A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The global market for Chip Scale Package (CSP) was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Chip Scale Package (CSP), focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Chip Scale Package (CSP) by region & country, by Type, and by Application.
The Chip Scale Package (CSP) market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Scale Package (CSP).
Market Segmentation
By Company
ASE Group
Amkor Technology
JCET
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Segment by Type:
Traditional Packaging
Advanced Packaging
Segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Chip Scale Package (CSP) manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Chip Scale Package (CSP) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Chip Scale Package (CSP) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Chip Scale Package (CSP) Product Introduction
1.2 Global Chip Scale Package (CSP) Market Size Forecast
1.3 Chip Scale Package (CSP) Market Trends & Drivers
1.3.1 Chip Scale Package (CSP) Industry Trends
1.3.2 Chip Scale Package (CSP) Market Drivers & Opportunity
1.3.3 Chip Scale Package (CSP) Market Challenges
1.3.4 Chip Scale Package (CSP) Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Chip Scale Package (CSP) Players Revenue Ranking (2023)
2.2 Global Chip Scale Package (CSP) Revenue by Company (2019-2024)
2.3 Key Companies Chip Scale Package (CSP) Manufacturing Base Distribution and Headquarters
2.4 Key Companies Chip Scale Package (CSP) Product Offered
2.5 Key Companies Time to Begin Mass Production of Chip Scale Package (CSP)
2.6 Chip Scale Package (CSP) Market Competitive Analysis
2.6.1 Chip Scale Package (CSP) Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Chip Scale Package (CSP) Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Chip Scale Package (CSP) as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Traditional Packaging
3.1.2 Advanced Packaging
3.2 Global Chip Scale Package (CSP) Sales Value by Type
3.2.1 Global Chip Scale Package (CSP) Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Chip Scale Package (CSP) Sales Value, by Type (2019-2030)
3.2.3 Global Chip Scale Package (CSP) Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Automotive and Traffic
4.1.2 Consumer Electronics
4.1.3 Communication
4.1.4 Other
4.2 Global Chip Scale Package (CSP) Sales Value by Application
4.2.1 Global Chip Scale Package (CSP) Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Chip Scale Package (CSP) Sales Value, by Application (2019-2030)
4.2.3 Global Chip Scale Package (CSP) Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Chip Scale Package (CSP) Sales Value by Region
5.1.1 Global Chip Scale Package (CSP) Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Chip Scale Package (CSP) Sales Value by Region (2019-2024)
5.1.3 Global Chip Scale Package (CSP) Sales Value by Region (2025-2030)
5.1.4 Global Chip Scale Package (CSP) Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Chip Scale Package (CSP) Sales Value, 2019-2030
5.2.2 North America Chip Scale Package (CSP) Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Chip Scale Package (CSP) Sales Value, 2019-2030
5.3.2 Europe Chip Scale Package (CSP) Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Chip Scale Package (CSP) Sales Value, 2019-2030
5.4.2 Asia Pacific Chip Scale Package (CSP) Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Chip Scale Package (CSP) Sales Value, 2019-2030
5.5.2 South America Chip Scale Package (CSP) Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Chip Scale Package (CSP) Sales Value, 2019-2030
5.6.2 Middle East & Africa Chip Scale Package (CSP) Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Chip Scale Package (CSP) Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Chip Scale Package (CSP) Sales Value
6.3 United States
6.3.1 United States Chip Scale Package (CSP) Sales Value, 2019-2030
6.3.2 United States Chip Scale Package (CSP) Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Chip Scale Package (CSP) Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Chip Scale Package (CSP) Sales Value, 2019-2030
6.4.2 Europe Chip Scale Package (CSP) Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Chip Scale Package (CSP) Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Chip Scale Package (CSP) Sales Value, 2019-2030
6.5.2 China Chip Scale Package (CSP) Sales Value by Type (%), 2023 VS 2030
6.5.3 China Chip Scale Package (CSP) Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Chip Scale Package (CSP) Sales Value, 2019-2030
6.6.2 Japan Chip Scale Package (CSP) Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Chip Scale Package (CSP) Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Chip Scale Package (CSP) Sales Value, 2019-2030
6.7.2 South Korea Chip Scale Package (CSP) Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Chip Scale Package (CSP) Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Chip Scale Package (CSP) Sales Value, 2019-2030
6.8.2 Southeast Asia Chip Scale Package (CSP) Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Chip Scale Package (CSP) Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Chip Scale Package (CSP) Sales Value, 2019-2030
6.9.2 India Chip Scale Package (CSP) Sales Value by Type (%), 2023 VS 2030
6.9.3 India Chip Scale Package (CSP) Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE Group
7.1.1 ASE Group Profile
7.1.2 ASE Group Main Business
7.1.3 ASE Group Chip Scale Package (CSP) Products, Services and Solutions
7.1.4 ASE Group Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.1.5 ASE Group Recent Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Profile
7.2.2 Amkor Technology Main Business
7.2.3 Amkor Technology Chip Scale Package (CSP) Products, Services and Solutions
7.2.4 Amkor Technology Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.2.5 Amkor Technology Recent Developments
7.3 JCET
7.3.1 JCET Profile
7.3.2 JCET Main Business
7.3.3 JCET Chip Scale Package (CSP) Products, Services and Solutions
7.3.4 JCET Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.3.5 Powertech Technology Recent Developments
7.4 Powertech Technology
7.4.1 Powertech Technology Profile
7.4.2 Powertech Technology Main Business
7.4.3 Powertech Technology Chip Scale Package (CSP) Products, Services and Solutions
7.4.4 Powertech Technology Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.4.5 Powertech Technology Recent Developments
7.5 TongFu Microelectronics
7.5.1 TongFu Microelectronics Profile
7.5.2 TongFu Microelectronics Main Business
7.5.3 TongFu Microelectronics Chip Scale Package (CSP) Products, Services and Solutions
7.5.4 TongFu Microelectronics Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.5.5 TongFu Microelectronics Recent Developments
7.6 Tianshui Huatian Technology
7.6.1 Tianshui Huatian Technology Profile
7.6.2 Tianshui Huatian Technology Main Business
7.6.3 Tianshui Huatian Technology Chip Scale Package (CSP) Products, Services and Solutions
7.6.4 Tianshui Huatian Technology Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.6.5 Tianshui Huatian Technology Recent Developments
7.7 UTAC
7.7.1 UTAC Profile
7.7.2 UTAC Main Business
7.7.3 UTAC Chip Scale Package (CSP) Products, Services and Solutions
7.7.4 UTAC Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.7.5 UTAC Recent Developments
7.8 Chipbond Technology
7.8.1 Chipbond Technology Profile
7.8.2 Chipbond Technology Main Business
7.8.3 Chipbond Technology Chip Scale Package (CSP) Products, Services and Solutions
7.8.4 Chipbond Technology Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.8.5 Chipbond Technology Recent Developments
7.9 Hana Micron
7.9.1 Hana Micron Profile
7.9.2 Hana Micron Main Business
7.9.3 Hana Micron Chip Scale Package (CSP) Products, Services and Solutions
7.9.4 Hana Micron Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.9.5 Hana Micron Recent Developments
7.10 OSE
7.10.1 OSE Profile
7.10.2 OSE Main Business
7.10.3 OSE Chip Scale Package (CSP) Products, Services and Solutions
7.10.4 OSE Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.10.5 OSE Recent Developments
7.11 Walton Advanced Engineering
7.11.1 Walton Advanced Engineering Profile
7.11.2 Walton Advanced Engineering Main Business
7.11.3 Walton Advanced Engineering Chip Scale Package (CSP) Products, Services and Solutions
7.11.4 Walton Advanced Engineering Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.11.5 Walton Advanced Engineering Recent Developments
7.12 NEPES
7.12.1 NEPES Profile
7.12.2 NEPES Main Business
7.12.3 NEPES Chip Scale Package (CSP) Products, Services and Solutions
7.12.4 NEPES Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.12.5 NEPES Recent Developments
7.13 Unisem
7.13.1 Unisem Profile
7.13.2 Unisem Main Business
7.13.3 Unisem Chip Scale Package (CSP) Products, Services and Solutions
7.13.4 Unisem Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.13.5 Unisem Recent Developments
7.14 ChipMOS
7.14.1 ChipMOS Profile
7.14.2 ChipMOS Main Business
7.14.3 ChipMOS Chip Scale Package (CSP) Products, Services and Solutions
7.14.4 ChipMOS Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.14.5 ChipMOS Recent Developments
7.15 Signetics
7.15.1 Signetics Profile
7.15.2 Signetics Main Business
7.15.3 Signetics Chip Scale Package (CSP) Products, Services and Solutions
7.15.4 Signetics Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.15.5 Signetics Recent Developments
7.16 Carsem
7.16.1 Carsem Profile
7.16.2 Carsem Main Business
7.16.3 Carsem Chip Scale Package (CSP) Products, Services and Solutions
7.16.4 Carsem Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.16.5 Carsem Recent Developments
7.17 King Yuan ELECTRONICS
7.17.1 King Yuan ELECTRONICS Profile
7.17.2 King Yuan ELECTRONICS Main Business
7.17.3 King Yuan ELECTRONICS Chip Scale Package (CSP) Products, Services and Solutions
7.17.4 King Yuan ELECTRONICS Chip Scale Package (CSP) Revenue (US$ Million) & (2019-2024)
7.17.5 King Yuan ELECTRONICS Recent Developments
8 Industry Chain Analysis
8.1 Chip Scale Package (CSP) Industrial Chain
8.2 Chip Scale Package (CSP) Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Chip Scale Package (CSP) Sales Model
8.5.2 Sales Channel
8.5.3 Chip Scale Package (CSP) Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
ASE Group
Amkor Technology
JCET
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
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*If Applicable.
