The semiconductor industry chain can be divided into three major links from top to bottom: design, manufacturing, and packaging and testing. Among them, packaging and testing is the last process in the manufacture of integrated circuit products. The process of packaging and testing wafers to obtain independent chips. Packaging and testing mainly includes two links of packaging and testing. Due to the relatively low added value of packaging and testing, high labor intensity, and relatively low entry barriers, the degree of localization of packaging and testing is relatively high. This report mainly studies the packaging and testing of display driver chips.
The global market for Display Driver Chip Packaging and Testing was estimated to be worth US$ 3176 million in 2023 and is forecast to a readjusted size of US$ 4928.3 million by 2030 with a CAGR of 6.8% during the forecast period 2024-2030
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Display Driver Chip Packaging and Testing, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Display Driver Chip Packaging and Testing by region & country, by Type, and by Application.
The Display Driver Chip Packaging and Testing market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Display Driver Chip Packaging and Testing.
Market Segmentation
By Company
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
Segment by Type:
Chip Packaging
Chip Testing
Segment by Application
Communication
Consumer Electronics
Vehicle Electronics
Aerospace
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Display Driver Chip Packaging and Testing manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Display Driver Chip Packaging and Testing in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Display Driver Chip Packaging and Testing in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Display Driver Chip Packaging and Testing Product Introduction
1.2 Global Display Driver Chip Packaging and Testing Market Size Forecast
1.3 Display Driver Chip Packaging and Testing Market Trends & Drivers
1.3.1 Display Driver Chip Packaging and Testing Industry Trends
1.3.2 Display Driver Chip Packaging and Testing Market Drivers & Opportunity
1.3.3 Display Driver Chip Packaging and Testing Market Challenges
1.3.4 Display Driver Chip Packaging and Testing Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Display Driver Chip Packaging and Testing Players Revenue Ranking (2023)
2.2 Global Display Driver Chip Packaging and Testing Revenue by Company (2019-2024)
2.3 Key Companies Display Driver Chip Packaging and Testing Manufacturing Base Distribution and Headquarters
2.4 Key Companies Display Driver Chip Packaging and Testing Product Offered
2.5 Key Companies Time to Begin Mass Production of Display Driver Chip Packaging and Testing
2.6 Display Driver Chip Packaging and Testing Market Competitive Analysis
2.6.1 Display Driver Chip Packaging and Testing Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Display Driver Chip Packaging and Testing Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Display Driver Chip Packaging and Testing as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Chip Packaging
3.1.2 Chip Testing
3.2 Global Display Driver Chip Packaging and Testing Sales Value by Type
3.2.1 Global Display Driver Chip Packaging and Testing Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Display Driver Chip Packaging and Testing Sales Value, by Type (2019-2030)
3.2.3 Global Display Driver Chip Packaging and Testing Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Communication
4.1.2 Consumer Electronics
4.1.3 Vehicle Electronics
4.1.4 Aerospace
4.1.5 Other
4.2 Global Display Driver Chip Packaging and Testing Sales Value by Application
4.2.1 Global Display Driver Chip Packaging and Testing Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Display Driver Chip Packaging and Testing Sales Value, by Application (2019-2030)
4.2.3 Global Display Driver Chip Packaging and Testing Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Display Driver Chip Packaging and Testing Sales Value by Region
5.1.1 Global Display Driver Chip Packaging and Testing Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Display Driver Chip Packaging and Testing Sales Value by Region (2019-2024)
5.1.3 Global Display Driver Chip Packaging and Testing Sales Value by Region (2025-2030)
5.1.4 Global Display Driver Chip Packaging and Testing Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Display Driver Chip Packaging and Testing Sales Value, 2019-2030
5.2.2 North America Display Driver Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Display Driver Chip Packaging and Testing Sales Value, 2019-2030
5.3.2 Europe Display Driver Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Display Driver Chip Packaging and Testing Sales Value, 2019-2030
5.4.2 Asia Pacific Display Driver Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Display Driver Chip Packaging and Testing Sales Value, 2019-2030
5.5.2 South America Display Driver Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Display Driver Chip Packaging and Testing Sales Value, 2019-2030
5.6.2 Middle East & Africa Display Driver Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Display Driver Chip Packaging and Testing Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Display Driver Chip Packaging and Testing Sales Value
6.3 United States
6.3.1 United States Display Driver Chip Packaging and Testing Sales Value, 2019-2030
6.3.2 United States Display Driver Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Display Driver Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Display Driver Chip Packaging and Testing Sales Value, 2019-2030
6.4.2 Europe Display Driver Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Display Driver Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Display Driver Chip Packaging and Testing Sales Value, 2019-2030
6.5.2 China Display Driver Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.5.3 China Display Driver Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Display Driver Chip Packaging and Testing Sales Value, 2019-2030
6.6.2 Japan Display Driver Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Display Driver Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Display Driver Chip Packaging and Testing Sales Value, 2019-2030
6.7.2 South Korea Display Driver Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Display Driver Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Display Driver Chip Packaging and Testing Sales Value, 2019-2030
6.8.2 Southeast Asia Display Driver Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Display Driver Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Display Driver Chip Packaging and Testing Sales Value, 2019-2030
6.9.2 India Display Driver Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.9.3 India Display Driver Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Steco(LG)
7.1.1 Steco(LG) Profile
7.1.2 Steco(LG) Main Business
7.1.3 Steco(LG) Display Driver Chip Packaging and Testing Products, Services and Solutions
7.1.4 Steco(LG) Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.1.5 Steco(LG) Recent Developments
7.2 LB-Lusem(Samsung)
7.2.1 LB-Lusem(Samsung) Profile
7.2.2 LB-Lusem(Samsung) Main Business
7.2.3 LB-Lusem(Samsung) Display Driver Chip Packaging and Testing Products, Services and Solutions
7.2.4 LB-Lusem(Samsung) Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.2.5 LB-Lusem(Samsung) Recent Developments
7.3 Chipbond Technology Corporation
7.3.1 Chipbond Technology Corporation Profile
7.3.2 Chipbond Technology Corporation Main Business
7.3.3 Chipbond Technology Corporation Display Driver Chip Packaging and Testing Products, Services and Solutions
7.3.4 Chipbond Technology Corporation Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.3.5 IMOS-ChipMOS TECHNOLOGIES INC. Recent Developments
7.4 IMOS-ChipMOS TECHNOLOGIES INC.
7.4.1 IMOS-ChipMOS TECHNOLOGIES INC. Profile
7.4.2 IMOS-ChipMOS TECHNOLOGIES INC. Main Business
7.4.3 IMOS-ChipMOS TECHNOLOGIES INC. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.4.4 IMOS-ChipMOS TECHNOLOGIES INC. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.4.5 IMOS-ChipMOS TECHNOLOGIES INC. Recent Developments
7.5 Hefei Chipmore Technology Co.,Ltd.
7.5.1 Hefei Chipmore Technology Co.,Ltd. Profile
7.5.2 Hefei Chipmore Technology Co.,Ltd. Main Business
7.5.3 Hefei Chipmore Technology Co.,Ltd. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.5.4 Hefei Chipmore Technology Co.,Ltd. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.5.5 Hefei Chipmore Technology Co.,Ltd. Recent Developments
7.6 Union Semiconductor (Hefei) Co., Ltd.
7.6.1 Union Semiconductor (Hefei) Co., Ltd. Profile
7.6.2 Union Semiconductor (Hefei) Co., Ltd. Main Business
7.6.3 Union Semiconductor (Hefei) Co., Ltd. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.6.4 Union Semiconductor (Hefei) Co., Ltd. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.6.5 Union Semiconductor (Hefei) Co., Ltd. Recent Developments
7.7 Jiangsu Napace Semiconductor Co., Ltd.
7.7.1 Jiangsu Napace Semiconductor Co., Ltd. Profile
7.7.2 Jiangsu Napace Semiconductor Co., Ltd. Main Business
7.7.3 Jiangsu Napace Semiconductor Co., Ltd. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.7.4 Jiangsu Napace Semiconductor Co., Ltd. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.7.5 Jiangsu Napace Semiconductor Co., Ltd. Recent Developments
7.8 Tongfu Microelectronics Co.,ltd.
7.8.1 Tongfu Microelectronics Co.,ltd. Profile
7.8.2 Tongfu Microelectronics Co.,ltd. Main Business
7.8.3 Tongfu Microelectronics Co.,ltd. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.8.4 Tongfu Microelectronics Co.,ltd. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.8.5 Tongfu Microelectronics Co.,ltd. Recent Developments
7.9 JCET Group Co.,Ltd.
7.9.1 JCET Group Co.,Ltd. Profile
7.9.2 JCET Group Co.,Ltd. Main Business
7.9.3 JCET Group Co.,Ltd. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.9.4 JCET Group Co.,Ltd. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.9.5 JCET Group Co.,Ltd. Recent Developments
7.10 ADVANCED SEMICONDUCTOR ENGINEERING, INC.
7.10.1 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Profile
7.10.2 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Main Business
7.10.3 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.10.4 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.10.5 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Recent Developments
7.11 Hitech Semiconductor (Wuxi) Co., Ltd.
7.11.1 Hitech Semiconductor (Wuxi) Co., Ltd. Profile
7.11.2 Hitech Semiconductor (Wuxi) Co., Ltd. Main Business
7.11.3 Hitech Semiconductor (Wuxi) Co., Ltd. Display Driver Chip Packaging and Testing Products, Services and Solutions
7.11.4 Hitech Semiconductor (Wuxi) Co., Ltd. Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.11.5 Hitech Semiconductor (Wuxi) Co., Ltd. Recent Developments
7.12 Hefei Chipmore Technology
7.12.1 Hefei Chipmore Technology Profile
7.12.2 Hefei Chipmore Technology Main Business
7.12.3 Hefei Chipmore Technology Display Driver Chip Packaging and Testing Products, Services and Solutions
7.12.4 Hefei Chipmore Technology Display Driver Chip Packaging and Testing Revenue (US$ Million) & (2019-2024)
7.12.5 Hefei Chipmore Technology Recent Developments
8 Industry Chain Analysis
8.1 Display Driver Chip Packaging and Testing Industrial Chain
8.2 Display Driver Chip Packaging and Testing Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Display Driver Chip Packaging and Testing Sales Model
8.5.2 Sales Channel
8.5.3 Display Driver Chip Packaging and Testing Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
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*If Applicable.
