.3.4 On-board Ethernet Physical Layer Chip Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global On-board Ethernet Physical Layer Chip Players Revenue Ranking (2023)
2.2 Global On-board Ethernet Physical Layer Chip Revenue by Company (2019-2024)
2.3 Global On-board Ethernet Physical Layer Chip Players Sales Volume Ranking (2023)
2.4 Global On-board Ethernet Physical Layer Chip Sales Volume by Company Players (2019-2024)
2.5 Global On-board Ethernet Physical Layer Chip Average Price by Company (2019-2024)
2.6 Key Manufacturers On-board Ethernet Physical Layer Chip Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers On-board Ethernet Physical Layer Chip Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of On-board Ethernet Physical Layer Chip
2.9 On-board Ethernet Physical Layer Chip Market Competitive Analysis
2.9.1 On-board Ethernet Physical Layer Chip Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by On-board Ethernet Physical Layer Chip Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in On-board Ethernet Physical Layer Chip as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 <2.5 GE
3.1.2 2.5-5 GE
3.1.3 >5 GE
3.2 Global On-board Ethernet Physical Layer Chip Sales Value by Type
3.2.1 Global On-board Ethernet Physical Layer Chip Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global On-board Ethernet Physical Layer Chip Sales Value, by Type (2019-2030)
3.2.3 Global On-board Ethernet Physical Layer Chip Sales Value, by Type (%) (2019-2030)
3.3 Global On-board Ethernet Physical Layer Chip Sales Volume by Type
3.3.1 Global On-board Ethernet Physical Layer Chip Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global On-board Ethernet Physical Layer Chip Sales Volume, by Type (2019-2030)
3.3.3 Global On-board Ethernet Physical Layer Chip Sales Volume, by Type (%) (2019-2030)
3.4 Global On-board Ethernet Physical Layer Chip Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Passenger Cars
4.1.2 Commercial Vehicles
4.2 Global On-board Ethernet Physical Layer Chip Sales Value by Application
4.2.1 Global On-board Ethernet Physical Layer Chip Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global On-board Ethernet Physical Layer Chip Sales Value, by Application (2019-2030)
4.2.3 Global On-board Ethernet Physical Layer Chip Sales Value, by Application (%) (2019-2030)
4.3 Global On-board Ethernet Physical Layer Chip Sales Volume by Application
4.3.1 Global On-board Ethernet Physical Layer Chip Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global On-board Ethernet Physical Layer Chip Sales Volume, by Application (2019-2030)
4.3.3 Global On-board Ethernet Physical Layer Chip Sales Volume, by Application (%) (2019-2030)
4.4 Global On-board Ethernet Physical Layer Chip Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global On-board Ethernet Physical Layer Chip Sales Value by Region
5.1.1 Global On-board Ethernet Physical Layer Chip Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global On-board Ethernet Physical Layer Chip Sales Value by Region (2019-2024)
5.1.3 Global On-board Ethernet Physical Layer Chip Sales Value by Region (2025-2030)
5.1.4 Global On-board Ethernet Physical Layer Chip Sales Value by Region (%), (2019-2030)
5.2 Global On-board Ethernet Physical Layer Chip Sales Volume by Region
5.2.1 Global On-board Ethernet Physical Layer Chip Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global On-board Ethernet Physical Layer Chip Sales Volume by Region (2019-2024)
5.2.3 Global On-board Ethernet Physical Layer Chip Sales Volume by Region (2025-2030)
5.2.4 Global On-board Ethernet Physical Layer Chip Sales Volume by Region (%), (2019-2030)
5.3 Global On-board Ethernet Physical Layer Chip Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
5.4.2 North America On-board Ethernet Physical Layer Chip Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
5.5.2 Europe On-board Ethernet Physical Layer Chip Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
5.6.2 Asia Pacific On-board Ethernet Physical Layer Chip Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
5.7.2 South America On-board Ethernet Physical Layer Chip Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
5.8.2 Middle East & Africa On-board Ethernet Physical Layer Chip Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions On-board Ethernet Physical Layer Chip Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions On-board Ethernet Physical Layer Chip Sales Value
6.2.1 Key Countries/Regions On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.2.2 Key Countries/Regions On-board Ethernet Physical Layer Chip Sales Volume, 2019-2030
6.3 United States
6.3.1 United States On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.3.2 United States On-board Ethernet Physical Layer Chip Sales Value by Type (%), 2023 VS 2030
6.3.3 United States On-board Ethernet Physical Layer Chip Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.4.2 Europe On-board Ethernet Physical Layer Chip Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe On-board Ethernet Physical Layer Chip Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.5.2 China On-board Ethernet Physical Layer Chip Sales Value by Type (%), 2023 VS 2030
6.5.3 China On-board Ethernet Physical Layer Chip Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.6.2 Japan On-board Ethernet Physical Layer Chip Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan On-board Ethernet Physical Layer Chip Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.7.2 South Korea On-board Ethernet Physical Layer Chip Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea On-board Ethernet Physical Layer Chip Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.8.2 Southeast Asia On-board Ethernet Physical Layer Chip Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia On-board Ethernet Physical Layer Chip Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India On-board Ethernet Physical Layer Chip Sales Value, 2019-2030
6.9.2 India On-board Ethernet Physical Layer Chip Sales Value by Type (%), 2023 VS 2030
6.9.3 India On-board Ethernet Physical Layer Chip Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Marvell
7.1.1 Marvell Company Information
7.1.2 Marvell Introduction and Business Overview
7.1.3 Marvell On-board Ethernet Physical Layer Chip Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Marvell On-board Ethernet Physical Layer Chip Product Offerings
7.1.5 Marvell Recent Development
7.2 Broadcom Inc
7.2.1 Broadcom Inc Company Information
7.2.2 Broadcom Inc Introduction and Business Overview
7.2.3 Broadcom Inc On-board Ethernet Physical Layer Chip Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Broadcom Inc On-board Ethernet Physical Layer Chip Product Offerings
7.2.5 Broadcom Inc Recent Development
7.3 Realtek Semiconductor Corp
7.3.1 Realtek Semiconductor Corp Company Information
7.3.2 Realtek Semiconductor Corp Introduction and Business Overview
7.3.3 Realtek Semiconductor Corp On-board Ethernet Physical Layer Chip Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Realtek Semiconductor Corp On-board Ethernet Physical Layer Chip Product Offerings
7.3.5 Realtek Semiconductor Corp Recent Development
7.4 Texas Instruments
7.4.1 Texas Instruments Company Information
7.4.2 Texas Instruments Introduction and Business Overview
7.4.3 Texas Instruments On-board Ethernet Physical Layer Chip Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Texas Instruments On-board Ethernet Physical Layer Chip Product Offerings
7.4.5 Texas Instruments Recent Development
7.5 NXP Semiconductors
7.5.1 NXP Semiconductors Company Information
7.5.2 NXP Semiconductors Introduction and Business Overview
7.5.3 NXP Semiconductors On-board Ethernet Physical Layer Chip Sales, Revenue and Gross Margin (2019-2024)
7.5.4 NXP Semiconductors On-board Ethernet Physical Layer Chip Product Offerings
7.5.5 NXP Semiconductors Recent Development
7.6 Motorcomm Electronic
7.6.1 Motorcomm Electronic Company Information
7.6.2 Motorcomm Electronic Introduction and Business Overview
7.6.3 Motorcomm Electronic On-board Ethernet Physical Layer Chip Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Motorcomm Electronic On-board Ethernet Physical Layer Chip Product Offerings
7.6.5 Motorcomm Electronic Recent Development
7.7 JLSemi
7.7.1 JLSemi Company Information
7.7.2 JLSemi Introduction and Business Overview
7.7.3 JLSemi On-board Ethernet Physical Layer Chip Sales, Revenue and Gross Margin (2019-2024)
7.7.4 JLSemi On-board Ethernet Physical Layer Chip Product Offerings
7.7.5 JLSemi Recent Development
8 Industry Chain Analysis
8.1 On-board Ethernet Physical Layer Chip Industrial Chain
8.2 On-board Ethernet Physical Layer Chip Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 On-board Ethernet Physical Layer Chip Sales Model
8.5.2 Sales Channel
8.5.3 On-board Ethernet Physical Layer Chip Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Marvell
Broadcom Inc
Realtek Semiconductor Corp
Texas Instruments
NXP Semiconductors
Motorcomm Electronic
JLSemi
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*If Applicable.
